公开(公告)号：US08315056B2

公开(公告)日：2012-11-20

申请号：US12884058

申请日：2010-09-16

申请人： Chang Hyun Lim ,  Jung Eun Kang ,  Seog Moon Choi ,  Kwang Soo Kim ,  Sung Keun Park

发明人： Chang Hyun Lim ,  Jung Eun Kang ,  Seog Moon Choi ,  Kwang Soo Kim ,  Sung Keun Park

IPC分类号： H05K7/20 ,  H05K1/03

CPC分类号： H05K1/0203 ,  H05K1/053 ,  H05K1/141 ,  H05K2201/062 ,  H05K2201/09745 ,  H05K2201/10166 ,  Y10T29/49083 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T156/10 ,  Y10T156/1056 ,  Y10T156/1064

摘要： Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space.

摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括：芯层，其包括芯金属层和形成在芯金属层上的芯绝缘层，并分为第一区域和第二区域; 形成在芯层的第一区域中的电路层; 形成在所述芯层的所述第二区域中的堆积层，并且包括积聚绝缘层和积聚电路层; 形成在芯层的第二区域和积层之间的粘合层; 以及安装在堆积层上以浸渍到粘合剂层中的浸渍装置。 发热元件安装在电路层上，并且热增强元件安装在积层上，从而防止热弱化元件被发热元件的热​​量损坏。 浸渍装置形成在堆积层上并浸渍在粘合剂层中，从而有效地利用空间。

公开(公告)号：US20120162931A1

公开(公告)日：2012-06-28

申请号：US13177270

申请日：2011-07-06

申请人： Tae Hoon Kim ,  Jae Cheon Doh ,  Seog Moon Choi

发明人： Tae Hoon Kim ,  Jae Cheon Doh ,  Seog Moon Choi

IPC分类号： H05K7/00

CPC分类号： H01L23/3121 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49575 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed herein is a 3D power module package, including: a power converting unit packaged to include a heat radiating substrate, a power device connected to the heat radiating substrate, and a lead frame; a controlling unit packaged to include a controlling unit substrate and IC and controlling devices mounted on an upper portion of the controlling unit substrate; and an electrical connecting unit electrically connecting the packaged power converting unit and the packaged controlling unit.

摘要翻译： 本文公开了一种3D功率模块封装，包括：封装成包括散热基板的功率转换单元，连接到散热基板的功率器件和引线框架; 控制单元，其被封装成包括控制单元基板和IC以及安装在所述控制单元基板的上部的控制装置; 以及电连接单元，电连接所述封装的电力转换单元和所述封装的控制单元。

公开(公告)号：US20120000697A1

公开(公告)日：2012-01-05

申请号：US12954416

申请日：2010-11-24

申请人： Jung Eun Kang ,  Seog Moon Choi ,  Sung Keun Park ,  Chang Hyun Lim ,  Kwang Soo Kim

发明人： Jung Eun Kang ,  Seog Moon Choi ,  Sung Keun Park ,  Chang Hyun Lim ,  Kwang Soo Kim

IPC分类号： H05K1/03 ,  H05K3/02 ,  H05K1/02

CPC分类号： H05K1/053 ,  H01L23/13 ,  H01L23/142 ,  H01L23/498 ,  H01L2224/73265 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K3/107 ,  H05K3/108 ,  H05K2201/10166 ,  H05K2203/0315 ,  H05K2203/0369 ,  H01L2924/00 ,  H01L2924/00014

摘要： Disclosed herein is a printed circuit board, including: a substrate having a cavity formed therein; an anodic oxide layer formed by anodizing the substrate; and a circuit layer formed in the cavity. The printed circuit board is advantageous in that, since a circuit layer is formed in a cavity of a substrate, a circuit layer having a thickness necessary for realizing a high-power semiconductor package can be easily formed, and the difficulty of supplying and demanding the raw material of a thick film plating resist can be overcome. Further, the printed circuit board is advantageous in that electrical shorts occurring at the time of forming a thick circuit layer and electrical shorts generated by the compounds remaining after etching can be prevented, thus improving the electrical reliability and stability of a circuit layer.

摘要翻译： 本文公开了一种印刷电路板，包括：其中形成有腔的基板; 通过阳极氧化所述基板形成的阳极氧化层; 以及形成在空腔中的电路层。 印刷电路板的优点在于，由于电路层形成在基板的空腔中，所以可以容易地形成具有实现大功率半导体封装所需的厚度的电路层，并且难以供应和要求 可以克服厚膜电镀抗蚀剂的原料。 此外，印刷电路板的优点在于，可以防止在形成厚电路层时发生的电短路和蚀刻后残留的化合物产生的电短路，从而提高电路层的电可靠性和稳定性。

公开(公告)号：US08012778B2

公开(公告)日：2011-09-06

申请号：US12259576

申请日：2008-10-28

申请人： Yong Suk Kim ,  Young Soo Oh ,  Hyoung Ho Kim ,  Taek Jung Lee ,  Seog Moon Choi

发明人： Yong Suk Kim ,  Young Soo Oh ,  Hyoung Ho Kim ,  Taek Jung Lee ,  Seog Moon Choi

IPC分类号： H01L21/00

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/641 ,  H01L2224/16225

摘要： The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.

摘要翻译： 本发明提供一种LED封装，其能够有效地从LED封装中散发从LED芯片发出的热量及其制造方法。 为此，在基板的下侧表面上形成至少一个凹槽以封装LED芯片，并且凹槽填充有碳纳米管材料。 在LED封装中，准备在底面上具有至少一个沟槽的衬底。 多个电极形成在基板的顶表面上。 此外，至少将一个LED芯片安装在基板上，以使两个端子电连接到上电极。 此外，碳纳米管填料填充在基板的槽中。

公开(公告)号：US20110012252A1

公开(公告)日：2011-01-20

申请号：US12551238

申请日：2009-08-31

申请人： Shan GAO ,  Seog Moon Choi ,  Tae Hyun Kim ,  Ju Pyo Hong ,  Bum Sik Jang ,  Ji Hyun Park

发明人： Shan GAO ,  Seog Moon Choi ,  Tae Hyun Kim ,  Ju Pyo Hong ,  Bum Sik Jang ,  Ji Hyun Park

IPC分类号： H01L23/46 ,  H01L23/48 ,  H01L21/50

CPC分类号： H01L25/072 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/427 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/071 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein is a power semiconductor module. The module includes metal plates each having a first through hole, with an anodic oxidation layer formed on a surface of metal plates and an interior of the first through hole. A cooling member has a second through hole at a position corresponding to the first through hole, and the metal plates are attached to both sides of the cooling member. A circuit layer is formed on the anodic oxidation layer and performs an interlayer connection through a via formed in the first and second through holes. A power device is connected to the circuit layer. A resin encapsulant encloses the circuit layer and the power device. A housing is installed to each of the metal plates to form a sealing space for the resin encapsulant.

摘要翻译： 这里公开了功率半导体模块。 模块包括各自具有第一通孔的金属板，阳极氧化层形成在金属板的表面和第一通孔的内部。 冷却构件在与第一通孔对应的位置具有第二通孔，并且金属板附接到冷却构件的两侧。 在阳极氧化层上形成电路层，通过在第一和第二通孔中形成的通孔进行层间连接。 电源设备连接到电路层。 树脂密封剂包围电路层和功率器件。 每个金属板上安装有一个壳体，以形成树脂密封剂的密封空间。

公开(公告)号：US20100295172A1

公开(公告)日：2010-11-25

申请号：US12538042

申请日：2009-08-07

申请人： Shan Gao ,  Seog Moon Choi ,  Do Jae Yoo ,  Tae Hyun Kim ,  Bum Sik Jang ,  Ji Hyun Park

发明人： Shan Gao ,  Seog Moon Choi ,  Do Jae Yoo ,  Tae Hyun Kim ,  Bum Sik Jang ,  Ji Hyun Park

IPC分类号： H01L23/34

CPC分类号： H01L23/467 ,  H01L23/142 ,  H01L23/24 ,  H01L23/3735 ,  H01L23/427 ,  H01L25/071 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Disclosed is a power semiconductor module having improved heat dissipation performance, including an anodized metal substrate including a metal plate, an anodized layer formed on a surface of the metal plate, and a circuit layer formed on the anodized layer on the metal plate, a power device connected to the circuit layer, and a housing mounted on the metal plate and for defining a sealing space which accommodates a resin sealing material for sealing the circuit layer and the power device.

摘要翻译： 公开了一种具有改善的散热性能的功率半导体模块，包括阳极化金属基板，其包括金属板，形成在金属板的表面上的阳极氧化层和形成在金属板上的阳极氧化层上的电路层， 连接到电路层的器件，以及安装在金属板上并用于限定容纳用于密封电路层和功率器件的树脂密封材料的密封空间的壳体。

公开(公告)号：US20090014827A1

公开(公告)日：2009-01-15

申请号：US12155836

申请日：2008-06-10

申请人： Chang Hyun Lim ,  Seog Moon Choi ,  Dae Jun Kim ,  Won Kyu Jeung ,  Jingli Yuan

发明人： Chang Hyun Lim ,  Seog Moon Choi ,  Dae Jun Kim ,  Won Kyu Jeung ,  Jingli Yuan

IPC分类号： H01L31/0203 ,  H01L31/18

CPC分类号： H01L27/14618 ,  H01L2224/13 ,  H04N5/2257

摘要： Provided is an image sensor module at the wafer level including a wafer; an image sensor mounted on one surface of the wafer; a wireless communication chip formed outside the image sensor on the one surface of the wafer; and a protective cover installed on the one surface of the wafer.

摘要翻译： 提供了包括晶片的晶片级的图像传感器模块; 安装在晶片的一个表面上的图像传感器; 在晶片的一个表面上形成在图像传感器外部的无线通信芯片; 以及安装在晶片的一个表面上的保护盖。

公开(公告)号：US07453093B2

公开(公告)日：2008-11-18

申请号：US11489578

申请日：2006-07-20

申请人： Yong Suk Kim ,  Young Soo Oh ,  Hyoung Ho Kim ,  Taek Jung Lee ,  Seog Moon Choi

发明人： Yong Suk Kim ,  Young Soo Oh ,  Hyoung Ho Kim ,  Taek Jung Lee ,  Seog Moon Choi

IPC分类号： H01L27/15 ,  H01L23/34

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/641 ,  H01L2224/16225

摘要： The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.

摘要翻译： 本发明提供一种LED封装，其能够有效地从LED封装中散发从LED芯片发出的热量及其制造方法。 为此，在基板的下侧表面上形成至少一个凹槽以封装LED芯片，并且凹槽填充有碳纳米管材料。 在LED封装中，准备在底面上具有至少一个沟槽的衬底。 多个电极形成在基板的顶表面上。 此外，至少将一个LED芯片安装在基板上，以使两个端子电连接到上电极。 此外，碳纳米管填料填充在基板的槽中。

公开(公告)号：US07371603B2

公开(公告)日：2008-05-13

申请号：US11439189

申请日：2006-05-24

申请人： Yong Suk Kim ,  Seog Moon Choi ,  Hyoung Ho Kim ,  Yong Sik Kim

发明人： Yong Suk Kim ,  Seog Moon Choi ,  Hyoung Ho Kim ,  Yong Sik Kim

IPC分类号： H01L21/00 ,  H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H01L33/52 ,  H01L2224/48091 ,  H01L2224/48227 ,  Y10S438/974 ,  H01L2924/00014

摘要： The invention relates to an LED package and proposes a method of fabricating an LED package including steps of providing a package substrate having a mounting area of an LED and a metal pattern to be connected with the LED, and plasma-treating the package substrate to reform at least a predetermined surface area of the package substrate where a resin-molded part will be formed. The method also includes mounting the LED on the mounting area on the substrate package and electrically connecting the LED with the metal pattern, and forming the resin-molded part in the mounting area of the LED to seal the LED package.

摘要翻译： 本发明涉及一种LED封装，并提出一种制造LED封装的方法，包括以下步骤：提供具有与LED连接的LED的安装区域和与LED连接的金属图案的封装基板，以及等离子体处理封装基板以改造 至少形成将形成树脂成型部件的封装基板的预定表面积。 该方法还包括将LED安装在基板封装上的安装区域上，并将LED与金属图案电连接，并在LED的安装区域中形成树脂模制部件以密封LED封装。

公开(公告)号：US08823153B2

公开(公告)日：2014-09-02

申请号：US13584743

申请日：2012-08-13

申请人： Tae Hoon Kim ,  Seog Moon Choi

发明人： Tae Hoon Kim ,  Seog Moon Choi

IPC分类号： H01L23/48

CPC分类号： H01L23/3107 ,  H01L21/563 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49575 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed herein is a semiconductor package. The semiconductor package includes: semiconductor elements, a first heat dissipation substrate formed under the semiconductor elements, a first lead frame electrically connecting the lower portions of the semiconductor elements to an upper portion of the first heat dissipation substrate, a second heat dissipation substrate formed over the semiconductor elements, and a second lead frame having a protrusion formed to be protruded from a lower surface thereof and electrically connecting the upper portions of the semiconductor elements to a lower portion of the second heat dissipation substrate.

摘要翻译： 这里公开了半导体封装。 半导体封装包括：半导体元件，形成在半导体元件下的第一散热基板，将半导体元件的下部电连接到第一散热基板的上部的第一引线框架，形成在第一散热基板上的第二散热基板 所述半导体元件和具有突起的第二引线框架，所述突起形成为从其下表面突出并将所述半导体元件的上部电连接到所述第二散热基板的下部。