公开(公告)号：US20070227893A1

公开(公告)日：2007-10-04

申请号：US11717773

申请日：2007-03-14

Applicant: Clement Saucy

Inventor： Clement Saucy

IPC: C25D5/02 ,  C25D1/00

CPC classification number: C25D1/003 ,  B81B2201/035 ,  B81C99/0085 ,  B81C2201/032 ,  C25D1/20 ,  G03F7/00

Abstract: The invention relates to a process for fabricating a monolayer or multilayer metal structure in LIGA technology, in which a photoresist layer is deposited on a flat metal substrate, a photoresist mold is created by irradiation or electron or ion bombardment, a metal or alloy is electroplated in this mold, the electroformed metal structure is detached from the substrate and the photoresist is separated from this metal structure, wherein the metal substrate is used as an agent involved in the forming of at least one surface of the metal structure other than that formed by the plane surface of the substrate.

Abstract translation: 本发明涉及一种在LIGA技术中制造单层或多层金属结构的方法，其中光致抗蚀剂层沉积在平坦的金属基底上，通过照射或电子或离子轰击产生光致抗蚀剂模具，电镀金属或合金 在该模具中，电铸金属结构与基板分离，并且光致抗蚀剂与该金属结构分离，其中金属基板用作形成金属结构的至少一个表面的试剂，而不是由 基板的平面。

公开(公告)号：US20060214105A1

公开(公告)日：2006-09-28

申请号：US11256213

申请日：2005-10-24

Applicant: Samuel Jaccard ,  Serguei Mikhailov ,  Frans Munnik

Inventor： Samuel Jaccard ,  Serguei Mikhailov ,  Frans Munnik

IPC: G01N23/00 ,  G21K7/00

CPC classification number: B81C1/00492 ,  B81C2201/032 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/201 ,  H01J37/3174 ,  H01J2237/31735 ,  H01J2237/31755 ,  H01J2237/31774 ,  H01J2237/31796 ,  Y10S430/143

Abstract: Ion beam lithography technique wherein a higher amount of radiation energy is deposited to predetermined regions in the bulk if a suitable substrate. By selecting the radiation nature, its energy and the irradiation parameters a structure can be created in the bulk of the material leaving the surface essentially untouched.

Abstract translation: 离子束光刻技术，其中如果合适的衬底，较高量的辐射能量沉积到本体中的预定区域。 通过选择辐射性质，其能量和照射参数，可以在离开表面基本上不变的材料的主体中产生结构。

公开(公告)号：US07105281B2

公开(公告)日：2006-09-12

申请号：US10492918

申请日：2002-10-25

Applicant: Jun Yorita ,  Yoshihiro Hirata ,  Tsuyoshi Haga

Inventor： Jun Yorita ,  Yoshihiro Hirata ,  Tsuyoshi Haga

IPC: G03F7/039

CPC classification number: B81C99/0085 ,  B81C2201/032 ,  C25D1/003 ,  H01L21/4821 ,  H05K3/202 ,  H05K3/205

Abstract: A method of manufacturing a metal microstructure by using a resin mold. In order to provide a method in which a mild manufacturing condition which causes less damage to the resin mold can be set and the high-precision metal microstructure can be mass-produced by uniform electroforming, the method of manufacturing the metal microstructure according to the present invention includes the steps of: fixing on a conductive substrate the resin mold having a vacant portion penetrating in the direction of thickness, by interposing a photosensitive polymer having a chemical composition changed by an electron beam, ultraviolet radiation or visible radiation so as to form a layered structure having the resin mold; exposing the layered structure having the resin mold to an electron beam, ultraviolet radiation or visible radiation; removing an exposed photosensitive polymer existing at the vacant portion of the resin mold; and filling with a metal the vacant portion of the layered structure having the resin mold by electroforming.

Abstract translation: 通过使用树脂模具制造金属微结构的方法。 为了提供一种可以设定对树脂模具造成较小损害的温和制造条件并且通过均匀电铸可以大量生产高精度金属微结构的方法，根据本发明的金属组织的制造方法 本发明包括以下步骤：通过插入具有由电子束，紫外线或可见光辐照的化学组成改变的光敏聚合物，将具有穿透厚度方向的空白部分的树脂模具固定在导电基板上，以形成 具有树脂模具的层状结构; 将具有树脂模具的层状结构暴露于电子束，紫外线辐射或可见光辐射; 去除存在于树脂模具的空缺部分的曝光的光敏聚合物; 并通过电铸将金属填充到具有树脂模具的层状结构的空
间部分。

公开(公告)号：US06572742B1

公开(公告)日：2003-06-03

申请号：US09488142

申请日：2000-01-20

Applicant: Adam L. Cohen

Inventor： Adam L. Cohen

IPC: C25D1706

CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method includes forming a layer, the forming of the layer includes: a) contacting a substrate with a first article, the first article includes a support and a conformable mask disposed in a pattern on the support; b) electroplating a first metal from a source of metal ions onto the substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the substrate. The method may further involve one or more of (1) selectively depositing or non-selectively depositing one or more additional materials to complete formation of the layer, (2) planarizing deposited material after each deposition or after all depositions for a layer, and/or (3) forming layers adjacent previously formed layers to build up a structure from a plurality of adhered layers. Electroplating articles and electroplating apparatus are also disclosed.

Abstract translation: 一种电镀方法包括形成层，所述层的形成包括：a）使基底与第一制品接触，所述第一制品包括以支持物的形式设置的支撑体和适形掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述衬底上，所述第一图案对应于所述适形掩模图案的所述补体; 以及c）从所述基底中去除所述第一制品。 该方法还可以包括以下一个或多个：（1）选择性地沉积或非选择性地沉积一种或多种附加材料以完成层的形成，（2）在每次沉积之后或在所有沉积之后平坦化沉积的材料，以及/ 或（3）形成与先前形成的层相邻的层，以从多个附着层建立结构。 还公开了电镀制品和电镀装置。

公开(公告)号：US06458263B1

公开(公告)日：2002-10-01

申请号：US09677041

申请日：2000-09-29

Applicant: Alfredo Martin Morales ,  Linda A. Domeier

Inventor： Alfredo Martin Morales ,  Linda A. Domeier

IPC: C25D502

CPC classification number: C25D1/003 ,  B81B2203/0118 ,  B81C1/00666 ,  B81C2201/019 ,  B81C2201/032 ,  C25D5/022 ,  G03F7/00 ,  G03F7/0035 ,  H01L21/76885

Abstract: In the formation of multilevel LIGA microstructures, a preformed sheet of photoresist material, such as polymethylmethacrylate (PMMA) is patterned by exposure through a mask to radiation, such as X-rays, and developed using a developer to remove the exposed photoresist material. A first microstructure is then formed by electroplating metal into the areas from which the photoresist has been removed. Additional levels of microstructure are added to the initial microstructure by covering the first microstructure with a conductive polymer, machining the conductive polymer layer to reveal the surface of the first microstructure, sealing the conductive polymer and surface of the first microstructure with a metal layer, and then forming the second level of structure on top of the first level structure. In such a manner, multiple layers of microstructure can be built up to allow complex cantilevered microstructures to be formed.

Abstract translation: 在形成多层LIGA微观结构时，通过将掩模曝光通过诸如X射线的辐射来形成预成型的光致抗蚀剂材料片，例如聚甲基丙烯酸甲酯（PMMA），并使用显影剂显影以除去曝光的光致抗蚀剂材料。 然后通过将金属电镀到已经从其去除光致抗蚀剂的区域中形成第一微结构。 通过用导电聚合物覆盖第一微结构，加工初始微结构，加工导电聚合物层以露出第一微结构的表面，用金属层密封导电聚合物和第一微结构的表面，并且 然后在第一级结构之上形成第二级结构。 以这种方式，可以建立多层微观结构以允许形成复杂的悬臂微结构。

公开(公告)号：US6027630A

公开(公告)日：2000-02-22

申请号：US055183

申请日：1998-04-03

Applicant: Adam L. Cohen

Inventor： Adam L. Cohen

IPC: B81C1/00 ,  B21C37/00 ,  C23F1/00 ,  C25D20060101 ,  C25D1/00 ,  C25D1/10 ,  C25D5/02 ,  C25D5/10 ,  C25D7/12 ,  C25D17/06 ,  C25D19/00 ,  C25D21/12 ,  H01L21/288 ,  H05K3/24

CPC classification number: C25D5/10 ,  B81C1/00126 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  H01L21/2885 ,  H05K3/241 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  Y10T428/12486 ,  Y10T428/239

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

公开(公告)号：US5985328A

公开(公告)日：1999-11-16

申请号：US14727

申请日：1998-01-28

Applicant: Wen-Hua Chu ,  Mauro Ferrari

Inventor： Wen-Hua Chu ,  Mauro Ferrari

IPC: A61K9/00 ,  A61K9/50 ,  A61K9/52 ,  B01D39/16 ,  B01D39/20 ,  B01D67/00 ,  B01D69/02 ,  B01D69/12 ,  B01D71/02 ,  B01J13/02 ,  B81B1/00 ,  B81C1/00 ,  C04B41/45 ,  C23C16/01 ,  G03F7/00 ,  B01D69/10 ,  C23F4/00

CPC classification number: B81C1/00087 ,  A61K9/0024 ,  A61K9/0097 ,  B01D39/1692 ,  B01D39/20 ,  B01D67/0058 ,  B01D67/0062 ,  B01D67/0072 ,  B01D69/02 ,  B01D69/12 ,  B01D71/02 ,  B01J13/02 ,  C04B41/4582 ,  C23C16/01 ,  G03F7/00 ,  G03F7/0015 ,  B01D2325/02 ,  B01D2325/04 ,  B81B2201/10 ,  B81C2201/014 ,  B81C2201/032

Abstract: A microfabricated containment capsule has a bulk substrate delimiting a cavity with a boundary, a first portion of which constitutes an inner wall of a solid portion of the bulk substrate. The bulk substrate also provides at a second portion of the boundary a membrane joined to one side of the bulk substrate, the membrane having at least one porous area with controlled pores.

Abstract translation: 微制造的容纳胶囊具有限定具有边界的空腔的体基底，该边界的第一部分构成本体基底的实心部分的内壁。 本体衬底还在边界的第二部分处提供连接到本体衬底的一侧的膜，所述膜具有至少一个具有受控孔的多孔区域。

公开(公告)号：US4661212A

公开(公告)日：1987-04-28

申请号：US903304

申请日：1986-09-03

Applicant: Wolfgang Ehrfeld ,  Peter Hagmann ,  Asim Maner ,  Dietrich Munchmeyer ,  Erwin Becker

Inventor： Wolfgang Ehrfeld ,  Peter Hagmann ,  Asim Maner ,  Dietrich Munchmeyer ,  Erwin Becker

IPC: C25D1/08 ,  B01D59/18 ,  B81C1/00 ,  C25D1/10

CPC classification number: B81C99/008 ,  C25D1/10 ,  B81C2201/0128 ,  B81C2201/032 ,  B81C2201/034

Abstract: In order to produce a plurality of plate shaped metal bodies containing a microstructure from a single molding tool constituting a master for the bodies, a negative mold is formed by filling the recesses in the microstructure of the tool with electrically insulating material and fastening to the insulating material an electrically conductive material which contacts the end faces of the microstructure of the tool.

Abstract translation: 为了从构成主体的主体的单个模具中生产包含微结构的多个板状金属体，通过用电绝缘材料填充工具的微观结构中的凹部并将其紧固到绝缘体上而形成负模具 材料是与工具的微结构的端面接触的导电材料。