公开(公告)号：US07562434B2

公开(公告)日：2009-07-21

申请号：US11442935

申请日：2006-05-30

申请人： Naoki Ishikawa ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Takayoshi Matsumura

发明人： Naoki Ishikawa ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Takayoshi Matsumura

IPC分类号： G11B5/127 ,  H04R31/00

CPC分类号： G11B5/4833 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4903 ,  Y10T29/49032

摘要： When crimping suspensions to carriage arms using a metal ball by applying ultrasonic vibration to a crimping tool, the suspensions can be crimped to the carriage arms without causing deformation to the suspensions and the like. A method of assembling a carriage assembly aligns attachment holes provided in front ends of carriage arms and crimping portions provided on suspensions to set the suspensions on the carriage arms and then presses a ball through crimping holes provided in the crimping portions while applying ultrasonic vibration to the crimping tool to crimp the suspensions to the carriage arms. When doing so, a ball, such as a ball whose surface has been subjected to a dimpling process, for which a load that acts on the ball when the ball passes through the crimping holes is low compared to a spherical ball is used to crimp the suspensions to the carriage arms.

摘要翻译： 当通过对压接工具施加超声波振动将金属球通过金属球压接到支架臂上时，可以将悬架卷曲到托架臂而不会使悬架等变形。 组装滑架组件的方法将设置在滑架臂的前端的设置孔和设置在悬架上的压接部对准，以将悬架设置在滑架臂上，然后通过设置在压接部分中的压接孔将球压入同时向超声波振动施加超声波振动 压接工具将悬架压接到托架臂上。 当这样做时，使用诸如球表面已经进行了凹坑处理的球，当球通过压接孔时作用在球上的负载与球形球相比较低， 悬挂在托架臂上。

公开(公告)号：US07298265B2

公开(公告)日：2007-11-20

申请号：US11091934

申请日：2005-03-29

申请人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi

发明人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi

IPC分类号： G08B13/14

CPC分类号： H01L24/12 ,  G06K19/07749 ,  G06K19/0775 ,  H01L23/49855 ,  H01L24/11 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/8159 ,  H01L2224/816 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/49018 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2224/29075 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： The present invention provides a radio frequency identification (RFID) tag which exchanges information with an external device in a noncontact manner, in which a paste is used as a material for an antenna, and which is designed to prevent sinking of bumps. A stopper for limiting sinking of bumps of a circuit chip caused by a pressing force when the circuit chip is connected to an antenna is provided on the circuit chip or a base at a position adjacent to the bumps.

摘要翻译： 本发明提供了一种射频识别（RFID）标签，其以非接触方式与外部设备交换信息，其中使用糊料作为天线的材料，并且被设计成防止凸起的下沉。 当电路芯片连接到天线时，用于限制由压力引起的电路芯片的凸块的下沉的止动器设置在电路芯片或与凸块相邻的位置的基座上。

公开(公告)号：US07214563B2

公开(公告)日：2007-05-08

申请号：US11319652

申请日：2005-12-29

申请人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shunichi Kikuchi ,  Tatsuro Tsuneno

发明人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shunichi Kikuchi ,  Tatsuro Tsuneno

IPC分类号： H01L21/44

CPC分类号： G06K19/07749 ,  H01L21/67132 ,  H01L21/67144 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2221/68354 ,  H01L2223/6677 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75314 ,  H01L2224/7565 ,  H01L2224/75745 ,  H01L2224/7598 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/81121 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/83192 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/81

摘要： An IC chip mounting method which mounts two or more IC chips on a base, includes: preparing a wafer by mounting a tape on a face thereof, which is the reverse of the wafer having a mounting surface to be attached to the base, and by dividing the wafer into IC chips by dicing while leaving the tape; positioning the wafer to face the base in such a direction that the mounting surface to be attached to the base faces the base; sequentially pressing the IC chips on the wafer against the base and temporarily fixing the IC chips while the base is being fed in a prescribed one-dimensional direction along the wafer and while the wafer is being moved two-dimensionally along the base; and fixing the IC chips temporarily fixed on the base on the base by heating and pressurizing in a batch manner.

摘要翻译： 一种将两个或更多个IC芯片安装在基座上的IC芯片安装方法，包括：通过在其表面上安装带子，准备晶片，该晶片具有安装在基座上的安装表面，并且通过 在离开胶带的同时通过切割将晶片分成IC芯片; 将晶片定位成使得与基座相对的安装表面面向基座的方向面对基座; 在晶片沿着晶片沿指定的一维方向进给的同时沿着基座二维移动的同时，将晶片上的IC芯片依次按压在基板上并临时固定IC芯片; 并且通过间歇加热和加压将临时固定在基座上的IC芯片固定在基座上。

公开(公告)号：US20070020801A1

公开(公告)日：2007-01-25

申请号：US11324600

申请日：2006-01-04

申请人： Naoki Ishikawa ,  Tatsuro Tsuneno ,  Hidehiko Kira ,  Hiroshi Kobayashi

发明人： Naoki Ishikawa ,  Tatsuro Tsuneno ,  Hidehiko Kira ,  Hiroshi Kobayashi

IPC分类号： H01L21/00

CPC分类号： G06K19/07745 ,  G06K19/07718 ,  H01L21/67144 ,  H01L21/6836 ,  H01L24/75 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/75743 ,  H01L2224/75822 ,  H01L2224/7598 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/81

摘要： The present invention provides an IC chip mounting method for mounting two or more IC chips on a base, including: preparing a wafer by mounting a tape on a face thereof, which is the reverse of the wafer having a mounting surface to be attached to the base, and by dividing the wafer into IC chips by dicing while leaving the tape; sequentially pressing the IC chips on the wafer against a first roller to allow the chips to be sucked onto the first roller; subsequently transferring the IC chips sucked onto the first roller to a second roller; and subsequently mounting the IC chips transferred to the second roller on the traveling base.

摘要翻译： 本发明提供了一种用于在基座上安装两个或更多个IC芯片的IC芯片安装方法，包括：通过在其表面上安装带来准备晶片，该晶片具有安装在其上的安装表面 并且通过在离开胶带的同时通过切割将晶片分成IC芯片; 依次将晶片上的IC芯片压靠在第一辊上，以使芯片被吸入到第一辊上; 随后将吸入第一辊的IC芯片传送到第二辊; 随后将传送到第二辊的IC芯片安装在行进基座上。

公开(公告)号：US20060131427A1

公开(公告)日：2006-06-22

申请号：US11091935

申请日：2005-03-29

申请人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi

发明人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi

IPC分类号： G06K19/06 ,  G08B13/14 ,  H01Q17/00

CPC分类号： H01L23/13 ,  G06K19/07749 ,  G06K19/0775 ,  H01L23/49855 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/10165 ,  H01L2224/1134 ,  H01L2224/13016 ,  H01L2224/13019 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01Q1/2208 ,  H01Q1/36 ,  H01Q7/00 ,  Y10T29/49018 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention provides a radio frequency identification (RFID) tag which exchanges information with an external device in a noncontact manner, in which a paste is used as a material for an antenna, and which is designed to avoid the problem due to swelling of the paste caused by a pressing force from bumps of an IC chip. A paste escape recess is provided in which part of the paste provided to form the antenna is caused to flow therein by the pressure received from the bumps when the IC chip with the bumps is connected to the antenna.

摘要翻译： 本发明提供了一种射频识别（RFID）标签，其以非接触方式与外部设备交换信息，其中使用糊料作为天线的材料，并且被设计为避免由于 由IC芯片的凸块的压力引起的糊状物。 提供了一种糊状逃逸凹部，其中当具有凸起的IC芯片连接到天线时，通过从凸起接收的压力使得设置成形成天线的浆料的一部分流入其中。

公开(公告)号：US07581309B2

公开(公告)日：2009-09-01

申请号：US11375210

申请日：2006-03-15

申请人： Takayoshi Matsumura ,  Naoki Ishikawa ,  Hiroshi Kobayashi ,  Yasuo Moriya ,  Hidehiko Kira

发明人： Takayoshi Matsumura ,  Naoki Ishikawa ,  Hiroshi Kobayashi ,  Yasuo Moriya ,  Hidehiko Kira

IPC分类号： G11B5/48 ,  B23P11/00

CPC分类号： G11B5/4813 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/49915 ,  Y10T29/49934 ,  Y10T29/49938 ,  Y10T29/53165

摘要： A method of assembling a carriage assembly is capable of suppressing deformation of spacer portions when suspensions are attached to carriage arms. The method of assembling a carriage assembly aligns fitting holes provided in front end portions of carriage arms and spacer holes provided in spacer portions of suspensions and places the suspensions onto the carriage arms, and then presses a ball with a diameter equal to or greater than an inner diameter of the spacer holes with a pressure-applying member to pass the ball through the spacer holes, thereby crimping spacer hole edge portions of the spacer portions and attaching the suspensions to the front end portions of the carriage arms. By applying ultrasonic vibration from two axial directions to the pressure-applying member, the pressure-applying member is caused to vibrate on a two-dimensional movement path on a predetermined plane and passes the ball through the spacer holes while causing the ball to rotate.

摘要翻译： 一种组装滑架组件的方法能够在将悬架连接到滑架臂时抑制间隔部分的变形。 组装滑架组件的方法将设置在滑架臂的前端部分的设置孔和设置在悬架的间隔部分中的间隔孔对准，并将悬架放置在滑架臂上，然后将直径等于或大于 具有加压构件的间隔孔的内径使球通过间隔孔，由此压接间隔件部分的间隔孔边缘部分并将悬架附接到托架臂的前端部。 通过将两个轴向的超声波振动施加到施加压力的构件，使压力施加构件在预定平面上的二维运动路径上振动，并使球通过间隔孔，同时使球旋转。

公开(公告)号：US07431218B2

公开(公告)日：2008-10-07

申请号：US11188346

申请日：2005-07-25

申请人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shunichi Kikuchi

发明人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shunichi Kikuchi

IPC分类号： G06K19/06

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

摘要： An RFID tag including a first part which has a first base and a communication antenna formed on the first base by use of a paste of resin material mixed with metallic filler; and a second part disposed on the first part, which has a second base, a metallic patch disposed on the second base and electrically connected to the antenna on the first part, and a circuit chip connected onto the metallic patch via a bump, the circuit chip performing radio communication via the antenna.

摘要翻译： 一种RFID标签，包括：第一部分，其具有通过使用与金属填料混合的树脂材料的浆料形成在第一基底上的第一基底和通信天线; 以及设置在第一部分上的第二部分，其具有第二基底，设置在第二基底上并与第一部分上的天线电连接的金属贴片，以及通过凸块连接到金属贴片上的电路芯片，该电路 芯片通过天线执行无线电通信。

公开(公告)号：US07274296B2

公开(公告)日：2007-09-25

申请号：US11062483

申请日：2005-02-23

申请人： Shunji Baba ,  Naoki Ishikawa ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shigeru Hashimoto ,  Yoshiyasu Sugimura

发明人： Shunji Baba ,  Naoki Ishikawa ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shigeru Hashimoto ,  Yoshiyasu Sugimura

IPC分类号： G08B13/14

CPC分类号： H01L23/573 ,  G06K19/073 ,  G06K19/0739 ,  H01L23/49855 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

摘要： The present invention provides an RFID tag that is very effective in preventing fraudulent uses. The RFID tag includes a base, an antenna pattern provided on the base, a breakdown pattern provided on the base, a circuit chip connected to both the antenna pattern and the breakdown pattern, and a cover that is bonded to the base in a strippable condition so as to cover the antenna pattern, the breakdown pattern and the circuit chip and is caused to come off together with all or a part of the breakdown pattern during stripping from the base. The breakdown pattern is transparent, or the cover conceals a remaining part of the breakdown pattern, or the breakdown pattern has a specific part that produces predetermined electrical properties and the cover conceals the specific part.

摘要翻译： 本发明提供一种非常有效防止欺诈用途的RFID标签。 RFID标签包括基座，设置在基座上的天线图案，设置在基座上的击穿图案，连接到天线图案和击穿图案的电路芯片，以及以可剥离状态接合到基座的盖子 以覆盖天线图案，击穿图案和电路芯片，并且在从基座剥离时与所有或部分击穿图案一起脱落。 击穿图案是透明的，或者盖子隐藏击穿图案的剩余部分，或者击穿图案具有产生预定电气特性的特定部件，并且盖子隐藏特定部件。

公开(公告)号：US20070186410A1

公开(公告)日：2007-08-16

申请号：US11442935

申请日：2006-05-30

申请人： Naoki Ishikawa ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Takayoshi Matsumura

发明人： Naoki Ishikawa ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Takayoshi Matsumura

IPC分类号： G11B5/48

CPC分类号： G11B5/4833 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4903 ,  Y10T29/49032

摘要： When crimping suspensions to carriage arms using a metal ball by applying ultrasonic vibration to a crimping tool, the suspensions can be crimped to the carriage arms without causing deformation to the suspensions and the like. A method of assembling a carriage assembly aligns attachment holes provided in front ends of carriage arms and crimping portions provided on suspensions to set the suspensions on the carriage arms and then presses a ball through crimping holes provided in the crimping portions while applying ultrasonic vibration to the crimping tool to crimp the suspensions to the carriage arms. When doing so, a ball, such as a ball whose surface has been subjected to a dimpling process, for which a load that acts on the ball when the ball passes through the crimping holes is low compared to a spherical ball is used to crimp the suspensions to the carriage arms.

摘要翻译： 当通过对压接工具施加超声波振动将金属球通过金属球压接到支架臂上时，可以将悬架卷曲到托架臂而不会使悬架等变形。 组装滑架组件的方法将设置在滑架臂的前端的设置孔和设置在悬架上的压接部对准，以将悬架设置在滑架臂上，然后通过设置在压接部分中的压接孔将球压入同时向超声波振动施加超声波振动 压接工具将悬架压接到托架臂上。 当这样做时，使用诸如球表面已经进行了凹坑处理的球，当球通过压接孔时作用在球上的负载与球形球相比较低， 悬挂在托架臂上。

公开(公告)号：US20070139203A1

公开(公告)日：2007-06-21

申请号：US11378623

申请日：2006-03-20

申请人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Takayoshi Matumura

发明人： Naoki Ishikawa ,  Shunji Baba ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Takayoshi Matumura

IPC分类号： G08B13/14 ,  B31B1/60

CPC分类号： G06K19/07749 ,  G06K19/077 ,  G06K19/07728 ,  H01Q1/2208 ,  H01Q9/16 ,  Y10T156/10 ,  Y10T156/1754

摘要： The present invention relates to an RFID tag performing exchange of information with an external device without contact, and is to improve the resistance to bending while avoiding an increase in the thickness of the RFID tag. A circuit chip is bonded to a base portion of a base with a thermosetting adhesive. The base is folded, and an ultraviolet curing adhesive is applied on the circuit chip. The fold-back portions of the base are folded back onto the circuit chip, to which portions ultraviolet light is irradiated, as a result, both of the surfaces of the circuit chip are bonded to the base with the adhesives.

摘要翻译： RFID标签技术领域本发明涉及RFID标签，其与外部设备进行信息交换而不接触，并且提高耐弯曲性，同时避免RFID标签的厚度增加。 电路芯片用热固性粘合剂粘合到基底的基部。 折叠底座，并在电路芯片上施加紫外线固化粘合剂。 将基座的折回部分折回到电路芯片上，照射部分紫外线，结果，电路芯片的两个表面都用粘合剂粘合到基底上。