公开(公告)号：US20070297713A1

公开(公告)日：2007-12-27

申请号：US11452820

申请日：2006-06-13

申请人： Daoqiang Lu ,  Jiamiao Tang ,  Jiangqi He ,  Edward A. Zarbock

发明人： Daoqiang Lu ,  Jiamiao Tang ,  Jiangqi He ,  Edward A. Zarbock

IPC分类号： G02B6/12

CPC分类号： G02B6/4232 ,  G02B6/421 ,  G02B6/4214 ,  G02B6/4246

摘要： A chip-to-chip optical interconnect includes a substrate, an optoelectronic die, and a waveguide structure. The substrate includes an optical via passing through the substrate. The optoelectronic die is disposed on the substrate and aligned to optically communicate through the optical via. A waveguide structure is positioned proximate to the substrate and aligned with the optical via to communicate optical signals with the optoelectronic die through the optical via.

摘要翻译： 芯片到芯片的光学互连包括衬底，光电管芯和波导结构。 衬底包括穿过衬底的光学通孔。 光电管芯设置在衬底上并对准以通过光通孔光学连通。 波导结构被定位在靠近基板并与光通孔对齐以通过光通孔与光电管芯通信光信号。

公开(公告)号：US20070158807A1

公开(公告)日：2007-07-12

申请号：US11322297

申请日：2005-12-29

申请人： Daoqiang Lu ,  Wei Shi ,  Qing Zhou ,  Jiangqi He

发明人： Daoqiang Lu ,  Wei Shi ,  Qing Zhou ,  Jiangqi He

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L25/50 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06582 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/00014

摘要： Electronic devices and methods for fabricating electronic devices are described. One embodiment includes an electronic device having a first die, the first die having a top surface, a bottom surface, and a plurality of side surfaces. The first die also includes a plurality of metal pads on the top surface extending to an outer edge of the top surface, and a plurality of metal pads on the bottom surface extending to an outer edge of the bottom surface. The first die also includes a plurality of metal regions along the side surfaces, wherein each of the metal regions extends between one of the metal pads on the top surface and one of the metal pads on the bottom surface. Other embodiments are described and claimed.

摘要翻译： 描述了用于制造电子设备的电子设备和方法。 一个实施例包括具有第一管芯的电子器件，第一管芯具有顶表面，底表面和多个侧表面。 第一管芯还包括在顶表面上延伸到顶表面的外边缘的多个金属焊盘，以及在底表面上延伸到底表面的外边缘的多个金属焊盘。 第一管芯还包括沿着侧表面的多个金属区域，其中每个金属区域在顶表面上的金属焊盘之一和底表面上的金属焊盘中的一个之间延伸。 描述和要求保护其他实施例。

公开(公告)号：US20070140627A1

公开(公告)日：2007-06-21

申请号：US11313534

申请日：2005-12-21

申请人： Daoqiang Lu

发明人： Daoqiang Lu

IPC分类号： G02B6/36

CPC分类号： G02B6/4249 ,  G02B6/4206 ,  G02B6/4231

摘要： An optical-electrical interface for interfacing optical signals with electrical signals. The optical-electrical interface includes an alignment interface for receiving an external waveguide connector from a first side. The alignment interface includes an alignment structure to mate with a corresponding alignment structure of the external waveguide connector to passively align the external waveguide connector. A first microlens is disposed on the first side of the alignment interface. A second microlens is disposed on a second side of the alignment interface. An optical path passes through the alignment interface between the first microlens and the second microlens. A conductor is disposed on the second side of the alignment interface.

摘要翻译： 用于将光信号与电信号对接的光电接口。 光电接口包括用于从第一侧接收外部波导连接器的对准接口。 对准接口包括对准结构，以与外部波导连接器的对应对准结构配合，以被动对准外部波导连接器。 第一微透镜设置在对准界面的第一侧上。 第二微透镜设置在对准界面的第二侧上。 光路穿过第一微透镜和第二微透镜之间的对准界面。 导体布置在对准界面的第二侧上。

公开(公告)号：US20070127865A1

公开(公告)日：2007-06-07

申请号：US11671775

申请日：2007-02-06

申请人： Daoqiang Lu ,  Gilroy Vandentop

发明人： Daoqiang Lu ,  Gilroy Vandentop

IPC分类号： G02B6/12

CPC分类号： G02B6/423 ,  G02B6/4232

摘要： Optical devices and methods for constructing the same are disclosed. An example optical device includes an optical transmitter, a photodetector and a waveguide optically coupling the optical transmitter and the photodetector. It also includes a substrate having a first cavity to receive the optical transmitter and a second cavity to receive the second transmitter. The first and second cavities are located and dimensioned to passively align the optical transmitter, the waveguide and the photodetector when the transmitter is inserted into the first cavity and the photodetector is inserted into the second cavity.

摘要翻译： 公开了用于构造它们的光学器件和方法。 一种示例性光学装置包括光发射器，光电检测器和光学耦合光发射器和光电检测器的波导。 其还包括具有用于接收光发射器的第一腔体和用于接收第二发射器的第二腔体的衬底。 第一和第二空腔的位置和尺寸被定位成当发射器被插入到第一空腔中并且光电检测器被插入到第二腔中时被动对准光发射器，波导和光电检测器。

公开(公告)号：US20060244148A1

公开(公告)日：2006-11-02

申请号：US11116554

申请日：2005-04-28

申请人： Daoqiang Lu

发明人： Daoqiang Lu

IPC分类号： H01L21/48 ,  H01L23/52

CPC分类号： H01L21/4871 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/31 ,  H01L24/75 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/73253 ,  H01L2224/83193 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/16152 ,  H01L2924/19043 ,  H01L2924/01047 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014

摘要： A solder is deposited on the backside of a wafer. The wafer can be pre-deposited with a barrier layer such as a titanium base and other materials. Deposition is carried out by electroplating, electroless plating, chemical vapor deposition, and physical vapor deposition. The solder-deposited die is bonded with a heat spreader that did not require a pre-deposited solder.

摘要翻译： 焊料沉积在晶片的背面。 晶片可以预先沉积有阻挡层，例如钛基和其它材料。 通过电镀，化学镀，化学气相沉积和物理气相沉积进行沉积。 焊料沉积的模具与不需要预沉积焊料的散热器结合。

公开(公告)号：US20060220223A1

公开(公告)日：2006-10-05

申请号：US11092054

申请日：2005-03-29

申请人： Daoqiang Lu ,  John Heck

发明人： Daoqiang Lu ,  John Heck

IPC分类号： H01L23/12

CPC分类号： B81C1/00269 ,  B81B2201/014 ,  B81C2203/0109 ,  B81C2203/019 ,  B81C2203/035

摘要： According to one embodiment an apparatus and method for MEMS packaging including a reactive nano-layer is presented. The apparatus comprises a substrate, an environmentally sensitive device on the substrate, a cap to fit over the device, and a hermetic seal between the cap and the substrate. The hermetic seal comprises a solder layer, and a reactive layer including one or more elements that react together through an initiating energy to emit exothermic heat to melt the solder layer.

摘要翻译： 根据一个实施例，提出了包括反应性纳米层的用于MEMS封装的装置和方法。 该设备包括基底，在基底上的环境敏感的装置，适合装置的盖子，以及盖子和基底之间的气密密封。 气密密封件包括焊料层，以及包括一个或多个元件的反应层，其通过引发能量一起反应以发射放热以熔化焊料层。

公开(公告)号：US20060192281A1

公开(公告)日：2006-08-31

申请号：US11406858

申请日：2006-04-19

申请人： Daoqiang Lu ,  John Heck

发明人： Daoqiang Lu ,  John Heck

IPC分类号： H01L23/12

CPC分类号： B81C1/00269 ,  H01L2224/45144 ,  H01L2224/48463 ,  Y10S257/924 ,  H01L2924/00

摘要： Microelectronic packages having chambers and sealing materials, and methods of making the packages, and sealing the chambers, are disclosed. An exemplary package may include a first surface, a second surface, a solid sealing material including an intermetallic compound, such as, for example, of gallium or another relatively low melting material, between the first surface and the second surface, and a chamber defined by the first surface, the second surface, and the sealing material. An exemplary method may include disposing a ring of a sealing material including a liquid metal between a first surface and a second surface to define a chamber between the first surface, the second surface, and the ring of the sealing material, and sealing the chamber by heating the sealing material to react the liquid metal with a metal that is capable of forming an intermetallic compound with the liquid metal.

摘要翻译： 公开了具有室和密封材料的微电子封装，以及制造封装的方法和密封室。 示例性包装可以包括在第一表面和第二表面之间的第一表面，第二表面，包括金属间化合物（例如镓或另一种较低熔点的材料）的固体密封材料， 通过第一表面，第二表面和密封材料。 示例性方法可以包括在第一表面和第二表面之间设置包括液体金属的密封材料的环，以在第一表面，第二表面和密封材料的环之间限定腔室，并且通过 加热密封材料以使液态金属与能够与液态金属形成金属间化合物的金属反应。

公开(公告)号：US07038316B2

公开(公告)日：2006-05-02

申请号：US10811370

申请日：2004-03-25

申请人： Chuan Hu ,  Daoqiang Lu ,  Zhiyong Wang ,  Gilroy Vandentop

发明人： Chuan Hu ,  Daoqiang Lu ,  Zhiyong Wang ,  Gilroy Vandentop

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： B23K3/0623 ,  B23K2101/40 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05099

摘要： An IC package is assembled from a bumpless die, a die carrier having a plurality of solder bumps thereon, and a heat spreader lid. The bumpless die is bonded to the heat spreader lid to form a module and then the module is bonded to the bumped die carrier.

摘要翻译： IC封装由无冲击模具，其上具有多个焊料凸块的模具载体和散热器盖组装。 将无凸起的模具结合到散热器盖上以形成模块，然后将模块结合到凸起的模具载体上。

公开(公告)号：US20060060637A1

公开(公告)日：2006-03-23

申请号：US10948595

申请日：2004-09-22

申请人： Jadhav Susheel ,  Daoqiang Lu

发明人： Jadhav Susheel ,  Daoqiang Lu

IPC分类号： B23K31/02

CPC分类号： B23K1/203 ,  B23K1/0016 ,  B23K2101/40

摘要： Embodiments of an apparatus and method for attaching a semiconductor die to a heat spreader (or other thermal component) are disclosed. The apparatus includes a substantially flat surface to receive a number of die, and the die may be held in place on the surface by a flux, the flux being subsequently removed prior to bonding. The apparatus may further include a number of registration elements to hold a heat spreader in a relative position over each die. Other embodiments are described and claimed.

摘要翻译： 公开了将半导体管芯附着到散热器（或其他热部件）上的装置和方法的实施例。 该装置包括基本上平坦的表面以接收多个管芯，并且管芯可以通过焊剂保持在表面上的适当位置，焊剂随后在接合之前被去除。 该装置还可以包括多个对准元件，以将散热器保持在每个管芯上的相对位置。 描述和要求保护其他实施例。

公开(公告)号：US06933171B2

公开(公告)日：2005-08-23

申请号：US10691136

申请日：2003-10-21

申请人： Ming Fang ,  Valery Dubin ,  Daoqiang Lu

发明人： Ming Fang ,  Valery Dubin ,  Daoqiang Lu

IPC分类号： G02B6/42 ,  H01L21/00 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/60 ,  H01L23/48 ,  H01L23/485 ,  H01L23/52 ,  H01L27/15 ,  H01L29/267 ,  H01L31/12 ,  H01L33/00

CPC分类号： H01L24/16 ,  G02B6/4204 ,  G02B6/4232 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2224/29099

摘要： The invention provides bumps between a die and a substrate with a height greater than or equal to a height of a waveguide between the die and the substrate. The bumps may be formed on a die prior to that die being singulated from a wafer.