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71.
公开(公告)号:US20190019553A1
公开(公告)日:2019-01-17
申请号:US16005493
申请日:2018-06-11
Applicant: Micron Technology, Inc.
Inventor: Scott J. Derner , Michael A. Shore
IPC: G11C14/00 , G11C11/22 , G11C11/4091 , H01L27/11507 , H01L27/108 , H01L49/02 , G11C11/4096 , G11C11/4097
Abstract: Apparatuses and methods for memory including ferroelectric memory cells and dielectric memory cells are disclosed. The apparatus includes a first memory cell including first and second ferroelectric capacitors configured to store charges representing complementary logical values, a second memory cell including first and second dielectric capacitors configured to store charges representing complementary logical values, a first bit line selectably coupled to the first ferroelectric capacitor of the first memory cell and to the first dielectric capacitor of the second memory cell, a second bit line selectably coupled to the second ferroelectric capacitor of the first memory cell and to the second dielectric capacitor of the second memory cell, and a sense amplifier coupled to the first and second bit lines.
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72.
公开(公告)号:US20190013057A1
公开(公告)日:2019-01-10
申请号:US16131969
申请日:2018-09-14
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Christopher J. Kawamura , Scott J. Derner
IPC: G11C11/22 , H01L27/11509 , H01L27/11507 , H01L27/11504 , G11C11/4091 , G11C11/56
CPC classification number: G11C11/2275 , G11C11/2259 , G11C11/2273 , G11C11/2293 , G11C11/2297 , G11C11/4091 , G11C11/5657 , H01L27/11504 , H01L27/11507 , H01L27/11509
Abstract: Apparatuses and methods are disclosed that include ferroelectric memory and, for accessing ferroelectric memory. An example method includes increasing a voltage of a first cell plate of a capacitor to change the voltage of a second cell plate of the capacitor, a second digit line, and a second sense node. The voltage of the second cell plate and the second digit line is decreased to change the voltage of the first cell plate, a first digit line, and a first sense node. The first node is driven to a first voltage and the second node is driven to a second voltage responsive to the voltage of the first node being greater than the second node. The first node is driven to the second voltage and the second node is driven to the first voltage responsive to the voltage of the first node being less than the second node.
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73.
公开(公告)号:US20180374528A1
公开(公告)日:2018-12-27
申请号:US16058202
申请日:2018-08-08
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Scott J. Derner , Christopher J. Kawamura
IPC: G11C11/22 , H01L27/11514 , H01L27/11509
CPC classification number: G11C11/2257 , G11C11/221 , G11C11/2259 , G11C11/2273 , G11C11/2275 , G11C11/2293 , H01L27/11509 , H01L27/11514
Abstract: Apparatuses and methods are disclosed that include ferroelectric memory and for operating ferroelectric memory. An example apparatus includes a capacitor having a first plate, a second plate, and a ferroelectric dielectric material. The apparatus further includes a first digit line and a first selection component configured to couple the first plate to the first digit line, and also includes a second digit line and a second selection component configured to couple the second plate to the second digit line.
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公开(公告)号:US10127971B1
公开(公告)日:2018-11-13
申请号:US15583023
申请日:2017-05-01
Applicant: Micron Technology, Inc.
Inventor: Scott J. Derner , Huy T. Vo , Patrick Mullarkey , Jeffrey P. Wright , Michael A. Shore
IPC: G11C11/4091 , G11C11/406 , G11C11/4072 , G11C11/4094 , G11C11/4096
Abstract: Systems and methods are provided for implementing an array rest mode. An example system includes at least one mode register configured to enable an array reset mode, a memory cell array including one or more sense amplifiers, and control logic. Each of the one or more sense amplifier may include at least a first terminal coupled to a first bit line and a second terminal coupled to a second bit line. The control logic may be coupled to the memory cell array, and in communication with the at least one mode register. The control logic may be configured to drive, in response to array reset mode being enabled, each of the first and second terminals of the sense amplifier to a bit-line precharge voltage that corresponds to a bit value to be written to respective memory cells associated with each of the first and second bit lines.
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75.
公开(公告)号:US10127965B2
公开(公告)日:2018-11-13
申请号:US15679032
申请日:2017-08-16
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Christopher J. Kawamura , Scott J. Derner
IPC: G11C11/22 , G11C11/4091 , H01L27/11504 , H01L27/11509 , H01L27/11507 , G11C11/56
Abstract: Apparatuses and methods are disclosed that include ferroelectric memory and for accessing ferroelectric memory. An example method includes increasing a voltage of a first cell plate of a capacitor to change the voltage of a second cell plate of the capacitor, a second digit line, and a second sense node. The voltage of the second cell plate and the second digit line is decreased to change the voltage of the first cell plate, a first digit line, and a first sense node. The first node is driven to a first voltage and the second node is driven to a second voltage responsive to the voltage of the first node being greater than the second node. The first node is driven to the second voltage and the second node is driven to the first voltage responsive to the voltage of the first node being less than the second node.
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公开(公告)号:US20180308853A1
公开(公告)日:2018-10-25
申请号:US15796611
申请日:2017-10-27
Applicant: Micron Technology, Inc.
Inventor: Debra M. Bell , Scott J. Derner
IPC: H01L27/11 , H01L21/762
CPC classification number: H01L27/1112 , G11C11/412 , G11C11/419 , H01L21/76202 , H01L27/1104
Abstract: Some embodiments include memory cells having four transistors supported by a base, and vertically offset from the base. The four transistors are incorporated into first and second inverters having first and second inverter outputs, respectively. A first access transistor gatedly couples the first inverter output to a first comparative bitline, and second access transistor gatedly couples the second inverter output to a second comparative bitline. The first and second access transistors have first and second gates coupled to one another through a wordline. The four transistors are along a first side of the wordline, and are vertically displaced from the wordline. The first and second comparative bitlines are laterally adjacent to one another along a second side of the wordline, and are vertically displaced from the wordline. Some embodiments include memory arrays.
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公开(公告)号:US20180294015A1
公开(公告)日:2018-10-11
申请号:US16007022
申请日:2018-06-13
Applicant: Micron Technology, Inc.
Inventor: Charles L. Ingalls , Scott J. Derner
IPC: G11C7/06
CPC classification number: G11C7/065 , G11C7/062 , G11C7/067 , G11C2207/063 , H01L21/8221 , H01L21/823885 , H01L27/0688 , H01L27/092 , H01L27/10897 , H01L29/7827
Abstract: A sense amplifier construction comprises a first n-type transistor and a second n-type transistor above the first n-type transistor. A third p-type transistor is included and a fourth p-type transistor is above the third p-type transistor. A lower voltage activation line is electrically coupled to n-type source/drain regions that are elevationally between respective gates of the first and second n-type transistors. A higher voltage activation line is electrically coupled to p-type source/drain regions that are elevationally between respective gates of the third and fourth p-type transistors.
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公开(公告)号:US20180061835A1
公开(公告)日:2018-03-01
申请号:US15664161
申请日:2017-07-31
Applicant: Micron Technology, Inc.
Inventor: Gloria Yang , Suraj J. Mathew , Raghunath Singanamalla , Vinay Nair , Scott J. Derner , Michael Amiel Shore , Brent Keeth , Fatma Arzum Simsek-Ege , Diem Thy N. Tran
IPC: H01L27/108 , H01L27/06 , H01L29/423 , H01L49/02 , H01L29/78
CPC classification number: H01L27/108 , G11C11/403 , H01L23/528 , H01L27/0688 , H01L28/90 , H01L29/0847 , H01L29/1037 , H01L29/42376 , H01L29/7827
Abstract: Some embodiments include a memory cell having first and second transistors, and a capacitor vertically displaced relative to the first and second transistors. The capacitor has a first node electrically coupled with a source/drain region of the first transistor, a second node electrically coupled with a source/drain region of the second transistor, and capacitor dielectric material between the first and second nodes. Some embodiments include a memory cell having first and second transistors vertically displaced relative to one another, and a capacitor between the first and second transistors. The capacitor has a first node electrically coupled with a source/drain region of the first transistor, a second node electrically coupled with a source/drain region of the second transistor, and capacitor dielectric material between the first and second nodes.
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79.
公开(公告)号:US20180061469A1
公开(公告)日:2018-03-01
申请号:US15679016
申请日:2017-08-16
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Scott J. Derner , Christopher J. Kawamura
IPC: G11C11/22
CPC classification number: G11C11/2257 , G11C11/221 , G11C11/2259 , G11C11/2273 , G11C11/2275 , G11C11/2293 , H01L27/11509 , H01L27/11514
Abstract: Apparatuses and methods are disclosed that in ferroelectric memory and for operating ferroelectric memory. An example apparatus includes a capacitor having a first plate, a second plate, and a ferroelectric dielectric material. The apparatus further includes a first digit line and a first selection component configured to couple the first plate to the first digit line, and also includes a second digit line and a second selection component configured to couple the second plate to the second digit line.
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公开(公告)号:US09892776B2
公开(公告)日:2018-02-13
申请号:US15181188
申请日:2016-06-13
Applicant: Micron Technology, Inc.
Inventor: Scott J. Derner , Charles L. Ingalls
IPC: G11C7/14 , G11C11/4099 , G11C5/06 , G11C11/22
CPC classification number: G11C11/2273 , G11C7/14 , G11C11/22 , G11C11/221 , G11C11/2275 , G11C11/4099 , G11C2211/5634
Abstract: Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A memory array may be operated in a half density mode, in which a subset of the memory cells is designated as reference memory cells. Each reference memory cell may be paired to an active memory cell and may act as a reference signal when sensing the active memory cell. Each pair of active and reference memory cells may be connected to a single access line. Sense components (e.g., sense amplifiers) associated with reference memory cells may be deactivated in half density mode. The entire memory array may be operated in half density mode, or a portion of the array may operate in half density mode and the remainder of the array may operate in full density mode.
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