摘要:
A gallium nitride compound semiconductor light emitting element has a nitride layered body formed on a translucent substrate. A P type pad electrode, an N type pad electrode and a P type electrode are formed at the layered body, each having the desired reflectance. The thickness of the translucent substrate and the nitride layered body stacked thereon of the semiconductor light emitting element is 60 μm to 460 μm.
摘要:
A semiconductor light-emitting device includes: a substrate; a semiconductor layer including at least one light-emitting region; a metal layer having a light transmitting characteristic; a first fluorescent material layer for converting at least a portion of first light emitted from the light-emitting region into second light having a different wavelength from the first light; and an oxide semiconductor layer formed between the metal layer and the first fluorescent material layer, and having a light-transmitting characteristic.
摘要:
A nitride based semiconductor light emitting element includes at least a gallium nitride based compound semiconductor layer of a first conductivity type and a gallium nitride based compound semiconductor layer of a second conductivity type stacked on a substrate. On a main region of the top surface of the semiconductor layer of the second conductivity type, a Pd-containing electrode is formed, and the top surface and side surfaces of the Pd-containing electrode as well as the surface of the semiconductor layer of the second conductivity type in a region of at least a prescribed width from the side surfaces are covered by a conductive shielding film to be shielded from the atmosphere or a mold resin.
摘要:
A gallium nitride group compound semiconductor light-emitting device comprises a substrate and a layered structure provided on the substrate. The layered structure includes: an active layer; an upper cladding layer and a lower cladding layer which is located closer to the substrate than the upper cladding layer, the active layer interposed between the cladding layers; an internal current constricting layer having an opening for constricting a current within a selected region of the active layer, the internal current constricting layer being provided on the upper cladding layer; a surface protecting layer for covering the internal current constricting layer and an exposed surface of the upper cladding layer in the opening of the internal current constricting layer; and a regrowth layer provided on the surface protecting layer. The surface protecting layer serves as a protecting layer for the upper cladding layer and the internal current constricting layer in a step of forming the regrowth layer.
摘要:
After the active layer including indium is formed, the evaporation preventing layer is formed at a temperature which does not cause liberation of indium. The p-type Al.sub.X Ga.sub.1-X N (0.ltoreq.X.ltoreq.1) or the like is used for the evaporation preventing layer. Increasing the substrate temperature to as high as 1020.degree. C. for forming the upper cladding layer does not cause liberation of indium from the active layer because the evaporation preventing layer is provided. As a result, the composition ratio of indium can be easily controlled and the high-quality active layer and the high-quality interface between the active layer and the upper cladding layer can be provided.
摘要:
A method for growing a compound semiconductor layer of Al.sub.x Ga.sub.1-x As (0.ltoreq.x.ltoreq.1) on a compound semiconductor substrate uses a molecular beam epitaxial apparatus, the method including the steps of providing the substrate having a GaAs layer on an upper surface thereof, thermally etching the GaAs layer by heating the substrate at a temperature and irradiating the GaAs layer with a gallium molecular beam and an arsenic molecular beam to expose the upper surface of the substrate, and growing the Al.sub.x Ga.sub.1-x As (0.ltoreq.x.ltoreq.1) layer on the upper surface of the substrate.
摘要翻译:在化合物半导体衬底上生长Al x Ga 1-x As(0≤x≤1)的化合物半导体层的方法使用分子束外延装置,该方法包括以下步骤:将具有GaAs层的衬底 通过在温度下加热衬底并用镓分子束和砷分子束照射GaAs层来暴露衬底的上表面,并且生长Al x Ga 1-x As(0 < = x <1)层。
摘要:
A constant torque ball joint employs upper and lower bearing pieces made of a self-lubricating material to journal the ball portion of a ball stud with their segmental semi-spherical internal surfaces and also employs upper and lower elastic material blocks having a longitudinal elastic modulus Eo of 1.5 to 10 kg/mm.sup.2 to substantially enclose tightly respectively the outer surfaces of the upper and lower bearing pieces. The upper and lower bearing pieces and the upper and lower elastic blocks with the ball portion of the ball stud are mounted whereby a small space is left between the upper and lower bearing pieces which are inserted in the socket cavity of a metallic socket joint rod. A metallic cover disc is applied over these inserted members and the end rim of the socket cavity is swaged to crimp the cover disc to substantially completely enclose the bearing pieces and the elastic blocks within the socket cavity and the cover disc. The elastic blocks are kept in a state of elastic compression at an elastic compression rate of 20 percent or less.
摘要翻译:恒转矩球接头使用由自润滑材料制成的上下轴承片,使其具有节段半球形内表面的球头螺栓的球形部分轴颈,并且还采用具有纵向弹性模量Eo的上下弹性材料块 为1.5〜10kg / mm 2,以分别基本上紧密地封闭上,下轴承片的外表面。 安装上下轴承片以及具有球头螺栓的球部的上下弹性块,由此在插入金属插座接头杆的插座空腔中的上轴承片和下轴承片之间留有小的空间。 在这些插入的构件上施加金属盖盘,并且模制插座空腔的端缘以压盖盖盘,以基本上完全包围轴承片和弹性块在插座腔和盖盘内。 弹性块以弹性压缩率保持在20%以下的弹性压缩状态。
摘要:
A substrate-type LED light source (10) includes: at least one blue LED chip (2) which has an emission peak in a range from 400 nm to 480 nm so as to correspond to a blue light region absorption peak of chlorophyll; a red phosphor (7b) which emit, upon receiving excitation light from the at least one blue LED chip (2), light having a peak wavelength in a range from 620 nm to 700 nm so as to correspond to a red light region absorption peak of chlorophyll; and a resin layer (7) in which the red phosphor 7b is dispersed and which covers the at least one blue LED chip (2).
摘要:
A light-emitting device capable of ensuring an electric connection between a light-emitting element and an electrode without generating any problem in practical use, by both connecting methods with a solder and a connector, and a lighting device provided with the light-emitting device are provided. The light-emitting device according to the present invention has a plurality of LED chips, and a soldering electrode land and a connector connecting electrode land electrically connected to the chips, on a ceramic substrate. The soldering electrode land is formed of a first conductive material having a function to prevent diffusion to a solder, and the connector connecting electrode land is formed of a second conductive material having a function to prevent oxidation.
摘要:
A light emitting device is a light emitting device using light emitting elements and includes: a substrate; a resin frame provided circularly on the substrate; a resin wall provided on the substrate so as to partition an area surrounded by the resin frame into 2 zones; light-emitting sections (a first light-emitting section: blue LEDs+red fluorescent material, a second light-emitting section: blue LEDs+yellow fluorescent material) provided in the respective zones, each of which light-emitting sections includes at least one light emitting element; and first and second anode electrodes and a cathode electrode provided so that each of the light-emitting sections receives current via a corresponding anode electrode and the cathode electrode, the light-emitting sections emitting respective pieces of light each having at least one color, which respective pieces of light have different colors from each other, the first and second anode electrodes being electrically connected to the first and second light-emitting sections, respectively. With the arrangement, which can increase an integration degree, it is possible to achieve a high color rendering property and an excellent color mixing property, to easily adjust a chromaticity, and to easily generate light with a desired chromaticity.