公开(公告)号：US20030047457A1

公开(公告)日：2003-03-13

申请号：US10266396

申请日：2002-10-08

发明人： Thomas G. Rukavina ,  Chia-Cheng Lin

IPC分类号： C25D005/00 ,  C25D005/02

CPC分类号： B64C1/1492 ,  B64C1/1484 ,  G02F1/155 ,  G02F1/163

摘要： A method for providing preferential coloring to a portion of an electrochromic window assembly, includes the steps of providing an electrochromic window assembly comprising first and second spaced apart transparent substrates defining a chamber therebetween, the first transparent substrate having a first conductive coating and the second transparent substrate having a second conductive coating, the chamber containing an electrochromic medium capable of coloring upon application of electrical potential thereto to provide reduced luminous transmittance; electrically connecting a plurality of first spaced facilities to the first conductive coating for providing the electrical potential to the first conductive coating; electrically connecting a plurality of second spaced facilities to the second conductive coating for providing the electrical potential to the second conductive coating; and applying an electrical current to selected ones of the plurality of first spaced facilities and to selected ones of the plurality of second spaced facilities to establish the electrical potential through a selected portion of the electrochromic medium such that the selected portion changes color and reduces its luminous transmittance.

摘要翻译： 一种用于向电致变色窗组件的一部分提供优选着色的方法包括提供电致变色窗组件的步骤，所述电致变色窗组件包括在其间限定室的第一和第二间隔开的透明衬底，所述第一透明衬底具有第一导电涂层， 具有第二导电涂层的基底，所述腔室包含能够在施加电位时着色的电致变色介质以提供降低的透光率; 将多个第一间隔开的设施电连接到第一导电涂层，以将电位提供给第一导电涂层; 将多个第二间隔设施电连接到第二导电涂层，以将电位提供给第二导电涂层; 以及将电流施加到所述多个第一间隔设施中的所选择的设备以及所述多个第二间隔设施中的选定的设备，以通过所述电致变色介质的选定部分建立电势，使得所选择的部分改变颜色并降低其发光 透光率。

公开(公告)号：US20030010643A1

公开(公告)日：2003-01-16

申请号：US09907258

申请日：2001-07-16

发明人： Daniel J. Gramarossa ,  Gary C. Downes

IPC分类号： C25D005/00 ,  C25D005/20 ,  C25D021/10 ,  C25D007/06 ,  C25D005/34

CPC分类号： H01L21/67748 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/67712 ,  H01L21/67718 ,  H01L21/67751 ,  H01L21/6776 ,  H01L21/6838 ,  H01L21/68707 ,  H01L21/68764

摘要： A method of processing wafers or other articles within a processing cell, entailing transporting a carrier supporting a vertically-oriented wafer horizontally through an inlet opening of a process cell, processing the vertically-oriented wafer within the process cell, and then transporting the carrier out of the process cell horizontally through an outlet opening of the process cell. In one exemplary implementation, the process performed within the cell is a pre-or post-treatment where the wafer is subjected to an acid solution treatment and/or a rinsing with de-ionized water treatment. In another exemplary implementation, the process performed within the process cell is an electroplating of the plating surface of the wafer. Additionally, a method of processing an empty carrier entailing transporting the carrier horizontally through an inlet opening of a process cell, processing the carrier within the process cell, and transporting the carrier out of the process cell horizontally through an outlet opening.

摘要翻译： 一种在处理单元内处理晶片或其它物品的方法，其需要将支撑垂直取向的晶片的载体水平地传送通过处理单元的入口，在处理单元内处理垂直取向的晶片，然后将载体输出 的过程单元水平地通过处理单元的出口。 在一个示例性实施方案中，在电池内进行的方法是经过或处理后处理，其中晶片经过酸溶液处理和/或用去离子水处理进行漂洗。 在另一示例性实施方案中，在处理单元内执行的处理是晶片的电镀表面的电镀。 另外，一种处理通过处理单元的入口水平传送载体的空载体的处理方法，处理过程单元内的载体，以及将载体从处理单元水平地通过出口开口输送出处理单元。

公开(公告)号：US20020185371A1

公开(公告)日：2002-12-12

申请号：US09876739

申请日：2001-06-07

发明人： Jason Ko

IPC分类号： C25D017/00 ,  C25D005/00

CPC分类号： C25D7/0642 ,  C25D7/0685

摘要： An electroplating apparatus includes a plurality of feeding rollers adapted to advance a sheet-shaped article, and a spraying unit. The spraying unit has a pair of upper and lower casings, each of which includes a casing body defining a chamber, and a net plate disposed to confront with the article. An electrolyte is sprayed from the chamber via meshes in the net plate and onto a side surface of the article. An anode current-conducting assembly includes a conducting net that is disposed fixedly within the chamber and that is superimposed on the net plate so as to cover the meshes in the net plate, and two conducting units respectively in electrical contact with two opposite side portions of the conducting net so as to supply electric current to the conducting net.

摘要翻译： 一种电镀设备包括适于推进片状物品的多个进给辊和喷射单元。 喷涂单元具有一对上下壳体，每个上壳体和下壳体包括限定腔室的壳体和设置成与物品相对的网板。 电解质通过网板中的网孔从该腔室喷射到制品的侧表面上。 阳极导电组件包括导电网，该导电网固定地设置在所述室内并且叠置在所述网板上以覆盖所述网板中的网孔;以及两个导电单元，其分别与所述网板的两个相对侧部分电接触 导电网，以便向导电网提供电流。

公开(公告)号：US20020157960A1

公开(公告)日：2002-10-31

申请号：US10178469

申请日：2002-06-24

申请人： Applied Materials, Inc.

发明人： Yezdi Dordi ,  Joe Stevens ,  Roy Edwards ,  Robert B. Lowrance ,  Michael Sugarman ,  Mark Denome

IPC分类号： C25D005/00 ,  C25D017/16 ,  C25D005/20 ,  C25D021/10 ,  C25C007/00

CPC分类号： H01L21/68721 ,  C25D5/20 ,  C25D7/123 ,  C25D17/001 ,  C25D17/004 ,  C25D17/005 ,  C25D17/08 ,  C25D21/00 ,  C25D21/18 ,  H01L21/67051 ,  H01L21/6715 ,  H01L21/6838 ,  H01L21/68742 ,  H01L21/68792

摘要： An apparatus and method for electro-chemically depositing a uniform metal layer onto a substrate is provided. In one aspect, the apparatus includes a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface. In another aspect, the apparatus further includes a dual catch-cup system having an electroplating solution catch-cup and a rinse catch-cup. The dual catch-cup system provides separation of the electroplating solution and the rinse solutions during processing and provides re-circulating systems for the different solutions of the electroplating system.

摘要翻译： 提供了一种用于将均匀金属层电化学沉积到基底上的装置和方法。 一方面，该装置包括连接到基板电镀表面的阴极，设置在基板支撑构件上方的阳极和供应流体连接阳极和基板电镀表面的电镀溶液的电镀溶液入口。 在另一方面，该装置还包括具有电镀溶液捕捉杯和冲洗捕捉杯的双捕获杯系统。 双捕捉杯系统在处理期间提供电镀溶液和冲洗溶液的分离，并为电镀系统的不同溶液提供再循环系统。

公开(公告)号：US20020139678A1

公开(公告)日：2002-10-03

申请号：US09866391

申请日：2001-05-24

发明人： Gregory J. Wilson ,  Paul R. McHugh ,  Robert A. Weaver ,  Thomas L. Ritzdorf

IPC分类号： C25D005/00 ,  C25C003/16 ,  C25D021/12 ,  C25B009/00

CPC分类号： C25D21/12 ,  C25D17/001 ,  C25F3/30

摘要： A facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber is described. The facility initially configures the electrical parameters in accordance with either a mathematical model of the processing chamber or experimental data derived from operating the actual processing chamber. After a workpiece is processed with the initial parameter configuration, the results are measured and a sensitivity matrix based upon the mathematical model of the processing chamber is used to select new parameters that correct for any deficiencies measured in the processing of the first workpiece. These parameters are then used in processing a second workpiece, which may be similarly measured, and the results used to further refine the parameters. In some embodiments, the facility analyzes a profile of the seed layer applied to a workpiece, and determines and communicates to a material deposition tool a set of control parameters designed to deposit material on the workpiece in a manner that compensates for deficiencies in the seed layer.

摘要翻译： 描述了一种用于选择和精炼用于在处理室中处理微电子工件的电参数的设备。 该设备最初根据处理室的数学模型或从操作实际处理室得到的实验数据来初始配置电参数。 在用初始参数配置处理工件之后，测量结果，并且使用基于处理室的数学模型的灵敏度矩阵来选择校正在第一工件的处理中测量的任何缺陷的新参数。 然后将这些参数用于处理可以类似地测量的第二工件，并且用于进一步改进参数的结果。 在一些实施例中，设备分析施加到工件的种子层的轮廓，并且确定并传送材料沉积工具一组控制参数，这些控制参数被设计成以补偿种子层中的缺陷的方式在工件上沉积材料 。

公开(公告)号：US20020098374A1

公开(公告)日：2002-07-25

申请号：US10014376

申请日：2001-10-26

发明人： Kazuhisa Fujiwara ,  Hiroshi Tan ,  Mitsuo Fujii ,  Masanobu Tsushima

IPC分类号： C25D001/04 ,  H05K003/10 ,  C25D005/00 ,  H05K003/02 ,  B32B003/00 ,  B21C037/00 ,  B32B007/00 ,  C25D007/04

CPC分类号： H05K3/384 ,  B32B15/01 ,  C22C18/00 ,  C25D5/10 ,  C25D5/48 ,  H05K2201/0355 ,  H05K2203/0723 ,  H05K2203/1105 ,  Y10T29/49155 ,  Y10T428/12438 ,  Y10T428/24917

摘要： This invention provides a copper foil for a printed wiring board, which comprises a copper foil, an alloy layer (A) comprising copper, zinc, tin and nickel which is formed on a surface of the copper foil, said surface to be brought into contact with a substrate for a printed wiring board, and a chromate layer which is formed on a surface of the alloy layer (A,. The copper foil for a printed wiring board has the following features: even if a printed wiring board is produced using a long-term stored copper foil, the interface between the copper foil and the substrate is only slightly corroded with chemicals; even if the copper foil contacts a varnish containing an organic acid, e.g., a varnish for an acrylic resin, in the formation of a copper-clad laminate, the bond strength is sufficient. Even if a printed circuit board made by using the copper foil is placed in a high temperature environment, e.g., in an engine room of an automobile, for a long period of time, blistering of the copper circuit from the substrate due to deterioration of the interface between the copper circuit and the substrate does not take place.

摘要翻译： 本发明提供一种用于印刷线路板的铜箔，其包括铜箔，形成在铜箔表面上的包含铜，锌，锡和镍的合金层（A），所述表面将被接触 具有用于印刷线路板的基板和形成在合金层（A）的表面上的铬酸盐层。印刷电路板用铜箔具有以下特征：即使使用 长期储存的铜箔，铜箔和基板之间的界面仅被化学物质轻微腐蚀;即使铜箔接触含有有机酸的清漆，例如用于丙烯酸树脂的清漆，形成 覆铜层压板，结合强度充分，即使将使用铜箔的印刷电路板放置在高温环境下，例如在汽车的发动机室中长时间放置， 铜 由于铜电路和基板之间的界面的劣化，基板的电路不会发生。

公开(公告)号：US20020086136A1

公开(公告)日：2002-07-04

申请号：US10021010

申请日：2001-12-19

发明人： Byung-sun Ahn ,  Dunaev Boris Nikolaevich ,  Smirnova Valentina Konstantinovna

IPC分类号： B32B003/10 ,  C25D005/00 ,  B32B001/00

CPC分类号： B41J2/1603 ,  B41J2/162 ,  B41J2/1625 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1642 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24331 ,  Y10T428/24355 ,  Y10T428/26

摘要： A nozzle plate assembly of micro-injecting device and a method for manufacturing the same in which a master plate which defines a nozzle region is dipped into an electrolyte in which NiH2/SO3/H, NiCl2, H3BO3, C12H25SO4/NaS and deionized water are mixed in a predetermined ratio. Then, current having a predetermined density is applied several times, to thereby form a nozzle plate having a plurality of nozzles. The nozzle plate so formed has different roughnesses at inner and outer surfaces, to thereby eliminate ink-crosstalk and the generation of air bubbles in the ink feed channel.

公开(公告)号：US20020079225A1

公开(公告)日：2002-06-27

申请号：US09984565

申请日：2001-10-30

发明人： Kouhei Shiba

IPC分类号： C25D005/00 ,  C25D021/12

CPC分类号： G01N15/1404 ,  G01N15/1031 ,  G01N2015/1411 ,  Y10T436/101666

摘要： An electrolyte solution for a particle measuring apparatus which comprises an inorganic salt, such as sodium chloride or calcium chloride, dissolved in an organic solvent. A substance that promotes dissolution of inorganic salts is added to provide the organic solvent with sufficient electric conductivity for electrical particle measurement. Such substances include either or both: Compound (a): a zwitterionic compound or compounds, and Compound (b): a compound or compounds including a hydroxyl group and a carboxyl or an amino group in the same molecule.

摘要翻译： 一种用于颗粒测量装置的电解质溶液，其包含溶解在有机溶剂中的无机盐如氯化钠或氯化钙。 加入促进无机盐溶解的物质，为有机溶剂提供足够的电导率用于电子粒子测量。 这些物质包括以下一种或两种：化合物（a）：两性离子化合物或化合物，和化合物（b）：在同一分子中包含羟基和羧基或氨基的化合物或化合物。

公开(公告)号：US20020074231A1

公开(公告)日：2002-06-20

申请号：US09977588

申请日：2001-10-13

申请人： Shipley Company, L.L.C.

发明人： Robert D. Mikkola ,  Jeffrey M. Calvert ,  Denis Morrisey

IPC分类号： C25D005/00 ,  C25D017/16 ,  C25D005/52 ,  C25D003/38

CPC分类号： H01L21/2885 ,  C25D3/38 ,  C25D7/12 ,  H05K3/241

摘要： Disclosed is a method of electroplating substrate such that small recessed features are completely filled with minimum thickness of the deposited metal over fields.

摘要翻译： 公开了一种电镀基板的方法，使得小的凹陷特征被完全填充有最小厚度的沉积金属。

公开(公告)号：US20020066671A1

公开(公告)日：2002-06-06

申请号：US09978797

申请日：2001-10-17

申请人： Shipley Company, L.L.C.

发明人： James G. Shelnut ,  David Merricks ,  Oleh B. Dutkewych ,  Charles R. Shipley

IPC分类号： C25D005/00 ,  C25D007/00 ,  C25D007/12

CPC分类号： H01L21/76868 ,  C23C18/1671 ,  C23C18/38 ,  C23C18/405 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/76843 ,  H01L21/76874 ,  H01L2221/1089 ,  H05K3/181 ,  H05K3/388 ,  H05K3/422 ,  Y10S205/916

摘要： Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures.

摘要翻译： 公开了在具有导电层的基板上沉积铜籽晶层的方法。 这种方法特别适用于在具有小孔径的基底上沉积铜籽晶层，并且优选地非常小的孔。