Determining physical property of substrate
    71.
    发明授权
    Determining physical property of substrate 有权
    确定底物的物理性质

    公开(公告)号:US08014004B2

    公开(公告)日:2011-09-06

    申请号:US12822096

    申请日:2010-06-23

    CPC classification number: G01B11/0683 G01B11/0625 Y10S707/99936

    Abstract: A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.

    Abstract translation: 确定基板的物理性质的方法包括记录从基板获得的第一光谱,第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。 该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。 数据库中的每个光谱具有与之相关联的物理属性值。 该方法包括产生指示物理属性的第一值与第一频谱相关联的信号,第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。 用于确定基板的物理性质的系统包括抛光机,端点确定模块和数据库。

    METHOD, MEASURING ARRANGEMENT AND APPARATUS FOR OPTICALLY MEASURING BY INTERFEROMETRY THE THICKNESS OF AN OBJECT
    72.
    发明申请
    METHOD, MEASURING ARRANGEMENT AND APPARATUS FOR OPTICALLY MEASURING BY INTERFEROMETRY THE THICKNESS OF AN OBJECT 审中-公开
    方法,测量装置和设备通过干涉测量物体的厚度进行光学测量

    公开(公告)号:US20110210691A1

    公开(公告)日:2011-09-01

    申请号:US13127462

    申请日:2009-11-13

    CPC classification number: G01B11/06 G01B11/0625

    Abstract: Method, measuring arrangement (23;26;27) and apparatus (1) for optically measuring by interferometry the thickness of an object (2) having an external surface (16) and an internal surface (17) opposite with respect to the external surface. A low coherence beam of radiations (I) is emitted, such beam being composed of a number of wavelengths within a band determined, by means of radiation sources (4a,4b;4c,4d;4ef) which can alternatively employ at least two different radiation beams belonging to differentiated bands, as depending on the thickness of the object, or a single wide band radiation source. The radiation beam is directed onto the external surface of the object by means of an optical probe (6). The radiations (R) that are reflected by the object are caught by means of the optical probe. By means of spectrometers (5;5a,5b;5d,5e;5f,5g) it is possible to analyze the spectrum of the result of the interference between radiations (R1) that are reflected by the external surface without entering the object and radiations (R2) that are reflected by the internal surface entering the object; and the thickness of the object is determined as a function of the spectrum provided by the spectrometers. The two spectrometers can be alternatively used for radiations belonging to each of said differentiated bands.

    Abstract translation: 方法,测量装置(23; 26; 27)和装置(1),用于通过干涉测量具有外表面(16)和相对于外表面相对的内表面(17)的物体(2)的厚度进行光学测量 。 发射低相干光束(I),这样的光束由通过辐射源(4a,4b; 4c,4d; 4ef)确定的波段内的多个波长组成,辐射源可以替代地使用至少两种不同的 属于微分带的辐射束,取决于物体的厚度,或单个宽带辐射源。 辐射束通过光学探针(6)被引导到物体的外表面上。 由物体反射的辐射(R)通过光学探针被捕获。 通过光谱仪(5; 5a,5b; 5d,5e; 5f,5g),可以分析由外表面反射而不进入物体和辐射的辐射(R1)之间的干涉结果的光谱 (R2),其被进入物体的内表面反射; 并且根据由光谱仪提供的光谱确定物体的厚度。 两个光谱仪可以替代地用于属于每个所述差分带的辐射。

    MONITORING APPARATUS AND METHOD FOR UNIFORMITY AND RESIDUAL THICKNESS OF NANO-TRANSFER PRINTING PROCESS
    74.
    发明申请
    MONITORING APPARATUS AND METHOD FOR UNIFORMITY AND RESIDUAL THICKNESS OF NANO-TRANSFER PRINTING PROCESS 审中-公开
    监测装置和纳米转印印刷工艺的均匀和残留厚度的方法

    公开(公告)号:US20110134440A1

    公开(公告)日:2011-06-09

    申请号:US12959354

    申请日:2010-12-02

    CPC classification number: G01B11/0625

    Abstract: The monitoring apparatus for uniformity and residual thickness of nano-transfer printing process is installed at a specific location in the surrounding of a transfer printing unit, and, during any stage of the transfer printing process, performs monitoring or measuring the forming rate and forming profile of the forming material inside the transfer printing unit. The monitoring apparatus includes a detection unit, a measuring unit and an analysis unit. The detection unit emits a detection ray to the transfer printing unit. The measuring unit receives a reaction signal of the detection ray passing through the transfer printing unit. The analysis unit analyzes the reaction signal to determine transfer uniformity and the material residual thickness in the transfer print unit.

    Abstract translation: 纳米转印印刷工艺的均匀性和残留厚度的监控装置安装在转印印刷单元的周围的特定位置,并且在转印印刷过程的任何阶段期间,执行监测或测量成型速率和形成轮廓 的转印印刷单元内的成形材料。 监视装置包括检测单元,测量单元和分析单元。 检测单元向转印单元发出检测光线。 测量单元接收通过转印机的检测光线的反应信号。 分析单元分析反应信号以确定转印单元中的转印均匀性和材料残留厚度。

    Optical Metrology On Textured Samples
    75.
    发明申请
    Optical Metrology On Textured Samples 有权
    光学测量在纹理样品

    公开(公告)号:US20110096339A1

    公开(公告)日:2011-04-28

    申请号:US12607970

    申请日:2009-10-28

    Applicant: Ira Naot

    Inventor: Ira Naot

    CPC classification number: G01B11/02 G01B11/06 G01B11/0625 G01N21/55

    Abstract: One or more parameters of a sample that includes a textured substrate and one or more overlying films is determined using, e.g., an optical metrology device to direct light to be incident on the sample and detecting light after the incident light interacts with the sample. The acquired data is normalized using reference data that is produced using a textured reference sample. The normalized data is then fit to simulated data that is associated with a model having an untextured substrate and one or more variable parameters. The value(s) of the one or more variable parameters from the model associated with the simulated data having the best fit is reported as measurement result.

    Abstract translation: 使用例如光学测量装置来确定包括纹理化衬底和一个或多个重叠膜的样品的一个或多个参数,以引导光入射到样品上并且在入射光与样品相互作用之后检测光。 使用使用纹理参考样本产生的参考数据对所获取的数据进行归一化。 然后将归一化数据拟合到与具有未纹理化衬底和一个或多个可变参数的模型相关联的模拟数据。 来自与具有最佳拟合的模拟数据相关联的模型的一个或多个可变参数的值被报告为测量结果。

    PAINTING STATION COMPRISING A MEASURING CELL FOR MEASURING THE LAYER THICKNESS
    76.
    发明申请
    PAINTING STATION COMPRISING A MEASURING CELL FOR MEASURING THE LAYER THICKNESS 有权
    包含用于测量层厚度的测量单元的绘画站

    公开(公告)号:US20110094444A1

    公开(公告)日:2011-04-28

    申请号:US12937022

    申请日:2009-03-11

    Abstract: A painting station, e.g., for serially painting components such as motor vehicles, is disclosed. A painting station may include at least one painting cell in which components are coated, e.g., with a paint, that has a certain layer thickness. At least one measuring cell is provided for measuring the layer thickness of the paint, e.g., with a radiation source, a radiation detector, and a conveying path along which the components to be coated are conveyed through the painting and measuring cells. The radiation source may emit light in the visible wavelength range.

    Abstract translation: 公开了一种涂装工位,例如用于串联涂漆诸如机动车辆的部件。 涂装台可以包括至少一个涂漆单元,其中涂覆有成分的组分,例如涂料,其具有一定的层厚度。 提供至少一个测量单元,用于测量涂料的层厚度,例如用辐射源,辐射检测器和输送路径,待涂覆的组分沿着输送路径输送通过涂装和测量单元。 辐射源可以发射可见光波长范围的光。

    Processing waveform-based NDE
    77.
    发明授权
    Processing waveform-based NDE 有权
    处理基于波形的NDE

    公开(公告)号:US07933027B1

    公开(公告)日:2011-04-26

    申请号:US12326436

    申请日:2008-12-02

    Applicant: Donald J Roth

    Inventor: Donald J Roth

    CPC classification number: G01N21/3581 G01B11/0625 G01J3/42 G01N21/3563

    Abstract: A computer implemented process for simultaneously measuring the velocity of terahertz electromagnetic radiation in a dielectric material sample without prior knowledge of the thickness of the sample and for measuring the thickness of a material sample using terahertz electromagnetic radiation in a material sample without prior knowledge of the velocity of the terahertz electromagnetic radiation in the sample is disclosed and claimed. Utilizing interactive software the process evaluates, in a plurality of locations, the sample for microstructural variations and for thickness variations and maps the microstructural and thickness variations by location. A thin sheet of dielectric material may be used on top of the sample to create a dielectric mismatch. The approximate focal point of the radiation source (transceiver) is initially determined for good measurements.

    Abstract translation: 一种计算机实现的过程,用于同时测量电介质材料样品中的太赫兹电磁辐射的速度,而不预先了解样品的厚度,并且在材料样品中使用太赫兹电磁辐射测量材料样品的厚度,而无需预先知道速度 的公开和要求保护的样品中的太赫兹电磁辐射。 利用交互式软件,该过程在多个位置评估用于微结构变化和厚度变化的样品,并且通过位置映射微结构和厚度变化。 可以在样品的顶部使用薄的电介质材料以产生介电失配。 最初确定辐射源(收发器)的近似焦点用于良好的测量。

    METHOD OF AND DEVICE FOR DETERMINING AND CONTROLLING THE DISTANCE BETWEEN AN INTEGRATED CIRCUIT AND A SUBSTRATE
    78.
    发明申请
    METHOD OF AND DEVICE FOR DETERMINING AND CONTROLLING THE DISTANCE BETWEEN AN INTEGRATED CIRCUIT AND A SUBSTRATE 有权
    用于确定和控制集成电路与基板之间的距离的方法和装置

    公开(公告)号:US20100323459A1

    公开(公告)日:2010-12-23

    申请号:US12745465

    申请日:2008-11-25

    Applicant: Christian Zenz

    Inventor: Christian Zenz

    CPC classification number: G01B11/0625

    Abstract: In a method of determining the distance (d) between an integrated circuit (1) and a substrate (2) emitted light enters the at least semi transparent substrate (2), passes through the substrate (2) and an at least semi transparent material (8), is reflected by the integrated circuit (1), passes again through the material (8) and the substrate (2), and leaves the substrate (2). The at least semi transparent material (8), particularly is an at least semi transparent adhesive, provided between the substrate (2) and the integrated circuit (1). The distance (d) between the substrate (2) and the integrated circuit (1) is determined by evaluating the intensities of the light leaving and entering the substrate (2), particularly by evaluating the ratio between the intensities of the light leaving and entering the substrate (2).

    Abstract translation: 在确定集成电路(1)和衬底(2)之间的距离(d)的方法中,发射的光进入至少半透明衬底(2),穿过衬底(2)和至少半透明材料 (8)被集成电路(1)反射,再次通过材料(8)和基板(2)离开基板(2)。 所述至少半透明材料(8)特别是设置在所述基板(2)和所述集成电路(1)之间的至少半透明粘合剂。 通过评估离开和进入衬底(2)的光的强度来确定衬底(2)和集成电路(1)之间的距离(d),特别是通过评估离开和进入的光的强度之间的比率 基板(2)。

    METHOD AND APPARATUS FOR THIN FILM QUALITY CONTROL
    79.
    发明申请
    METHOD AND APPARATUS FOR THIN FILM QUALITY CONTROL 审中-公开
    薄膜质量控制的方法和装置

    公开(公告)号:US20100220316A1

    公开(公告)日:2010-09-02

    申请号:US12775293

    申请日:2010-05-06

    Applicant: Moshe Finarov

    Inventor: Moshe Finarov

    Abstract: Photovoltaic thin film quality control is obtained where the thin film is supported by a support and a section of the film is illuminated by a polychromatic or monochromatic illumination source. The source forms on the thin film an illuminated line. The light collected from discrete sampled points located on the illuminated line is transferred to a photo-sensitive sensor through an optical switch. The spectral signal of the light reflected, transmitted or scattered by the sampled points is collected by the sensor, processed and photovoltaic thin film parameters applicable to the quality control are derived e.g. thin film thickness, index of refraction, extinction coefficient, absorption coefficient, energy gap, conductivity, crystallinity, surface roughness, crystal phase, material composition and photoluminescence spectrum and intensity. Manufacturing equipment parameters influencing the material properties may be changed to provide a uniform thin film layer with pre-defined properties.

    Abstract translation: 获得光电薄膜质量控制,其中薄膜由支撑体支撑并且膜的一部分被多色或单色照明源照射。 源在薄膜上形成一条照明线。 从位于照明线上的离散采样点收集的光通过光学开关转移到光敏传感器。 由采样点反射,传播或散射的光的光谱信号由传感器收集,处理和适用于质量控制的光伏薄膜参数例如被导出。 薄膜厚度,折射率,消光系数,吸收系数,能隙,导电率,结晶度,表面粗糙度,结晶相,材料组成和光致发光光谱和强度。 可以改变影响材料性能的制造设备参数,以提供具有预定特性的均匀薄膜层。

    Optical stacked structure inspecting method and optical stacked structure inspecting apparatus
    80.
    发明授权
    Optical stacked structure inspecting method and optical stacked structure inspecting apparatus 失效
    光学层叠结构检查方法和光学堆叠结构检查装置

    公开(公告)号:US07692801B2

    公开(公告)日:2010-04-06

    申请号:US11415293

    申请日:2006-05-02

    Applicant: Yuki Nakamura

    Inventor: Yuki Nakamura

    CPC classification number: G01N21/9506 G01B11/0625

    Abstract: An inspecting method inspects an optical stacked structure having a reflection layer and at least one light transmitting thin film sequentially stacked on a substrate. The inspecting method irradiates inspection light on the optical stacked structure from a side provided with the light transmitting thin film, measures a light intensity of reflected light from each layer, that changes depending on a change in an optical path length to each layer, and inspects a thickness of the light transmitting thin film based on the light intensity of reflected light for a specific wavelength.

    Abstract translation: 检查方法检查具有反射层和顺序堆叠在基板上的至少一个透光薄膜的光学堆叠结构。 检查方法从设置有透光薄膜的一侧将检查光照射在光学堆叠结构上,测量每层反射光的光强度,其随着每层光程长度的变化而变化,并且检查 基于特定波长的反射光的光强度的透光薄膜的厚度。

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