公开(公告)号：US11722220B2

公开(公告)日：2023-08-08

申请号：US17144938

申请日：2021-01-08

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Chang-Yu Lin ,  Cheng-Yuan Kung ,  Hung-Yi Lin

IPC分类号： H04B10/00 ,  H04B10/40 ,  G02B6/42 ,  H04J14/00

CPC分类号： H04B10/40 ,  G02B6/4206 ,  G02B6/4257

摘要： A system including optical devices is provided. The system includes a first substrate and a first device for optical communication. The first device has a first surface, a second surface opposite to the first surface, and a first side contiguous with the first surface and the second surface. Moreover, the first side is smaller than one of the first surface and the second surface in terms of area. The first device is attached at the first side thereof to the first substrate.

公开(公告)号：US11721652B2

公开(公告)日：2023-08-08

申请号：US17078070

申请日：2020-10-22

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Wen-Long Lu

IPC分类号： H01L23/00 ,  H01L23/66 ,  H01L23/498 ,  H01L21/48 ,  H01Q1/38

CPC分类号： H01L23/66 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/4985 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/16 ,  H01Q1/38 ,  H01L2223/6677 ,  H01L2224/16227

摘要： A semiconductor device package includes an electronic component and a substrate. The electronic component has a first surface and a second surface. The substrate is connected to the first surface of the electronic component through an adhesive layer. The substrate includes a first antenna disposed over the second surface of the electronic components through the adhesive layer.

公开(公告)号：US20230244049A1

公开(公告)日：2023-08-03

申请号：US17588105

申请日：2022-01-28

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Po-I WU ,  Ming-Fong JHONG

IPC分类号： G02B6/43 ,  G02B6/42

CPC分类号： G02B6/43 ,  G02B6/4277 ,  G02B6/4284

摘要： The present disclosure relates to an electronic device that includes a waveguide, a plurality of transceiving portions over the waveguide, and a cavity between the waveguide and the transceiving portions and connecting the waveguide with the transceiving portions. The cavity is configured for resonating of an electromagnetic wave from the waveguide or the transceiving portions.

公开(公告)号：US11710689B2

公开(公告)日：2023-07-25

申请号：US17115629

申请日：2020-12-08

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Chang-Lin Yeh ,  Yu-Chang Chen

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L25/16

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49866 ,  H01L25/16

摘要： A semiconductor device package includes a substrate, a first solder paste, an electrical contact and a first encapsulant. The substrate includes a conductive pad. The first solder paste is disposed on the pad. The electrical contact is disposed on the first solder paste. The first encapsulant encapsulates a portion of the electrical contact and exposes the surface of the electrical contact. The electrical contact has a surface facing away from the substrate. A melting point of the electrical contact is greater than that of the first solder paste. The first encapsulant includes a first surface facing toward the substrate and a second surface opposite to the first surface. The second surface of the first encapsulant is exposed to air.

公开(公告)号：US20230230966A1

公开(公告)日：2023-07-20

申请号：US17576822

申请日：2022-01-14

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Wei-Hao CHANG

IPC分类号： H01L25/16 ,  H01L31/12 ,  H01L31/0216 ,  H01L23/31 ,  H05K1/02 ,  H05K1/11

CPC分类号： H01L25/167 ,  H01L31/12 ,  H01L31/02164 ,  H01L23/3121 ,  H05K1/028 ,  H05K1/115 ,  H05K2201/10121

摘要： The present disclosure provides an electronic package. The electronic package includes a substrate, a first component disposed on the substrate and configured to detect an external signal, and an encapsulant disposed on the substrate. The electronic package also includes a protection element disposed on the substrate and physically separating the first device from the encapsulant and exposing the first device. The present disclosure also provides an electronic device.

公开(公告)号：US20230223354A1

公开(公告)日：2023-07-13

申请号：US18121568

申请日：2023-03-14

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Wei Da LIN ,  Meng-Jen WANG ,  Hung Chen KUO ,  Wen Jin HUANG

IPC分类号： H01L23/552 ,  H01L21/56 ,  H01L23/04 ,  H01L21/3213 ,  H01L23/31

CPC分类号： H01L23/552 ,  H01L21/565 ,  H01L21/561 ,  H01L23/04 ,  H01L21/32131 ,  H01L23/3114 ,  H01L21/563

摘要： A semiconductor device package includes a substrate having a surface, a conductive element disposed on the surface of the substrate, and an encapsulant disposed on the surface of the substrate and covering the conductive element. The conductive element has an upper surface facing away from the substrate and exposed from the encapsulant. Further, a roughness of the upper surface of the conductive element is greater than a roughness of a side surface of the conductive element.

公开(公告)号：US11699682B2

公开(公告)日：2023-07-11

申请号：US16994498

申请日：2020-08-14

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Wen-Long Lu

IPC分类号： H01L25/065 ,  H01L23/538 ,  H01L21/50 ,  H01L21/768

CPC分类号： H01L25/0657 ,  H01L21/50 ,  H01L21/76802 ,  H01L21/76877 ,  H01L23/5384 ,  H01L23/5386

摘要： A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a first module, a second module, a first intermediate circuit layer, a first conductive transmission path and a second conductive transmission path. The second module is stacked on the first module. The first intermediate circuit layer is arranged between the first module and the second module. The first conductive transmission is configured to electrically connect the first semiconductor module with the first intermediate circuit layer. The second conductive transmission path is configured to electrically connect the first intermediate circuit layer with the second semiconductor module.

公开(公告)号：US20230215816A1

公开(公告)日：2023-07-06

申请号：US17566575

申请日：2021-12-30

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Cheng-Yuan KUNG ,  Hsu-Chiang SHIH ,  Hung-Yi LIN ,  Chien-Mei HUANG

IPC分类号： H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H01L23/538

CPC分类号： H01L23/562 ,  H01L23/5383 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/16227 ,  H01L2924/1511 ,  H01L2924/3512

摘要： A package structure includes an encapsulant, a patterned circuit structure, at least one electronic component and a shrinkage modifier. The patterned circuit structure is disposed on the encapsulant and includes a pad. The electronic component is disposed on the patterned circuit structure, and includes a bump electrically connected to the pad. The shrinkage modifier is encapsulated in the encapsulant and configured to reduce a relative displacement between the bump and the pad along a horizontal direction in an environment of temperature variation.

公开(公告)号：US20230207521A1

公开(公告)日：2023-06-29

申请号：US18112463

申请日：2023-02-21

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Yung-Hsing CHANG ,  Wen-Hsin LIN

IPC分类号： H01L25/065 ,  H01L23/31 ,  H01L21/56 ,  H01L25/00 ,  H01L23/552

CPC分类号： H01L25/0652 ,  H01L21/561 ,  H01L23/552 ,  H01L23/3121 ,  H01L25/50

摘要： At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a first substrate with a first surface and a second surface opposite to the first surface, a second substrate adjacent to the first surface of the first substrate, and an encapsulant encapsulating the first substrate and the second substrate. The first substrate defines a space. The second substrate covers the space. The second surface of the first substrate is exposed by the encapsulant. A surface of the encapsulant is coplanar with the second surface of the first substrate or protrudes beyond the second surface of the first substrate.

公开(公告)号：US20230199362A1

公开(公告)日：2023-06-22

申请号：US17560179

申请日：2021-12-22

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Chang Yi WU ,  Hung Yi LIN ,  Jenchun CHEN

IPC分类号： H04R1/10

CPC分类号： H04R1/1016 ,  H04R1/1058 ,  H04R1/1091

摘要： The present disclosure provides a wearable component. The wearable component includes a first carrier and a first electronic component at least partially embedded within the first carrier. The first carrier and the first electronic component define a space configured for audio transmission. An ear tip and a method of manufacturing a wearable component are also provided.