-
公开(公告)号：US20140084240A1
公开(公告)日：2014-03-27
申请号：US13625825
申请日：2012-09-24
申请人： Hsin-Hua Hu , Andreas Bibl , John A. Higginson
发明人： Hsin-Hua Hu , Andreas Bibl , John A. Higginson
IPC分类号： H01L33/04
CPC分类号： H01L21/52 , H01L21/6835 , H01L21/6836 , H01L24/83 , H01L24/93 , H01L24/95 , H01L25/0753 , H01L25/50 , H01L27/156 , H01L33/0079 , H01L33/40 , H01L2221/6835 , H01L2224/95136 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/00
摘要： A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
-
公开(公告)号：US08573508B2
公开(公告)日：2013-11-05
申请号：US12641203
申请日：2009-12-17
CPC分类号： H01L21/6715
摘要： A fluid ejection apparatus includes a substrate having a plurality of fluid passages for fluid flow and a plurality of nozzles fluidically connected to the fluid passages, a plurality of actuators positioned on top of the substrate to cause fluid in the plurality of fluid passages to be ejected from the plurality of nozzles, a housing component with a descending portion that projects down to the substrate, an integrated circuit chip supported on the substrate, a potting barrier secured to the housing component and positioned between the integrated circuit chip and the actuators, and a potting material between the integrated circuit chip and the barrier.
摘要翻译： 流体喷射装置包括具有多个用于流体流动的流体通道的基板和与流体通道流体连接的多个喷嘴;位于基板顶部的多个致动器，以使多个流体通道中的流体被弹出 从所述多个喷嘴中，具有向下突出到所述基板的下降部分的壳体部件，支撑在所述基板上的集成电路芯片，固定到所述壳体部件并且位于所述集成电路芯片和所述致动器之间的封装屏障，以及 封装材料之间的集成电路芯片和屏障。
-
83.发明授权公开(公告)号：US08518204B2
公开(公告)日：2013-08-27
申请号：US13436314
申请日：2012-03-30
CPC分类号： H01L24/83 , H01L21/67144 , H01L24/75 , H01L24/95 , H01L33/0079 , H01L33/46 , H01L2224/7598 , H01L2224/83 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , Y10T156/1153 , H01L2924/00
摘要： A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.
摘要翻译： 描述了将微器件和微器件阵列制造和传送到接收衬底的方法。 在一个实施例中，在蚀刻p-n二极管层以形成多个微p-n二极管期间，电绝缘层被用作蚀刻停止层。 在一个实施例中，在将微器件形成和传送到接收衬底期间，使用导电中间接合层。
-
公开(公告)号：US20130127020A1
公开(公告)日：2013-05-23
申请号：US13372277
申请日：2012-02-13
IPC分类号： H01L29/06
CPC分类号： H01L24/83 , B32B37/025 , B32B37/06 , B32B2457/20 , H01L21/67144 , H01L21/6833 , H01L24/75 , H01L24/95 , H01L24/97 , H01L2224/75725 , H01L2224/7598 , H01L2224/83005 , H01L2224/97 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/1421 , H01L2924/1431 , H01L2924/1434 , H01L2924/1461 , H01L2924/15153 , Y10T156/1153 , Y10T156/1707 , Y10T156/1744 , Y10T156/1749 , Y10T156/1776 , H01L2224/83 , H01L2924/00
摘要： A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate.
摘要翻译： 公开了一种微器件转印头和头阵列。 在一个实施例中，微器件转移头包括基底，具有侧壁的台面结构，形成在台面结构上的电极以及覆盖电极的电介质层。 可以将电压施加到微器件转移头和头阵列以从载体衬底拾取微器件并将微器件释放到接收衬底上。
-
公开(公告)号：US20130126891A1
公开(公告)日：2013-05-23
申请号：US13372222
申请日：2012-02-13
CPC分类号： H01L33/06 , F21V7/00 , H01L25/0753 , H01L27/15 , H01L29/0684 , H01L33/0079 , H01L33/04 , H01L33/20 , H01L33/28 , H01L33/30 , H01L2224/95
摘要： A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.
摘要翻译： 描述了微型发光二极管（LED）和形成用于传送到接收基板的微型LED阵列的方法。 微型LED结构可以包括微型p-n二极管和金属化层，金属化层位于微型p-n二极管和结合层之间。 保形介质阻挡层可以跨越微型p-n二极管的侧壁。 微型LED结构和微型LED阵列可以被拾取并转移到接收衬底。
-
公开(公告)号：US08377319B2
公开(公告)日：2013-02-19
申请号：US12027597
申请日：2008-02-07
申请人： Zhenfang Chen , Andreas Bibl , Paul A. Hoisington
发明人： Zhenfang Chen , Andreas Bibl , Paul A. Hoisington
IPC分类号： G01D15/00
CPC分类号： B41J2/1623 , B41J2/162 , B41J2/1628 , B41J2/1629 , B41J2/1632 , B41J2/1645
摘要： Techniques are provided for forming nozzles in a microelectromechanical device. The nozzles are formed in a layer prior to the layer being bonded onto another portion of the device. Forming the nozzles in the layer prior to bonding enables forming nozzles that have a desired depth and a desired geometry. Selecting a particular geometry for the nozzles can reduce the resistance to ink flow as well as improve the uniformity of the nozzles across the microelectromechanical device.
摘要翻译： 提供了用于在微机电装置中形成喷嘴的技术。 在将层粘合到装置的另一部分之前，喷嘴形成在一层中。 在接合之前在层中形成喷嘴可以形成具有期望深度和期望几何形状的喷嘴。 为喷嘴选择特定的几何形状可以降低油墨流动的阻力，并且提高喷嘴在整个微机电装置上的均匀性。
-
87.发明授权Micro device transfer head heater assembly and method of transferring a micro device 有权微型设备传送头加热器组件和传送微型设备的方法公开(公告)号：US08349116B1
公开(公告)日：2013-01-08
申请号：US13372422
申请日：2012-02-13
CPC分类号： H01L29/167 , B32B38/18 , H01L21/67144 , H01L24/75 , H01L24/83 , H01L24/95 , H01L24/97 , H01L25/0753 , H01L33/62 , H01L2224/75725 , H01L2224/7598 , H01L2224/83005 , H01L2224/97 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1421 , H01L2924/1431 , H01L2924/1434 , H01L2924/1461 , H01L2933/0066 , Y10T156/1153 , Y10T156/17 , Y10T156/1705 , Y10T156/1707 , Y10T156/1744 , Y10T156/1749 , Y10T156/1776 , Y10T156/1911 , H01L2224/83 , H01L2924/00
摘要： A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
摘要翻译： 公开了一种传送微型装置和微型装置阵列的方法。 承载连接到接合层的微型器件的载体衬底被加热到低于接合层的液相线温度的温度，并且转移头被加热到高于接合层的液相线温度的温度。 当微型装置与转印头接触时，来自转印头的热量转移到粘结层中以至少部分地熔化粘结层。 施加到转印头的电压产生从载体衬底拾取微器件的夹持力。
-
公开(公告)号：US08333860B1
公开(公告)日：2012-12-18
申请号：US13372310
申请日：2012-02-13
CPC分类号： H01L24/83 , B32B37/025 , B32B37/06 , B32B2457/20 , H01L21/67144 , H01L21/6833 , H01L24/75 , H01L24/95 , H01L24/97 , H01L2224/75725 , H01L2224/7598 , H01L2224/83005 , H01L2224/97 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/1421 , H01L2924/1431 , H01L2924/1434 , H01L2924/1461 , H01L2924/15153 , Y10T156/1153 , Y10T156/1707 , Y10T156/1744 , Y10T156/1749 , Y10T156/1776 , H01L2224/83 , H01L2924/00
摘要： A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate.
摘要翻译： 公开了一种微器件转印头和头阵列。 在一个实施例中，微器件转移头包括基底，具有侧壁的台面结构，形成在台面结构上的电极以及覆盖电极的电介质层。 可以将电压施加到微器件转移头和头阵列以从载体衬底拾取微器件并将微器件释放到接收衬底上。
-
公开(公告)号：US08297742B2
公开(公告)日：2012-10-30
申请号：US12728020
申请日：2010-03-19
申请人： Kevin Von Essen , John A. Higginson , Andreas Bibl
发明人： Kevin Von Essen , John A. Higginson , Andreas Bibl
IPC分类号： B41J2/045
CPC分类号： B41J2/14233 , B41J2/161 , B41J2/1623 , B41J2/1632 , B41J2/1642 , B41J2/1643 , B41J2/1646 , B41J2002/14362 , B41J2202/03 , Y10T29/49401
摘要： A fluid ejection device includes a circuit layer having a fluid outlet on a lower surface, a chamber substrate having a fluid inlet on an upper surface, an electrical contact electrically connecting the chamber substrate to the lower surface of the circuit layer, and a seal forming a fluid connection between the fluid outlet of the circuit layer and the fluid inlet of the chamber substrate. The seal and the electrical contact are a eutectic material. The seal and the electrical contact may be the same material.
摘要翻译： 流体喷射装置包括在下表面上具有流体出口的电路层，具有在上表面上的流体入口的腔室基底，将腔室基底电连接到电路层的下表面的电接触，以及密封形成 电路层的流体出口和腔室衬底的流体入口之间的流体连接。 密封和电接触是共晶材料。 密封和电接触可以是相同的材料。
-
公开(公告)号：US08191979B2
公开(公告)日：2012-06-05
申请号：US12416756
申请日：2009-04-01
CPC分类号： B41J3/28 , B41J11/06 , B41J13/103
摘要： A device for depositing drops includes a head configured to eject drops on a region of a substrate; a stage configured to hold the substrate while the head ejects drops on the region of the substrate; a first transporting device configured to transport the substrate in a transporting direction onto the stage; and a second transporting device configured to transport the substrate in the transporting direction off the stage. The stage and at least one of the first transporting device or the second transporting device are movable together in the transporting direction.
摘要翻译： 用于沉积液滴的装置包括头部，头部构造成在基底的区域上喷射液滴; 一个构造成在头部喷射在衬底的区域上时保持衬底的阶段; 第一输送装置，其构造成将所述基板沿输送方向输送到所述载物台上; 以及第二输送装置，其构造成将所述基板沿所述输送方向输送出所述载物台。 第一输送装置或第二输送装置中的载物台和至少一个可沿输送方向一起移动。
-
-
-
-
-
-
-
-
-
搜索结果
183 条记录 (耗时 0.03 秒)
