Measuring a Process Parameter for a Manufacturing Process Involving Lithography
    83.
    发明申请
    Measuring a Process Parameter for a Manufacturing Process Involving Lithography 审中-公开
    测量涉及平版印刷的制造工艺的工艺参数

    公开(公告)号:US20160349627A1

    公开(公告)日:2016-12-01

    申请号:US15117409

    申请日:2015-01-28

    Abstract: There is disclosed a method of measuring a process parameter for a manufacturing process involving lithography. In a disclosed arrangement the method comprises performing first and second measurements of overlay error in a region on a substrate, and obtaining a measure of the process parameter based on the first and second measurements of overlay error. The first measurement of overlay error is designed to be more sensitive to a perturbation in the process parameter than the second measurement of overlay error by a known amount.

    Abstract translation: 公开了一种测量涉及光刻的制造工艺的工艺参数的方法。 在公开的布置中,该方法包括对基板上的区域中的覆盖误差执行第一和第二测量,并且基于重叠误差的第一和第二测量值获得处理参数的度量。 重叠误差的第一次测量被设计为对过程参数中的扰动比已知量的覆盖误差的第二次测量更敏感。

    METROLOGY METHOD AND DEVICE
    84.
    发明申请

    公开(公告)号:US20250138436A1

    公开(公告)日:2025-05-01

    申请号:US18690961

    申请日:2022-08-16

    Abstract: Disclosed is a metrology method and associated devices. The method comprises obtaining a first image, said first image being subject to one or more non-isoplanatic aberrations of an optical system used to capture said image; and non-iteratively correcting said first image for the effect of said one or more non-isoplanatic aberrations by performing one or both of: a field non-isoplanatic correction operation in field space for said first image, said field space corresponding to a field plane of the optical system; and a pupil non-isoplanatic correction operation in pupil space for said first image, said pupil space corresponding to a pupil plane of the optical system. Said one or more non-isoplanatic aberrations comprise a class of non-isoplanatic aberrations describable as a convolution combined with an object distortion and/or a pupil distortion.

    Metrology Apparatus and a Method of Determining a Characteristic of Interest

    公开(公告)号:US20200218167A1

    公开(公告)日:2020-07-09

    申请号:US16826479

    申请日:2020-03-23

    Abstract: A metrology apparatus for and a method of determining a characteristic of interest relating to at least one structure on a substrate. The metrology apparatus comprises a sensor and an optical system. The sensor is for detecting characteristics of radiation impinging on the sensor. The optical system comprises an illumination path and a detection path. The optical system is configured to illuminate the at least one structure with radiation received from a source via the illumination path. The optical system is configured to receive radiation scattered by the at least one structure and to transmit the received radiation to the sensor via the detection path.

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