公开(公告)号：US08741739B2

公开(公告)日：2014-06-03

申请号：US13342697

申请日：2012-01-03

Applicant: Alan B. Botula ,  Mark D. Jaffe ,  Alvin J. Joseph

Inventor： Alan B. Botula ,  Mark D. Jaffe ,  Alvin J. Joseph

IPC: H01L21/30

CPC classification number: H01L29/16 ,  H01L21/76254

Abstract: A semiconductor structure and a method of forming the same. In one embodiment, a method of forming a silicon-on-insulator (SOI) wafer substrate includes: providing a handle substrate; forming a high resistivity material layer over the handle substrate, the high resistivity material layer including one of an amorphous silicon carbide (SiC), a polycrystalline SiC, an amorphous diamond, or a polycrystalline diamond; forming an insulator layer over the high resistivity material layer; and bonding a donor wafer to a top surface of the insulator layer to form the SOI wafer substrate.

Abstract translation: 半导体结构及其形成方法。 在一个实施例中，形成绝缘体上硅（SOI）晶片衬底的方法包括：提供处理衬底; 在所述手柄衬底上形成高电阻率材料层，所述高电阻率材料层包括非晶碳化硅（SiC），多晶SiC，无定形金刚石或多晶金刚石中的一种; 在所述高电阻率材料层上形成绝缘体层; 并将施主晶片接合到绝缘体层的顶表面以形成SOI晶片衬底。

公开(公告)号：US08729664B2

公开(公告)日：2014-05-20

申请号：US13437273

申请日：2012-04-02

Applicant: Jeffrey P. Gambino ,  Mark D. Jaffe ,  Mark D. Levy ,  John C. Malinowski

Inventor： Jeffrey P. Gambino ,  Mark D. Jaffe ,  Mark D. Levy ,  John C. Malinowski

IPC: H01L29/15 ,  H01L23/52 ,  H01L29/47 ,  H01L27/095

CPC classification number: H01L29/0619 ,  H01L23/562 ,  H01L23/585 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated circuit chip comprising a guard ring formed on a semiconductor substrate that surrounds the active region of the integrated circuit chip and extends from the semiconductor substrate through one or more of a plurality of wiring levels. The guard ring comprises stacked metal lines with spaces breaking up each respective metal line. Each space may be formed such that it partially overlies the space in the metal line directly below but does not overlie any other space. Alternatively, each space may also be formed such that each space is at least completely overlying the space in the metal line below it.

Abstract translation: 一种集成电路芯片，包括形成在半导体衬底上的保护环，所述保护环围绕所述集成电路芯片的有源区并从所述半导体衬底延伸穿过多个布线层中的一个或多个。 保护环包括堆叠金属线，空间分开各个金属线。 每个空间可以被形成为使得其部分地覆盖金属线中的空间直接在下方，但不覆盖任何其它空间。 或者，每个空间也可以形成为使得每个空间至少完全覆盖在其下面的金属线中的空间。

公开(公告)号：US08723392B2

公开(公告)日：2014-05-13

申请号：US13183977

申请日：2011-07-15

Applicant: James W. Adkisson ,  Panglijen Candra ,  Thomas J. Dunbar ,  Jeffrey P. Gambino ,  Mark D. Jaffe ,  Anthony K. Stamper ,  Randy L. Wolf

Inventor： James W. Adkisson ,  Panglijen Candra ,  Thomas J. Dunbar ,  Jeffrey P. Gambino ,  Mark D. Jaffe ,  Anthony K. Stamper ,  Randy L. Wolf

IPC: H03H9/25

CPC classification number: H03H9/14538 ,  H03H3/08

Abstract: Disclosed herein is a surface acoustic wave (SAW) filter and method of making the same. The SAW filter includes a piezoelectric substrate; a planar barrier layer disposed above the piezoelectric substrate, and at least one conductor buried in the piezoelectric substrate and the planar barrier layer.

Abstract translation: 本文公开了一种表面声波（SAW）滤波器及其制造方法。 SAW滤波器包括压电基片; 设置在所述压电基板上方的平面阻挡层，以及埋设在所述压电基板和所述平面阻挡层中的至少一个导体。

公开(公告)号：US08536035B2

公开(公告)日：2013-09-17

申请号：US13363603

申请日：2012-02-01

Applicant: Alan B. Botula ,  Mark D. Jaffe ,  Alvin J. Joseph ,  Kenneth F. McAvey ,  Gerd Pfeiffer ,  Richard A. Phelps

Inventor： Alan B. Botula ,  Mark D. Jaffe ,  Alvin J. Joseph ,  Kenneth F. McAvey ,  Gerd Pfeiffer ,  Richard A. Phelps

IPC: H01L21/425

CPC classification number: H01L21/76254

Abstract: Silicon-on-insulator (SOI) structures and related methods of forming such structures. In one case, a method includes providing a silicon-on-insulator (SOI) handle substrate having: a substantially uniform resistivity profile along a depth of the handle substrate; and an interstitial oxygen (Oi) concentration of less than approximately 10 parts per million atoms (ppma). The method further includes counter-doping a surface region of the handle, causing the surface region to have a resistivity greater than approximately 3 kOhm-cm, and joining the surface region of the handle substrate with a donor wafer.

Abstract translation: 绝缘体上硅（SOI）结构和形成这种结构的相关方法。 在一种情况下，一种方法包括提供绝缘体上硅（SOI）手柄衬底，其具有：沿着手柄衬底的深度的基本均匀的电阻率分布; 和间隙氧（Oi）浓度小于约10ppm（ppma）。 所述方法还包括对所述手柄的表面区域进行反掺杂，使所述表面区域具有大于约3kOhm-cm的电阻率，并且将所述手柄衬底的表面区域与施主晶片接合。

公开(公告)号：US20130181293A1

公开(公告)日：2013-07-18

申请号：US13352851

申请日：2012-01-18

Applicant: Jeffrey P. Gambino ,  Russell T. Herrin ,  Mark D. Jaffe ,  Laura J. Schutz

Inventor： Jeffrey P. Gambino ,  Russell T. Herrin ,  Mark D. Jaffe ,  Laura J. Schutz

IPC: H01L27/088 ,  H01L21/28

CPC classification number: H01L21/823842 ,  H01L21/28052

Abstract: A method patterns a polysilicon gate over two immediately adjacent, opposite polarity transistor devices. The method patterns a mask over the polysilicon gate. The mask has an opening in a location where the opposite polarity transistor devices abut one another. The method then removes some (a portion) of the polysilicon gate through the opening to form at least a partial recess (or potentially a complete opening) in the polysilicon gate. The recess separates the polysilicon gate into a first polysilicon gate and a second polysilicon gate. After forming the recess, the method dopes the first polysilicon gate using a first polarity dopant and dopes the second polysilicon gate using a second polarity dopant having an opposite polarity of the first polarity dopant.

Abstract translation: 一种在两个紧邻的相反极性的晶体管器件上形成多晶硅栅极的方法。 该方法在多晶硅栅极上形成掩模。 掩模在相反极性晶体管器件彼此邻接的位置处具有开口。 然后，该方法通过开口去除多晶硅栅极的一些（一部分），以在多晶硅栅极中形成至少一个部分凹槽（或潜在的完整开口）。 凹槽将多晶硅栅极分离成第一多晶硅栅极和第二多晶硅栅极。 在形成凹槽之后，该方法使用第一极性掺杂剂掺杂第一多晶硅栅极，并使用具有与第一极性掺杂剂相反极性的第二极性掺杂剂掺杂第二多晶硅栅极。

公开(公告)号：US20130026646A1

公开(公告)日：2013-01-31

申请号：US13193991

申请日：2011-07-29

Applicant: James W. Adkisson ,  Jeffrey P. Gambino ,  Mark D. Jaffe ,  Alvin J. Joseph

Inventor： James W. Adkisson ,  Jeffrey P. Gambino ,  Mark D. Jaffe ,  Alvin J. Joseph

IPC: H01L21/28 ,  G06F17/50 ,  H01L23/48 ,  H01L21/22 ,  H01L21/265

CPC classification number: H01L21/76898 ,  H01L21/26586 ,  H01L29/732

Abstract: A method for forming passivated through wafer vias, passivated through wafer via structures, and passivated through wafer via design structures. The method includes: forming a through wafer via in a semiconductor substrate, the through wafer via comprising an electrical conductor extending from a top of the semiconductor substrate to a bottom surface of the semiconductor substrate; and forming a doped layer abutting all sidewalls of the electrical conductor, the doped layer of a same dopant type as the semiconductor substrate, the concentration of dopant in the doped layer greater than the concentration of dopant in the semiconductor substrate, the doped layer intervening between the electrical conductor and the semiconductor substrate.

Abstract translation: 用于形成钝化的晶片通孔的方法，通过晶片通孔结构钝化，并通过设计结构钝化通过晶片。 该方法包括：在半导体衬底中形成贯穿晶片通孔，所述贯通晶片通孔包括从半导体衬底的顶部延伸到半导体衬底的底表面的电导体; 并且形成邻接电导体的所有侧壁的掺杂层，与半导体衬底相同的掺杂剂类型的掺杂层，掺杂层中掺杂剂的浓度大于半导体衬底中掺杂剂的浓度，掺杂层介于 电导体和半导体衬底。

公开(公告)号：US08168474B1

公开(公告)日：2012-05-01

申请号：US12987402

申请日：2011-01-10

Applicant: James W. Adkisson ,  Panglijen Candra ,  Thomas J. Dunbar ,  Jeffrey P. Gambino ,  Mark D. Jaffe ,  Robert K. Leidy ,  Yen L. Lim

Inventor： James W. Adkisson ,  Panglijen Candra ,  Thomas J. Dunbar ,  Jeffrey P. Gambino ,  Mark D. Jaffe ,  Robert K. Leidy ,  Yen L. Lim

IPC: H01L21/00

CPC classification number: H01L21/78 ,  H01L21/76898

Abstract: Systems and methods simultaneously form first openings and second openings in a substrate. The first openings are formed smaller than the second openings. The method also simultaneously forms a first material in the first openings and the second openings. The first material fills the first openings, and the first material lines the second openings. The method forms a second material different than the first material in the second openings. The second material fills the second openings. The method forms a plurality of integrated circuit structures over the first material and the second material within the second openings. The method applies mechanical stress to the substrate to cause the substrate to split along the first openings.

Abstract translation: 系统和方法同时在衬底中形成第一开口和第二开口。 第一开口形成为小于第二开口。 该方法还同时在第一开口和第二开口中形成第一材料。 第一材料填充第一开口，第一材料将第二开口排列。 该方法形成与第二开口中的第一材料不同的第二材料。 第二材料填充第二开口。 该方法在第二开口内的第一材料和第二材料上形成多个集成电路结构。 该方法对基板施加机械应力以使基板沿着第一开口分开。

公开(公告)号：US20110279399A1

公开(公告)日：2011-11-17

申请号：US12779994

申请日：2010-05-14

Applicant: Brent A. Anderson ,  Mark D. Jaffe ,  Jed H. Rankin

Inventor： Brent A. Anderson ,  Mark D. Jaffe ,  Jed H. Rankin

IPC: G06F3/045 ,  G06F3/041 ,  G06F3/042 ,  G09G5/00

CPC classification number: G06F3/042 ,  G06F3/041 ,  G06F3/0421 ,  G06F3/044 ,  G06F2203/04109

Abstract: Disclosed herein are embodiments of an interface device (e.g., a display, touchpad, touchscreen display, etc.) with integrated power collection functions. In one embodiment, a solar cell or solar cell array can be located within a substrate at a first surface and an array of interface elements can also be located within the substrate at the first surface such that portions of the solar cell(s) laterally surround the individual interface elements or groups thereof. In another embodiment, a solar cell or solar cell array can be located within the substrate at a first surface and an array of interface elements can be located within the substrate at a second surface opposite the first surface (i.e., opposite the solar cell or solar cell array). In yet another embodiment, an array of diodes, which can function as either solar cells or sensing elements, can be within a substrate at a first surface and can be wired to allow for selective operation in either a power collection mode or sensing mode.

Abstract translation: 这里公开了具有集成的功率收集功能的接口设备（例如，显示器，触摸板，触摸屏显示器等）的实施例。 在一个实施例中，太阳能电池或太阳能电池阵列可以位于第一表面的衬底内，并且界面元件阵列也可以位于第一表面的衬底内，使得太阳能电池的一部分横向包围 各个接口元件或其组合。 在另一个实施例中，太阳能电池或太阳能电池阵列可以位于第一表面的衬底内，并且界面元件的阵列可以位于衬底内的与第一表面相对的第二表面（即，与太阳能电池或太阳能 单元格阵列）。 在另一个实施例中，可以用作太阳能电池或感测元件的二极管阵列可以在第一表面的衬底内，并且可以被布线以允许在电力收集模式或感测模式中的选择性操作。

公开(公告)号：US07622364B2

公开(公告)日：2009-11-24

申请号：US11465622

申请日：2006-08-18

Applicant: James W. Adkisson ,  Jeffrey P. Gambino ,  Mark D. Jaffe ,  Richard J. Rassel

Inventor： James W. Adkisson ,  Jeffrey P. Gambino ,  Mark D. Jaffe ,  Richard J. Rassel

IPC: H01L21/00

CPC classification number: H01L24/05 ,  H01L23/3114 ,  H01L23/485 ,  H01L23/562 ,  H01L23/585 ,  H01L24/03 ,  H01L2224/05553 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic packaging having at least one bond pad positioned on a chip for effectuating through-wafer connections to an integrated circuit. The electronic package is equipped with an edge seal between the bond pad region and an active circuit region, and includes a crack stop, which is adapted to protect the arrangement from the entry of deleterious moisture and combination into the active regions of the chip containing the bond pads.

Abstract translation: 一种电子封装，其具有位于芯片上的至少一个接合焊盘，用于实现与集成电路的晶圆连接。 电子封装在接合焊盘区域和有源电路区域之间配备有边缘密封，并且包括裂缝停止件，其适于保护布置免受有害水分和组合进入含有 接合垫

公开(公告)号：US07517806B2

公开(公告)日：2009-04-14

申请号：US11186748

申请日：2005-07-21

Applicant: Andres Bryant ,  William F. Clark, Jr. ,  David M. Fried ,  Mark D. Jaffe ,  Edward J. Nowak ,  John J. Pekarik ,  Christopher S. Putnam

Inventor： Andres Bryant ,  William F. Clark, Jr. ,  David M. Fried ,  Mark D. Jaffe ,  Edward J. Nowak ,  John J. Pekarik ,  Christopher S. Putnam

IPC: H01L21/302

CPC classification number: H01L21/84 ,  H01L21/3086 ,  H01L21/3088 ,  H01L21/823821 ,  H01L27/1203 ,  H01L29/66795 ,  H01L29/785 ,  Y10S438/947

Abstract: A method and structure for an integrated circuit structure that utilizes complementary fin-type field effect transistors (FinFETs) is disclosed. The invention has a first-type of FinFET which includes a first fin, and a second-type of FinFET which includes a second fin running parallel to the first fin. The invention also has an insulator fin positioned between the source/drain regions of the first first-type of FinFET and the second-type of FinFET. The insulator fin has approximately the same width dimensions as the first fin and the second fin, such that the spacing between the first-type of FinFET and the second-type of FinFET is approximately equal to the width of one fin. The invention also has a common gate formed over channel regions of the first-type of FinFET and the second-type of FinFET. The gate includes a first impurity doping region adjacent the first-type of FinFET and a second impurity doping region adjacent the second-type of FinFET. The differences between the first impurity doping region and the second impurity doping region provide the gate with different work functions related to differences between the first-type of FinFET and the second-type of FinFET. The first fin and the second fin have approximately the same width.

Abstract translation: 公开了利用互补翅片型场效应晶体管（FinFET）的集成电路结构的方法和结构。 本发明具有包括第一鳍片的第一类型的FinFET和包括与第一鳍片平行的第二鳍片的第二类型的FinFET。 本发明还具有位于第一第一类型FinFET的源极/漏极区域和第二类型FinFET之间的绝缘体鳍片。 绝缘体鳍片具有与第一鳍片和第二鳍片大致相同的宽度尺寸，使得第一类型的FinFET和第二类型的FinFET之间的间隔大致等于一个鳍片的宽度。 本发明还具有形成在第一类型FinFET和第二类型FinFET的沟道区上的公共栅极。 栅极包括与第一类型的FinFET相邻的第一杂质掺杂区域和与第二类型的FinFET相邻的第二杂质掺杂区域。 第一杂质掺杂区域和第二杂质掺杂区域之间的差异为栅极提供与第一类型FinFET和第二类型FinFET之间的差异有关的不同功函数。 第一鳍片和第二鳍片具有大致相同的宽度。