公开(公告)号：US10026718B2

公开(公告)日：2018-07-17

申请号：US15853852

申请日：2017-12-25

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi ,  Tadaaki Ikeda

IPC: H01L29/18 ,  H01L33/00 ,  H01L25/075 ,  H01L33/56 ,  H01L33/54 ,  H01L33/62 ,  H01L33/60 ,  H01L33/48 ,  H01L33/50

Abstract: A light emitting device includes a first light emitting element, a second light emitting element, a substrate, and a light reflective covering member. A first land is provided in a substrate front surface and includes a first terminal and a second terminal. A second land is provided in the substrate front surface and includes a third terminal and a fourth terminal. An intermediate wiring is provided between the first land and the second land in the substrate front surface. A first wiring is provided in a substrate back surface and is electrically connected to the first terminal through a first through-via. A second wiring is provided in the substrate back surface and is electrically connected to the fourth terminal through a second through-via. A third wiring is provided in the substrate back surface and is electrically connected to the second terminal and the third terminal through a third through-via.

公开(公告)号：US09887181B2

公开(公告)日：2018-02-06

申请号：US15480460

申请日：2017-04-06

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi ,  Tadaaki Ikeda

IPC: H01L29/18 ,  H01L33/00 ,  H01L25/075 ,  H01L33/60 ,  H01L33/48 ,  H01L33/50 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/483 ,  H01L33/502 ,  H01L33/504 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

Abstract: A light emitting device includes a first light emitting element having a first front surface and a first lateral surface, and a second light emitting element having a second front surface and a second lateral surface. A substrate includes a substrate front surface in which an intermediate wiring is provided. The light reflective covering member is provided on the substrate front surface to cover the first lateral surface and the second lateral surface. The light reflective covering member includes an external surface opposite to a substrate front surface in the front-back direction and a first recess having a recess opening on the external surface and a recess bottom opposite to the recess opening in the front-back direction. The recess bottom is positioned between the intermediate wiring and both of the first front surface and the second front surface in the front-back direction.

公开(公告)号：US09825001B2

公开(公告)日：2017-11-21

申请号：US14867222

申请日：2015-09-28

Applicant: NICHIA CORPORATION

Inventor： Hiroto Tamaki ,  Takuya Nakabayashi

IPC: H01L23/00 ,  H01L33/50 ,  H01L33/48

CPC classification number: H01L24/97 ,  H01L33/486 ,  H01L33/505 ,  H01L33/56 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2933/0041 ,  H01L2924/00014

Abstract: A method of manufacturing a light emitting device includes: preparing a light-transmissive member including a light reflective sheet that has a through-hole, and a color conversion material layer that is composed of a light-transmissive resin containing a color conversion material and disposed in the through-hole, preparing a light emitting element, fixing the color conversion material layer to the light emitting element, covering a side surface of the light emitting element with a light-reflective member, and cutting the light-reflective member and light-reflective sheet.

公开(公告)号：US09793459B2

公开(公告)日：2017-10-17

申请号：US15588863

申请日：2017-05-08

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi ,  Akira Hori

IPC: H01L33/48 ,  H01L33/54 ,  H01L33/64 ,  H01L33/62 ,  H01L33/32 ,  H01L33/56 ,  H01L33/60 ,  H01L33/50

CPC classification number: H01L33/647 ,  H01L25/0753 ,  H01L33/32 ,  H01L33/486 ,  H01L33/502 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/16225

Abstract: A light emitting device includes a substrate, a light emitting element, a sealing member, a light transmissive member and a heat dissipation terminal. The substrate has a first main surface, a second main surface, and a mounting surface that is adjacent to at least the second main surface. The substrate includes an insulating base material and a pair of connection terminals. The light emitting element is mounted on the first main surface of the substrate. The sealing member is in contact with at least a part of a side surface of the light emitting element and is formed substantially in the same plane as the substrate on the mounting surface. The heat dissipation terminal is arranged generally in the center on the second main surface of the substrate and has a recess portion as viewed along a direction normal to the second main surface.

公开(公告)号：US09748164B2

公开(公告)日：2017-08-29

申请号：US14196778

申请日：2014-03-04

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi ,  Yoshitaka Bando ,  Hiroto Tamaki

IPC: H01L23/495 ,  H01L33/62

CPC classification number: H01L23/49537 ,  H01L21/4828 ,  H01L23/49503 ,  H01L23/49544 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49582 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A lead frame of high quality which can endure direct bonding to the electrodes of a semiconductor element and a metal member, and a semiconductor device of high reliability which utilizing the lead frame. The lead frame includes a pair of lead frame portions which are arranged spaced apart from and opposite to each other to be electrically connected to a pair of electrodes of a semiconductor element respectively, and a pair of support bars which are arranged spaced apart from the lead portions and extending from a side of either one of the lead portions to a side of the other lead portion.

公开(公告)号：US09666774B2

公开(公告)日：2017-05-30

申请号：US14866317

申请日：2015-09-25

Applicant: Nichia Corporation

Inventor： Suguru Beppu ,  Yoichi Bando ,  Hiroto Tamaki ,  Takuya Nakabayashi

IPC: H01L33/60 ,  H01L33/50

CPC classification number: H01L33/60 ,  H01L33/50 ,  H01L2224/73253 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.

公开(公告)号：US09647190B2

公开(公告)日：2017-05-09

申请号：US15194530

申请日：2016-06-27

Applicant: NICHIA CORPORATION

Inventor： Shimpei Sasaoka ,  Takuya Nakabayashi

IPC: H01L33/00 ,  H01L33/62 ,  H01L25/13 ,  H01L25/075 ,  H01L33/48 ,  H01L23/00

CPC classification number: H01L33/62 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0753 ,  H01L25/13 ,  H01L27/156 ,  H01L33/486 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4909 ,  H01L2224/49107 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A light emitting apparatus includes a package and a first light emitting device. The package has a package bottom surface and defining recessed portion having a recessed portion bottom surface therein. The package includes a first leadframe, a second leadframe and resin portion. Each of the first and second leadframes has a leadframe upper surface which is partially exposed at the recessed portion bottom surface and a leadframe bottom surface exposed at the package bottom surface. The first light emitting device is mounted in the recessed portion. The first and second leadframes are spaced apart each other via an separation area having a bending portion and a liner portion connected to the bending portion and extended substantially straight along a boundary line between the first leadframe main body and the first leadframe extension portion at the package bottom surface.

公开(公告)号：US09548261B2

公开(公告)日：2017-01-17

申请号：US14196805

申请日：2014-03-04

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi ,  Yoshitaka Bando ,  Hiroto Tamaki

IPC: H01L23/495 ,  H01L33/62

CPC classification number: H01L23/49503 ,  H01L23/49562 ,  H01L23/49582 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A lead frame of high quality which can endure direct bonding to a semiconductor element, and a semiconductor device of high reliability which utilizing the lead frame. A lead frame includes a plurality of connected units, each unit including a pair of lead portions arranged spaced apart and opposite from each other, for mounting a semiconductor element and electrically connecting to a pair of electrodes of the semiconductor element respectively. The lead portions respectively include an element mounting region arranged on a surface thereof to mount the semiconductor element, and a groove extending from opposing end surfaces of each of the pair of lead portions, in a direction away from the end surfaces and bending in a surrounding manner along outer periphery of the element mounting region.

Abstract translation: 可以承受与半导体元件的直接接合的高质量的引线框架，以及利用引线框架的高可靠性的半导体器件。 引线框架包括多个连接的单元，每个单元包括彼此间隔开并相对布置的一对引线部分，用于安装半导体元件并电连接到半导体元件的一对电极。 引线部分分别包括布置在其表面上以安装半导体元件的元件安装区域和从远离端面的方向从一对引线部分的每一个的相对端表面延伸的凹槽，并在周围 方式沿着元件安装区域的外周。

公开(公告)号：US09406856B2

公开(公告)日：2016-08-02

申请号：US14315332

申请日：2014-06-26

Applicant: NICHIA CORPORATION

Inventor： Shimpei Sasaoka ,  Takuya Nakabayashi

IPC: H01L33/00 ,  H01L33/62 ,  H01L25/13 ,  H01L33/48 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0753 ,  H01L25/13 ,  H01L27/156 ,  H01L33/486 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4909 ,  H01L2224/49107 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: The present invention provides a package for light emitting apparatus has a long-length direction and a short-length direction perpendicular to the long-length direction as viewed in plan view, and includes first, second and third leadframes, and a resin portion. The first and second leadframes are arranged on the both sides in the long-length direction. The third leadframe is arranged between the first and second leadframes. The resin portion is integrally formed with the first, second and third leadframes. The first and second leadframes include main portions, and first and second extension portions that extend from the main portions toward the second and first leadframes, respectively, and have a width smaller than the main portions.

Abstract translation: 本发明提供了一种发光装置的封装，其具有从俯视图看的长度方向和长度方向的长度方向，并且包括第一，第二和第三引线框以及树脂部。 第一引线框架和第二引线框架沿长度方向布置在两侧。 第三引线框架布置在第一引线框架和第二引线框架之间。 树脂部分与第一，第二和第三引线框一体形成。 第一引线框架和第二引线框架包括主要部分，以及分别从主要部分朝向第二引线框架和第一引线框架延伸并且具有小于主要部分的宽度的第一和第二延伸部分。

公开(公告)号：US09368704B2

公开(公告)日：2016-06-14

申请号：US14196754

申请日：2014-03-04

Applicant: NICHIA CORPORATION

Inventor： Takuya Nakabayashi ,  Yoshitaka Bando ,  Hiroto Tamaki

IPC: H01L33/00 ,  H01L33/62 ,  H01L23/495

CPC classification number: H01L33/62 ,  H01L23/495 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A lead frame of high quality which can endure direct bonding to a light emitting element, and a light emitting device of high reliability which utilizing the lead frame. A lead frame includes a clad material which is a stacked layer of at least a first metal layer and a second metal layer, the second metal layer made of a metal which is different from the metal of the first metal layer, and a through portion. In the through-portion, an end surface of the first metal layer and an end surface of the second metal layer are covered with a plated layer. The end surface of either the first metal layer or the second metal layer protrudes farther into the through-portion than the end surface of the other metal layer.

Abstract translation: 可以承受与发光元件的直接接合的高质量的引线框架和利用引线框架的高可靠性的发光器件。 引线框架包括作为至少第一金属层和第二金属层的堆叠层的包覆材料，由与第一金属层的金属不同的金属制成的第二金属层和贯通部。 在贯通部中，第一金属层的端面和第二金属层的端面被电镀层覆盖。 第一金属层或第二金属层的端面比另一金属层的端面进一步向贯通部突出。