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公开(公告)号：US09918386B2
公开(公告)日：2018-03-13
申请号：US15489563
申请日：2017-04-17
Applicant: Skyworks Solutions, Inc.
Inventor： Darren Roger Frenette , George Khoury , Leslie Paul Wallis , Lori Ann DeOrio
IPC: H05K1/18 , H01L23/488 , H04B1/40 , H03F3/195 , H03F3/213 , H03H7/06 , H01L25/18 , H01L23/31 , H01L23/00 , H01L23/66
CPC classification number: H05K1/181 , H01L23/3107 , H01L23/66 , H01L24/16 , H01L24/48 , H01L25/16 , H01L25/18 , H01L41/0475 , H01L41/113 , H01L2223/6644 , H01L2224/04042 , H01L2224/16225 , H01L2224/48091 , H01L2224/48106 , H01L2224/48195 , H01L2224/48225 , H01L2924/00014 , H01L2924/1421 , H01L2924/146 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/19105 , H01L2924/19107 , H03B5/32 , H03F3/195 , H03F3/213 , H03F2200/451 , H03H7/06 , H03H9/0547 , H03H2001/0021 , H04B1/40 , H05K2201/1006 , H05K2201/10098 , H05K2201/10674 , H01L2224/45099
Abstract: A packaged module for use in a wireless communication device has a substrate supporting an integrated circuit die that includes at least a microprocessor and radio frequency receiver circuitry and a stacked filter assembly configured as a filter circuit that is in communication with the radio frequency receiver circuitry. The stacked filter assembly includes a plurality of passive components, where each passive component is packaged as a surface mount device. At least one passive component is in direct communication with the substrate and at least another passive component is supported above the substrate by the at least one passive component that is in the direct communication with the substrate.
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公开(公告)号：US09893703B2
公开(公告)日：2018-02-13
申请号：US14869205
申请日：2015-09-29
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Young Ghyu Ahn , Byoung Hwa Lee , Min Cheol Park
IPC: H03H7/01 , H01G4/40 , H01F17/00 , H01G4/30 , H01G4/35 , H01G4/012 , H01G4/232 , H05K1/02 , H03H1/00
CPC classification number: H03H7/0115 , H01F17/00 , H01F17/0013 , H01F27/292 , H01G4/012 , H01G4/232 , H01G4/30 , H01G4/35 , H01G4/40 , H03H7/1766 , H03H2001/0085 , H05K1/0233 , H05K2201/1006
Abstract: A multilayer electronic component includes a body including one or more ceramic layers or magnetic layers; an inductor part including coil portions disposed in the body to be perpendicular to a lower surface of the body; a plurality of internal electrodes disposed in the body to be perpendicular to the lower surface of the body; and an input terminal, an output terminal, and a ground terminal disposed on the lower surface of the body. The body includes a first capacitor part and a second capacitor part having different levels of capacitance. The first and second capacitor parts each include at least two among the plurality of internal electrodes and at least one of the ceramic layers or magnetic layers is interposed therebetween.
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公开(公告)号：US20170303400A1
公开(公告)日：2017-10-19
申请号：US15489563
申请日：2017-04-17
Applicant: Skyworks Solutions, Inc.
Inventor： Darren Roger Frenette , George Khoury , Leslie Paul Wallis , Lori Ann DeOrio
IPC: H05K1/18 , H01L23/00 , H01L25/18 , H01L23/31 , H04B1/40 , H03F3/195 , H03F3/213 , H01L23/66 , H03H7/06
CPC classification number: H05K1/181 , H01L23/3107 , H01L23/66 , H01L24/16 , H01L24/48 , H01L25/16 , H01L25/18 , H01L41/0475 , H01L41/113 , H01L2223/6644 , H01L2224/04042 , H01L2224/16225 , H01L2224/48091 , H01L2224/48106 , H01L2224/48195 , H01L2224/48225 , H01L2924/00014 , H01L2924/1421 , H01L2924/146 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/19105 , H01L2924/19107 , H03B5/32 , H03F3/195 , H03F3/213 , H03F2200/451 , H03H7/06 , H03H9/0547 , H03H2001/0021 , H04B1/40 , H05K2201/1006 , H05K2201/10098 , H05K2201/10674 , H01L2224/45099
Abstract: A packaged module for use in a wireless communication device has a substrate supporting an integrated circuit die that includes at least a microprocessor and radio frequency receiver circuitry and a stacked filter assembly configured as a filter circuit that is in communication with the radio frequency receiver circuitry. The stacked filter assembly includes a plurality of passive components, where each passive component is packaged as a surface mount device. At least one passive component is in direct communication with the substrate and at least another passive component is supported above the substrate by the at least one passive component that is in the direct communication with the substrate.
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公开(公告)号：US20170117876A1
公开(公告)日：2017-04-27
申请号：US15301942
申请日：2015-04-02
Applicant: Samsung Electronics Co., Ltd
Inventor： Jae Sub Youn
CPC classification number: H03H11/04 , H01R13/6485 , H03H7/06 , H05K1/0216 , H05K1/0259 , H05K2201/1006
Abstract: An electronic device comprises: a first signal line configured to transmit a noise signal; a filter configured to transmit at least part of the noise signal from the first signal line; and a second signal line configured to transmit the at least part of the noise signal transmitted via the filter, wherein both ends of the filter are connected to the first signal line and the second signal line.
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公开(公告)号：US20160380606A1
公开(公告)日：2016-12-29
申请号：US14754241
申请日：2015-06-29
Applicant: Analog Devices Global
Inventor： Aldrick S. Limjoco , Michael Cusack , Donal G. O'Sullivan , Patrick John Meehan , Thomas Conway
IPC: H03H7/01 , H01L23/31 , H01L23/552 , H01L25/16 , H05K1/11 , H05K3/30 , H05K3/28 , H05K1/18 , H05K1/02 , H05K7/06 , H01L23/495
CPC classification number: H05K1/111 , H01L23/3107 , H01L23/49541 , H01L23/49575 , H01L23/552 , H01L25/16 , H01L2224/48247 , H01L2924/19105 , H05K1/0218 , H05K1/181 , H05K3/284 , H05K3/303 , H05K2201/1003 , H05K2201/1006
Abstract: An integrated electronic component assembly can include an electrically-conductive structure comprising two or more electrically-conductive terminals accessible on an exterior of the integrated electronic component assembly, a first component attachment region for a first component within the integrated electronic component assembly, and a second component attachment region for a second component within the integrated electronic component assembly. The integrated electronic component assembly can include an electrically-conductive magnetically-permeable shield coupled to or defined by the electrically-conductive structure, the electrically-conductive magnetically-permeable shield located between the first and second component attachment regions, including a portion extending in a direction out of a plane defined by the first and second component attachment regions, to suppress magnetic coupling between the first and second components.
Abstract translation: 集成电子部件组件可以包括导电结构，其包括可在集成电子部件组件的外部上接近的两个或更多个导电端子，用于集成电子部件组件内的第一部件的第一部件附接区域和第二部件附接区域 用于集成电子部件组件内的第二部件的部件附接区域。 集成电子部件组件可以包括耦合到导电结构或由导电结构限定的导电导磁屏蔽件，位于第一和第二部件附接区域之间的导电导磁屏蔽件，包括在 方向离开由第一和第二部件附接区域限定的平面，以抑制第一和第二部件之间的磁耦合。
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Patent Agency Ranking
公开(公告)号：US09490766B2
公开(公告)日：2016-11-08
申请号：US14180119
申请日：2014-02-13
Applicant: UT-Battelle, LLC
Inventor： Roger Allen Kisner , David Lee Fugate
CPC classification number: H03H1/0007 , H03H7/0115 , H03H2001/0021 , H03H2001/0028 , H05K1/0209 , H05K1/0233 , H05K3/0061 , H05K2201/09972 , H05K2201/1006 , H05K2201/10219
Abstract: Electromagnetic interference (EMI) noise filter embodiments and methods for filtering are provided herein. EMI noise filters include multiple signal exclusion enclosures. The multiple signal exclusion enclosures contain filter circuit stages. The signal exclusion enclosures can attenuate noise generated external to the enclosures and/or isolate noise currents generated by the corresponding filter circuits within the enclosures. In certain embodiments, an output of one filter circuit stage is connected to an input of the next filter circuit stage. The multiple signal exclusion enclosures can be chambers formed using conductive partitions to divide an outer signal exclusion enclosure. EMI noise filters can also include mechanisms to maintain the components of the filter circuit stages at a consistent temperature. For example, a metal base plate can distribute heat among filter components, and an insulating material can be positioned inside signal exclusion enclosures.
Abstract translation: 本文提供电磁干扰（EMI）噪声滤波器实施例和滤波方法。 EMI噪声滤波器包括多个信号排除外壳。 多信号排除外壳包含滤波电路级。 信号排除外壳可以衰减外壳产生的噪声和/或隔离由外壳内的相应的滤波器电路产生的噪声电流。 在某些实施例中，一个滤波器电路级的输出连接到下一个滤波器电路级的输入端。 多个信号排除外壳可以是使用导电隔板形成的腔室，以分隔外部信号排除罩。 EMI噪声滤波器还可以包括将滤波器电路的部件级保持在恒定温度的机构。 例如，金属基板可以在过滤器部件之间分配热量，并且绝缘材料可以位于信号排除外壳内。
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公开(公告)号：US09270322B2
公开(公告)日：2016-02-23
申请号：US14006997
申请日：2012-03-12
Applicant: Florian Pivit
Inventor： Florian Pivit
CPC classification number: H04B1/44 , H01P1/213 , H01P1/2135 , H01P1/2136 , H01P3/121 , H01P5/12 , H01P11/00 , H03H7/463 , H05K1/0218 , H05K1/0243 , H05K2201/0723 , H05K2201/1006 , H05K2203/1572 , Y10T29/49147
Abstract: A printed circuit board 100 for forming a diplexer circuit 200 comprising a first connector 110 for connecting a first filter 112 and second connector 120 for connecting a second filter 122, wherein the first connector 110 and the second connector 120 are located on opposite sides of the printed circuit board 100.
Abstract translation: 一种用于形成双工器电路200的印刷电路板100，包括用于连接第一过滤器112的第一连接器110和用于连接第二过滤器122的第二连接器120，其中第一连接器110和第二连接器120位于 印刷电路板100。
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公开(公告)号：US09252476B2
公开(公告)日：2016-02-02
申请号：US14057000
申请日：2013-10-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Syuichi Onodera
CPC classification number: H01P5/12 , H03H9/0566 , H04M1/0202 , H05K1/0227 , H05K1/0233 , H05K1/0243 , H05K1/113 , H05K2201/09618 , H05K2201/1006
Abstract: In a circuit module, even if a transmission signal output from a transmission electrode of a mounting substrate to a transmission terminal of a splitter leaks into a ground electrode, the transmission signal that has leaked into the ground electrode flows into via conductors that are connected along an edge portion of the ground electrode close to the transmission electrode and connected to a ground line of a motherboard. Therefore, the transmission signal that has been output from the transmission electrode and leaked into the ground electrode is prevented from traveling along an edge portion of the ground electrode toward a reception electrode side. Thus, characteristics of isolation between the transmission electrode and the reception electrode provided on the mounting substrate on which the splitter is mounted are improved.
Abstract translation: 在电路模块中，即使从安装基板的发送电极输出到分路器的发送端子的发送信号泄漏到接地电极中，泄漏到接地电极的发送信号流入通过导体连接的通路 接地电极的边缘部分靠近传输电极并连接到母板的接地线。 因此，防止从发送电极输出并漏入接地电极的发送信号沿着接地电极的边缘部朝向接收电极侧行进。 因此，改善了在安装有分离器的安装基板上设置的传输电极和接收电极之间的隔离特性。
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公开(公告)号：US20150334822A1
公开(公告)日：2015-11-19
申请号：US14760900
申请日：2014-01-09
Applicant: NSK LTD.
Inventor： Naoto SHINKAWA , Shigeru FUKINUKI
CPC classification number: H05K1/0231 , B62D5/0406 , H01L2224/4103 , H01L2924/00014 , H05K1/0233 , H05K1/0298 , H05K1/115 , H05K1/141 , H05K1/162 , H05K1/18 , H05K2201/042 , H05K2201/097 , H05K2201/1006 , H01L2224/37099
Abstract: There is provided a printed circuit substrate and a noise suppression structure capable of minimizing constraint on a component layout on a substrate and suppressing noise. The printed circuit substrate includes conductive patterns of odd numbered layers and conductive patterns of even numbered layers which are alternately arranged in a vertical direction and hold an insulating layer between each layer. Portions excepting predetermined areas for connecting a first through-hole and predetermined areas for insulating from a second through-hole in the conductive patterns of the odd numbered layers have a same shape as portions excepting predetermined areas for connecting the second through-hole and predetermined areas for insulating the first through-hole in the conductive patterns of the even numbered layers, and the portions are laminated on one another at the same position in the vertical direction.
Abstract translation: 提供了能够最小化对基板上的部件布局的约束并抑制噪声的印刷电路基板和噪声抑制结构。 印刷电路基板包括偶数层的导电图案和偶数层的导电图案，其在垂直方向上交替布置并且在每层之间保持绝缘层。 除了用于连接第一通孔的预定区域和用于与奇数层的导电图案中的第二通孔绝缘的预定区域之外的部分具有与用于连接第二通孔和预定区域的预定区域之外的部分相同的形状 用于绝缘偶数层的导电图案中的第一通孔，并且这些部分在垂直方向上的相同位置彼此层叠。
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公开(公告)号：US20150116892A1
公开(公告)日：2015-04-30
申请号：US14257806
申请日：2014-04-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Min Cheol PARK , Sang Soo PARK
CPC classification number: H01G4/40 , H01G2/06 , H01G4/232 , H01G4/30 , H05K1/0231 , H05K1/111 , H05K3/3442 , H05K2201/10015 , H05K2201/10022 , H05K2201/1006 , H05K2201/10636 , Y02P70/611
Abstract: A multilayer ceramic capacitor may include: a ceramic body including a plurality of dielectric layers; a capacitor part including a first internal electrode formed in the ceramic body and a second internal electrode formed in the ceramic body; a resistor part including a first internal connection conductor formed in the ceramic body and a second internal connection conductor formed in the ceramic body; a first dummy electrode formed in the ceramic body and a second dummy electrode formed in the ceramic body; and first to sixth external electrodes and the first and second internal connection conductors. The capacitor part and the resistor part may be connected in series to each other.
Abstract translation: 多层陶瓷电容器可以包括：陶瓷体，其包括多个电介质层; 电容器部分，包括形成在陶瓷体中的第一内部电极和形成在陶瓷体中的第二内部电极; 电阻部分，包括形成在陶瓷体中的第一内部连接导体和形成在陶瓷体中的第二内部连接导体; 形成在陶瓷体中的第一虚拟电极和形成在陶瓷体中的第二虚拟电极; 以及第一至第六外部电极以及第一和第二内部连接导体。 电容器部分和电阻器部分可以彼此串联连接。
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