公开(公告)号：US4482445A

公开(公告)日：1984-11-13

申请号：US350425

申请日：1982-02-22

申请人： Joseph C. Fjelstad

发明人： Joseph C. Fjelstad

IPC分类号： C25F3/14 ,  C25F7/00 ,  H05K3/00 ,  H05K3/07

CPC分类号： C25F7/00 ,  C25F3/14 ,  H05K3/0055 ,  H05K2203/0346 ,  H05K3/07 ,  Y10S204/07

摘要： Methods and apparatus for electrochemically deburring perforate metallic clad dielectric laminates such, for example, as laminated printed circuit boards (PCBs) or printed wiring boards (PWBs) and similar machined and fabricated laminated dielectric parts; and, more specifically, methods and apparatus for removing burrs formed during drilling, punching and similar machining operations for forming holes in a workpiece and wherein the conductive path for current flow during the electrochemical deburring process extends through the thru-hole perforations formed in the workpiece being deburred so as to concentrate current densities and preferential electrochemical attack in the regions of the clad at the peripheral edges of the thru-hole perforations in the clad dielectric laminate.

摘要翻译： 用于电化学去毛刺穿孔金属包层电介质层压板的方法和装置，例如作为层压印刷电路板（PCB）或印刷电路板（PWB）以及类似的机加工和制造的叠层电介质部件; 更具体地说，用于去除在钻孔，冲孔和在工件中形成孔的类似的加工操作中形成的毛刺的方法和装置，并且其中在电化学去毛刺过程中用于电流的导电路径延伸穿过形成在工件中的通孔穿孔 被去毛刺，以便在包层电介质层压板中的通孔穿孔的周边边缘处的包层区域中集中电流密度和优先电化学侵蚀。

公开(公告)号：US08796830B1

公开(公告)日：2014-08-05

申请号：US11515167

申请日：2006-09-01

申请人： Joseph C. Fjelstad

发明人： Joseph C. Fjelstad

IPC分类号： H01L23/495

CPC分类号： H01L23/3135 ,  H01L21/4828 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49548 ,  H01L24/06 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48764 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48864 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/07811 ,  H01L2924/15311 ,  H01L2924/18165 ,  H01L2924/00012 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/00014

摘要： In an embodiment, an IC assembly comprises an IC having a top surface comprising a plurality of input/output terminations, a plurality of leads arranged around the IC, a plurality of bond wires, and an encapsulant. Each lead has a first surface and a second surface opposite the first surface, and has a feature protruding from the first surface proximate an inward end of the lead nearest the IC. The feature extends from the first surface to approximately a plane that includes a bottom surface of the IC. Each bond wire connects a respective lead to a respective I/O terminal on the IC. The encapsulant seals the bond wires, the IC, and a first portion of the leads that includes the feature. The feature creates on offset from the bottom of the IC to permit the encapsulant to surround the first portion.

摘要翻译： 在一个实施例中，IC组件包括具有包括多个输入/输出终端的顶表面的IC，围绕IC布置的多个引线，多个接合线和密封剂。 每个引线具有与第一表面相对的第一表面和第二表面，并且具有从第一表面突出的特征，邻近引线最靠近IC的内端。 该特征从第一表面延伸到包括IC的底表面的大致平面。 每个接合线将相应的引线连接到IC上的相应I / O端子。 密封剂密封接合线，IC和引线的包括该特征的第一部分。 该特征从IC的底部偏移创建，以允许密封剂围绕第一部分。

公开(公告)号：US08510935B2

公开(公告)日：2013-08-20

申请号：US12170426

申请日：2008-07-09

申请人： Joseph C. Fjelstad

发明人： Joseph C. Fjelstad

IPC分类号： B32B3/10

CPC分类号： H05K1/188 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24195 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/185 ,  H05K3/06 ,  H05K3/061 ,  H05K3/284 ,  H05K3/323 ,  H05K2201/0355 ,  H05K2203/1469 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49169 ,  Y10T428/24612 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for producing an assembly of electronic components and assemblies in accord with this, wherein the electronic components have component terminals. A conductive firmament having a first side and a second side is provided. Then the component terminals are connected to the first side of the firmament with an anisotropic conductor. A pattern is applied to the second side of said firmament. And portions of the firmament are removed based on the pattern, such that remaining portions of said firmament form the electrical circuit interconnecting the component terminals.

摘要翻译： 一种用于制造与此相对应的电子部件和组件的组件的方法，其中电子部件具有部件端子。 提供具有第一侧和第二侧的导电孔。 然后组件端子用各向异性导体连接到穹顶的第一侧。 一种模式适用于所述穹隆的第二面。 并且基于图案去除穹隆的部分，使得所述穹形的剩余部分形成将元件端子互连的电路。

公开(公告)号：US08333617B2

公开(公告)日：2012-12-18

申请号：US13473249

申请日：2012-05-16

申请人： Joseph C. Fjelstad

发明人： Joseph C. Fjelstad

IPC分类号： H01R24/00

CPC分类号： H01R13/15 ,  H01R13/05 ,  Y10T29/49204

摘要： An electronic wiping torsional connector for use in connecting to mating contacts on an insulating base. The connector includes a plurality of contacts 1-10 each having a contact 13 and an anchor 14. Contacts 1-10 twist against anchor 14 when the insulating base is inserted into the connector to provide the wiping contact. In an alternative embodiment, the conductors are wires having two bends at different angles. One bend is elongated such that it engages a paddle before the other and rotates the other bend into contact with a ribbon contact located on the paddle.

摘要翻译： 一种用于连接到绝缘基座上的配合触点的电子擦拭扭转连接器。 连接器包括多个具有接触件13和锚固件14的接触件1-10。当绝缘基座插入连接器中以提供擦拭接触件时，接头1-10与锚固件14相互扭转。 在替代实施例中，导体是具有不同角度的两个弯曲的导线。 一个弯曲部分是细长的，使得它在另一个之前接合桨，并使另一个弯曲部转动与位于桨上的带状接触接触。

公开(公告)号：US08080874B1

公开(公告)日：2011-12-20

申请号：US11855826

申请日：2007-09-14

申请人： Jeremy Werner ,  Daniel L. Rosenband ,  Jeremy Matthew Plunkett ,  William L. Schmidt ,  David T. Wang ,  Wael O. Zohni ,  Philip Arnold Ferolito ,  Michael John Sebastian Smith ,  Suresh Natarajan Rajan ,  Joseph C. Fjelstad

发明人： Jeremy Werner ,  Daniel L. Rosenband ,  Jeremy Matthew Plunkett ,  William L. Schmidt ,  David T. Wang ,  Wael O. Zohni ,  Philip Arnold Ferolito ,  Michael John Sebastian Smith ,  Suresh Natarajan Rajan ,  Joseph C. Fjelstad

IPC分类号： H01L23/34 ,  H01L23/48

CPC分类号： H05K1/181 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/5387 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/1203 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1304 ,  H01L2924/14 ,  H01L2924/1424 ,  H01L2924/1436 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K1/0281 ,  H05K1/141 ,  H05K1/147 ,  H05K2201/10454 ,  H05K2201/10484 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/2018 ,  Y02P70/611 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A system, method, and apparatus are included for providing additional space between an integrated circuit package and a circuit board. An integrated circuit package is provided including a plurality of integrated circuit package contacts. Also provided is a circuit board in electrical communication with the integrated circuit package. Further, the integrated circuit package, the integrated circuit contacts, and/or the circuit board is configured for providing additional space between the integrated circuit package and the circuit board to position at least a portion of at least one component between the integrated circuit package and the circuit board.

摘要翻译： 包括系统，方法和装置，用于在集成电路封装和电路板之间提供额外的空间。 提供了包括多个集成电路封装触点的集成电路封装。 还提供了与集成电路封装电通信的电路板。 此外，集成电路封装，集成电路触点和/或电路板被配置为在集成电路封装和电路板之间提供额外的空间，以将至少一部分的至少一部分置于集成电路封装和 电路板。

公开(公告)号：US20110171859A1

公开(公告)日：2011-07-14

申请号：US12684835

申请日：2010-01-08

申请人： Joseph C. Fjelstad

发明人： Joseph C. Fjelstad

IPC分类号： H01R4/48 ,  H01R43/16

CPC分类号： H01R13/15 ,  H01R13/05 ,  Y10T29/49204

摘要： An electronic wiping torsional connector for use in connecting to mating contacts on an insulating base. The connector includes a plurality of contacts 1-10 each having a contact area 13 and an anchor area 14. Contacts 1-10 twist against an anchor 14 when the insulating base is inserted into the connector to provide the wiping contact. Alternative embodiments allow reduced insertion force and reduced size. The method provides for manufacturing the connector in quantity by roll-to-roll processing with a metal back.

摘要翻译： 一种用于连接到绝缘基座上的配合触点的电子擦拭扭转连接器。 连接器包括多个具有接触区域13和锚定区域14的接触件1-10。当绝缘基底插入连接器以提供擦拭接触件时，接触件10与锚固件14相互扭转。 替代实施例允许减小的插入力和减小的尺寸。 该方法通过用金属背的卷对卷加工来提供数量的连接器的制造。

公开(公告)号：US20090277677A1

公开(公告)日：2009-11-12

申请号：US12429988

申请日：2009-04-24

申请人： Joseph C. Fjelstad ,  Nader Gamini ,  David Tichane

发明人： Joseph C. Fjelstad ,  Nader Gamini ,  David Tichane

IPC分类号： H05K1/18 ,  H05K13/00

CPC分类号： H05K1/185 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24227 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H05K3/1241 ,  H05K2201/10515 ,  H05K2201/10628 ,  H05K2201/10689 ,  H05K2201/10719 ,  H05K2203/0173 ,  H05K2203/1469 ,  Y10T29/49117

摘要： A system for prototyping electrical circuits, as well as creating production circuits, without using solder. Stand-in electrical components 110a are placed on a carrier 100a and scanned 310. From the resulting data, a machine tool or laser ablation system 410 then creates a negative master 420a with aperture(s) 530 into which production components 810 are placed and secured. Component leads 820 or packages are encapsulated with electrically insulating material 910 with vias 1030a exposing the leads. Traces 1040 connect appropriate leads forming a circuit sub-assembly 1000 which can serve as a basis for a circuit assembly formed through a reverse-interconnection process.

摘要翻译： 用于原型电路的系统，以及创建生产电路，而不使用焊料。 待机电气元件110a被放置在载体100a上并扫描310.根据所得数据，机床或激光烧蚀系统410然后创建具有孔530的负主体420a，生产部件810被放置并固定到其中 。 元件引线820或封装被电绝缘材料910封装，通孔1030a暴露引线。 迹线1040连接形成电路子组件1000的适当导线，其可以用作通过反向互连工艺形成的电路组件的基础。

公开(公告)号：US20090237901A1

公开(公告)日：2009-09-24

申请号：US12405773

申请日：2009-03-17

申请人： Joseph C. Fjelstad

发明人： Joseph C. Fjelstad

IPC分类号： H05K1/18 ,  B29C45/14

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/73267 ,  H01L2924/19105 ,  H05K1/0278 ,  H05K3/1241 ,  H05K2201/0191 ,  H05K2201/09118 ,  H05K2203/1469

摘要： A method (10) for manufacturing a monolithic molded electronic assembly (12). A mold (14) having first and second mold potions (14a-b) that mate to form an interior chamber (16) is provided. The mold has an injection port (22) and channel (24) connecting into the chamber. Electronic parts (30) having electronic contacts (32) are populated onto the second mold portion, to be substantially contained in the chamber. The mold potions are mated together and a liquid insulating molding material (36) is injected through the injection port channel to fill the chamber. The molding material is hardened to a solid, thereby embedding the electronic parts in the molding material as a monolithic sub-assembly (40). The monolithic sub-assembly is removed from the mold and one or more solderless conductive circuits (50) are applied to the electronic contacts of the electronic parts, thereby providing the electronic assembly.

摘要翻译： 一种用于制造单片模制电子组件（12）的方法（10）。 提供具有配合以形成内部腔室（16）的第一和第二模具部分（14a-b）的模具（14）。 模具具有连接到腔室中的注射口（22）和通道（24）。 具有电子触点（32）的电子部件（30）填充到第二模具部分上，以基本上容纳在腔室中。 将模具配合在一起，并且通过注入口通道注入液体绝缘模塑材料（36）以填充腔室。 将成型材料硬化成固体，从而将电子部件嵌入到成型材料中作为整体式子组件（40）。 将单片子组件从模具中取出，并且将一个或多个无焊导电电路（50）施加到电子部件的电子触点，从而提供电子组件。

公开(公告)号：US20090056997A1

公开(公告)日：2009-03-05

申请号：US12200749

申请日：2008-08-28

申请人： Joseph C. Fjelstad

发明人： Joseph C. Fjelstad

IPC分类号： H01R12/04 ,  H05K3/00

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L2224/04105 ,  H01L2224/92144 ,  H01L2224/96 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/056 ,  H05K3/284 ,  H05K3/4644 ,  H05K2201/0969 ,  H05K2201/2018 ,  H05K2203/0156 ,  H05K2203/1469 ,  Y10T29/49124 ,  Y10T29/49146 ,  H01L2924/00

摘要： A frame 100 containing aperture(s) 102, 103, 104 is positioned on and joined to a permanent substrate 206a or temporary substrate 206b. Electrical component(s) 202, 203, 204 are placed into respective aperture(s) 102, 103, 104 with the leads 504, 1002 of the component(s) 202, 203, 204 positioned on and attached to the permanent substrate 206a or the temporary substrate 206b. Then an encapsulant 402, electrically insulating, but preferably thermally conductive, envelops the component(s) 102, 103, 104. At this point, temporary substrate 206b may be removed exposing component leads 1002. Or, if component(s) 102, 103, 104 are mounted on permanent substrate 206a, vias 502 extend from the surface of substrate 206a to leads 504. With leads 504, 1002 exposed, the completed subassembly 500, 1000 may be incorporated into various forms of reverse-interconnection process (RIP) assemblies as detailed in related applications.

摘要翻译： 包含孔102,103,104的框架100定位在永久基板206a或临时基板206b上并连接到永久基板206a或临时基板206b上。 电气部件202,203,204被放置在相应的孔102,103,104中，其中部件202,203,204的引线504,1002定位在永久性基板206a上并连接到永久基板206a或 临时衬底206b。 然后，电绝缘但优选导热的密封剂402包封部件102,103,104。在这一点上，可以移除暴露部件引线1002的临时基板206b。或者，如果部件102,103 ，104安装在永久性基板206a上，通孔502从基板206a的表面延伸到引线504.在引线504,1002露出的情况下，完成的子组件500,1000可以并入各种形式的反向互连工艺（RIP）组件 具体如相关申请。

公开(公告)号：US06884120B1

公开(公告)日：2005-04-26

申请号：US10608255

申请日：2003-06-27

申请人： Belgacem Haba ,  Para Segaram ,  Joseph C. Fjelstad

发明人： Belgacem Haba ,  Para Segaram ,  Joseph C. Fjelstad

IPC分类号： H01R24/00

CPC分类号： H01R12/88 ,  H01R12/79 ,  H01R13/2407

摘要： A connector is described which uses a coupling structure integrally formed from a plurality of discrete elements that are aligned to receive an insertion force. In response to the insertion force affecting some or all of the elements, the affected elements move from an original state into a deflected state. In the deflected state, the overall thickness of the coupling structure is reduced. The relationship between the coupling structure and a dimension of a cavity that is to be occupied by the coupling structure is such that when the thickness of the coupling structure is reduced, the dimension of the cavity is increased.

摘要翻译： 描述了一种连接器，其使用由对准以接收插入力的多个分立元件整体形成的联接结构。 响应于影响部分或全部元件的插入力，受影响的元件从原始状态移动到偏转状态。 在偏转状态下，耦合结构的总体厚度减小。 耦合结构与要由耦合结构占据的空腔的尺寸之间的关系使得当耦合结构的厚度减小时，空腔的尺寸增加。