公开(公告)号：US3437882A

公开(公告)日：1969-04-08

申请号：US3437882D

申请日：1966-01-14

Applicant: TEXAS INSTRUMENTS INC

Inventor： CAYZER JOHN ANTHONY

IPC: H05K1/14 ,  H05K3/30 ,  H05K3/36 ,  H02B1/04

CPC classification number: H05K1/14 ,  H01R12/52 ,  H05K3/308 ,  H05K3/366 ,  H05K2201/044 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/1053 ,  H05K2201/10765 ,  H05K2201/10946 ,  H05K2201/10962

公开(公告)号：US3287795A

公开(公告)日：1966-11-29

申请号：US37301464

申请日：1964-06-05

Applicant: WESTERN ELECTRIC CO

Inventor： CHAMBERS EDWIN G ,  FISHER KENNETH W

IPC: H01F27/02 ,  H01R12/18 ,  H01R12/22 ,  H05K1/18

CPC classification number: H05K1/182 ,  H01F27/027 ,  H05K2201/10295 ,  H05K2203/1316 ,  Y10T29/49172

公开(公告)号：US3257537A

公开(公告)日：1966-06-21

申请号：US31877563

申请日：1963-10-21

Applicant: RESOURCES AND FACILITIES CORP

Inventor： WILLIAM CLARK GEOFFREY

IPC: H05K1/00 ,  H05K3/04 ,  H05K3/40

CPC classification number: H05K3/4015 ,  H05K1/0284 ,  H05K3/04 ,  H05K2201/09063 ,  H05K2201/10053 ,  H05K2201/10295 ,  H05K2203/1189 ,  Y10T29/49155

公开(公告)号：US3205297A

公开(公告)日：1965-09-07

申请号：US21462962

申请日：1962-08-03

Applicant: THOMPSON RAMO WOOLDRIDGE INC

Inventor： BROCK BERT D

IPC: H05K3/32

CPC classification number: H05K3/328 ,  H01R12/58 ,  H05K2201/10295 ,  H05K2201/10303 ,  H05K2201/10916 ,  H05K2201/10962 ,  H05K2203/0495

公开(公告)号：US3162788A

公开(公告)日：1964-12-22

申请号：US7720060

申请日：1960-12-20

Applicant: IBM

Inventor： ALLEN LESLIE J ,  LORENZ EDWARD J ,  RICHARDSON WILLIAM J

IPC: H01R12/70 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01R12/7076 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/10295 ,  H05K2201/10454 ,  H05K2201/10606

公开(公告)号：US2966652A

公开(公告)日：1960-12-27

申请号：US64549257

申请日：1957-03-12

Applicant: BURROUGHS CORP

Inventor： JOHN PARSTORFER

IPC: H05K3/34 ,  H05K3/40

CPC classification number: H01R12/526 ,  H05K3/3447 ,  H05K3/4046 ,  H05K2201/10295

公开(公告)号：US11904073B2

公开(公告)日：2024-02-20

申请号：US17975245

申请日：2022-10-27

Applicant: Verily Life Sciences LLC

Inventor： Alexander Loo ,  Damiano Patron ,  Matthew Page

IPC: A61N1/02 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H01G4/005 ,  H01G4/018 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01G4/224 ,  H01G4/228 ,  H01G4/236 ,  A61L31/02 ,  H01R4/02 ,  H01R4/60 ,  H01R43/02 ,  H05K3/32 ,  H01R4/04 ,  H01Q1/27 ,  H01Q23/00 ,  H01R12/53

CPC classification number: A61L31/026 ,  H01Q1/273 ,  H01Q23/00 ,  H01R4/029 ,  H01R4/04 ,  H01R4/60 ,  H01R12/53 ,  H01R43/0256 ,  H05K1/18 ,  H05K3/0047 ,  H05K3/321 ,  H05K3/328 ,  H05K2201/10257 ,  H05K2201/10295 ,  H05K2203/049

Abstract: A biocompatible electrical connection includes a substrate; a ferrule having a concentric flange at a first end of the ferrule; a first adhesive; and a second adhesive. The first adhesive adheres a first surface of the concentric flange of the ferrule to a surface of the substrate. The second adhesive fills an annular space between a hole in the substrate and the ferrule. The first adhesive or the second adhesive forms a conductive path on the surface of the substrate between the ferrule and a circuit pattern on the substrate.

公开(公告)号：US10314164B1

公开(公告)日：2019-06-04

申请号：US15851195

申请日：2017-12-21

Applicant: Astec International Limited

Inventor： Edgardo Hernando Vergara ,  Adriane Cabral Ginez ,  Joel Cadiente Macadangdang

IPC: H05K1/02 ,  H01R12/58 ,  H01R12/71 ,  H01R12/70 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K1/0263 ,  H01R12/585 ,  H01R12/7064 ,  H01R12/718 ,  H05K3/301 ,  H05K3/3447 ,  H05K2201/10272 ,  H05K2201/10295 ,  H05K2201/1059 ,  H05K2203/1581

Abstract: According to some aspects of the present disclosure, circuit board assemblies are disclosed. Example circuit board assemblies include a printed circuit board having a first surface and a second surface, and defining an opening having at least one side extending from the first surface to the second surface. The assembly also includes a bus bar having a first surface, a second surface, and at least one side. The bus bar is secured in the opening of the printed circuit board via a press-fit, such that a slot is defined between the at least one side of the bus bar and the at least one side of the opening defined by the printed circuit board. The assembly further includes an electrical lead positioned in the slot, and solder disposed between the electrical lead and the bus bar to electrically couple the electrical lead and the bus bar.

公开(公告)号：US20190045631A1

公开(公告)日：2019-02-07

申请号：US16075044

申请日：2017-03-14

Applicant: SUMITOMO WIRING SYSTEMS, LTD.

Inventor： Tsuyoshi SAKITA

IPC: H05K1/14 ,  H01R12/71 ,  H01R4/02 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K1/14 ,  H01R4/02 ,  H01R12/716 ,  H05K1/141 ,  H05K1/144 ,  H05K1/18 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/306 ,  H05K3/34 ,  H05K2201/042 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/10295 ,  H05K2201/10303 ,  H05K2203/1484

Abstract: A method of this invention is for manufacturing a circuit board in which terminal fittings and electronic components are provided on a first surface of a main substrate that has the first surface and a second surface, a sub substrate that has a first surface and a second surface is arranged on the second surface side of the main substrate, and the sub substrate and the main substrate are connected by relay terminals. The main substrate and the sub substrate are formed in advance in a state of being connected in the same plane. During the method, the main and sub substrate are initially physical connected, at which time electrical components are attached to at least the main substrate. After physically separating the main and sub substrates, they are electrically connected.

公开(公告)号：US20180103536A1

公开(公告)日：2018-04-12

申请号：US15289426

申请日：2016-10-10

Applicant: Nidec Motor Corporation

Inventor： William Pickering ,  Bruce A. Nielsen

IPC: H05K1/02 ,  H01L23/367 ,  H01L23/498 ,  H05K1/18 ,  H05K5/00 ,  H01L25/07 ,  H05K1/03 ,  H01M10/42

CPC classification number: H05K1/0206 ,  H01L23/367 ,  H01L23/3737 ,  H01L23/4006 ,  H01L23/49827 ,  H01L23/49844 ,  H01L25/072 ,  H01M10/425 ,  H05K1/0209 ,  H05K1/0263 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/181 ,  H05K5/0008 ,  H05K5/0026 ,  H05K7/1432 ,  H05K7/20963 ,  H05K2201/0162 ,  H05K2201/066 ,  H05K2201/09036 ,  H05K2201/10037 ,  H05K2201/10166 ,  H05K2201/10189 ,  H05K2201/10272 ,  H05K2201/10295

Abstract: An electrical device configuration enables heat to be dissipated from a multi-layer printed circuit board (PCB) while handling electrical currents in excess of 200 amps. The semiconductor devices that convert input DC current to output AC current are mounted to a side of the PCB that is opposite the side of the PCB that receives the input DC current. A base plate that acts as a heat sink includes recessed areas to receive the semiconductor devices and enable the PCB to be positioned close to the base plate. Thermal vias are provided in the PCB to conductive heat from the semiconductor devices to the side of the PCB that receives the input current. Also, the busbars for receiving the input current are positioned to provide short resistive paths to the current to reduce the generation of heat by the current flowing in the PCB.