公开(公告)号：US20160126613A1

公开(公告)日：2016-05-05

申请号：US14931689

申请日：2015-11-03

Applicant: RF Micro Devices, Inc.

Inventor： Dirk Robert Walter Leipold ,  George Maxim ,  Baker Scott

IPC: H01P1/20 ,  H01P7/06 ,  H03H5/00

CPC classification number: H01F27/2804 ,  H01F2027/2809 ,  H01L21/0276 ,  H01L28/10 ,  H01P7/06 ,  H01P7/065 ,  H01P7/08 ,  H03H7/38 ,  H03H7/463 ,  H03H9/24 ,  H04B1/40 ,  H04J1/08

Abstract: A resonator includes an inductive element and a conductive cavity surrounding the inductive element. In particular, the conductive cavity surrounds the inductive element such that a capacitance is distributed between the inductive element and the conductive cavity. By distributing a capacitance between the inductive element and the conductive cavity, a high quality-factor resonator can be achieved by the resonator with a relatively small form factor.

Abstract translation: 谐振器包括感应元件和围绕感应元件的导电腔。 特别地，导电腔围绕感应元件，使得电容分布在感应元件和导电腔之间。 通过在电感元件和导电腔之间分配电容，可以通过具有相对小的形状因子的谐振器来实现高质量因子谐振器。

公开(公告)号：US09048836B2

公开(公告)日：2015-06-02

申请号：US14449594

申请日：2014-08-01

Applicant: RF Micro Devices, Inc.

Inventor： George Maxim ,  Dirk Robert Walter Leipold ,  Baker Scott

IPC: H03K17/56 ,  H03K17/30 ,  H03K17/60 ,  H03K17/687 ,  H03K17/16

CPC classification number: H03K17/302 ,  H03F1/565 ,  H03F3/193 ,  H03F3/245 ,  H03F3/68 ,  H03F3/72 ,  H03F2200/111 ,  H03F2200/267 ,  H03F2200/451 ,  H03F2203/7209 ,  H03K17/165 ,  H03K17/30 ,  H03K17/60 ,  H03K17/687

Abstract: Embodiments of radio frequency (RF) switching circuitry are disclosed that include (at least) a first switch and a body switching network operably associated with the first switch. The first switch has a first control contact, a first switch contact and a first body contact. The body switching network includes a first switchable path and a second switchable path. The first switchable path is connected between the first body contact and the first control contact of the first switch. Additionally, the second switchable path is connected between the first body contact and the first switch contact. Accordingly, the first body contact is can be appropriately biased by the switchable paths without requiring a resistor network and thus there is less loading. This maintains the Q factor of the RF switching circuitry.

Abstract translation: 公开了射频（RF）切换电路的实施例，其包括（至少）与第一开关可操作地相关联的第一开关和主体切换网络。 第一开关具有第一控制触点，第一开关触点和第一体接触。 身体切换网络包括第一切换路径和第二切换路径。 第一可切换路径连接在第一开关的第一主体接点和第一控制触点之间。 此外，第二可切换路径连接在第一主体接触件和第一开关触头之间。 因此，可以通过可切换路径适当地偏置第一体接触，而不需要电阻网络，因此具有较少的负载。 这维持了RF开关电路的Q因子。

公开(公告)号：US20150147986A1

公开(公告)日：2015-05-28

申请号：US14554746

申请日：2014-11-26

Applicant: RF MICRO DEVICES, INC.

Inventor： Baker Scott ,  George Maxim ,  Dirk Robert Walter Leipold

IPC: H04B1/04

CPC classification number: H03G3/3036 ,  H03F1/0211 ,  H03F1/0272 ,  H03F1/223 ,  H03F1/32 ,  H03F1/523 ,  H03F1/565 ,  H03F3/19 ,  H03F3/193 ,  H03F3/24 ,  H03F3/45179 ,  H03F3/45394 ,  H03F3/68 ,  H03F2200/324 ,  H03F2200/387 ,  H03F2200/451 ,  H03F2200/471 ,  H03F2201/3236 ,  H03G3/3042 ,  H04B1/0475 ,  H04B2001/0408 ,  H04B2001/0416 ,  H04B2001/0425

Abstract: RF PA circuitry includes an amplifier stage, gain compensation circuitry, and an adder. The amplifier stage is configured to receive and amplify an RF input signal to provide an RF output signal. The gain compensation circuitry is coupled in parallel with the amplifier stage and configured to receive the RF input signal and provide a gain compensation signal, wherein the gain compensation signal is configured to linearize at least a portion of the gain response of the amplifier stage or the RF PA circuitry in general. The adder is coupled between an output of the amplifier stage and the gain compensation stage and is configured to receive and add the RF output signal and the gain compensation signal to provide a linearized RF output signal.

Abstract translation: RF PA电路包括放大器级，增益补偿电路和加法器。 放大器级被配置为接收和放大RF输入信号以提供RF输出信号。 所述增益补偿电路与所述放大器级并联并且被配置为接收所述RF输入信号并提供增益补偿信号，其中所述增益补偿信号被配置为线性化放大器级的增益响应的至少一部分或 RF PA电路一般。 加法器耦合在放大器级的输出端和增益补偿级之间，并且被配置为接收和添加RF输出信号和增益补偿信号以提供线性化的RF输出信号。

公开(公告)号：US20150145604A1

公开(公告)日：2015-05-28

申请号：US14554774

申请日：2014-11-26

Applicant: RF Micro Devices, Inc.

Inventor： Baker Scott ,  George Maxim ,  Dirk Robert Walter Leipold

IPC: H03F1/02 ,  H03F3/21 ,  H03F3/19

CPC classification number: H03G3/3036 ,  H03F1/0211 ,  H03F1/0272 ,  H03F1/223 ,  H03F1/32 ,  H03F1/523 ,  H03F1/565 ,  H03F3/19 ,  H03F3/193 ,  H03F3/24 ,  H03F3/45179 ,  H03F3/45394 ,  H03F3/68 ,  H03F2200/324 ,  H03F2200/387 ,  H03F2200/451 ,  H03F2200/471 ,  H03F2201/3236 ,  H03G3/3042 ,  H04B1/0475 ,  H04B2001/0408 ,  H04B2001/0416 ,  H04B2001/0425

Abstract: Radio frequency power amplifier circuitry includes an amplifier element, power supply modulation circuitry, and bias modulation circuitry. The amplifier element is configured to amplify an RF input signal using a modulated power supply signal and a modulated bias signal to produce an RF output signal. The power supply modulation circuitry is coupled to the amplifier element and configured to provide the modulated power supply signal. The bias modulation circuitry is coupled to the amplifier element and the power supply modulation circuitry and configured to receive the modulated power supply signal and provide the modulated bias signal. Notably, the modulated bias signal is a function of the modulated power supply signal such that the modulated bias signal is configured to maintain a small signal gain of the amplifier element and the phase of the RF input signal at a constant value as the modulated power supply signal changes.

Abstract translation: 射频功率放大器电路包括放大器元件，电源调制电路和偏置调制电路。 放大器元件被配置为使用调制的电源信号和调制的偏置信号来放大RF输入信号以产生RF输出信号。 电源调制电路耦合到放大器元件并且被配置为提供调制电源信号。 偏置调制电路耦合到放大器元件和电源调制电路，并被配置为接收经调制的电源信号并提供经调制的偏置信号。 值得注意的是，调制偏置信号是调制电源信号的函数，使得调制偏置信号被配置为将放大器元件的小信号增益和RF输入信号的相位保持在恒定值，作为调制电源 信号变化。

公开(公告)号：US20150035582A1

公开(公告)日：2015-02-05

申请号：US14449594

申请日：2014-08-01

Applicant: RF Micro Devices, Inc.

Inventor： George Maxim ,  Dirk Robert Walter Leipold ,  Baker Scott

IPC: H03K17/30 ,  H03K17/687 ,  H03K17/16 ,  H03K17/60

CPC classification number: H03K17/302 ,  H03F1/565 ,  H03F3/193 ,  H03F3/245 ,  H03F3/68 ,  H03F3/72 ,  H03F2200/111 ,  H03F2200/267 ,  H03F2200/451 ,  H03F2203/7209 ,  H03K17/165 ,  H03K17/30 ,  H03K17/60 ,  H03K17/687

Abstract: Embodiments of radio frequency (RF) switching circuitry are disclosed that include (at least) a first switch and a body switching network operably associated with the first switch. The first switch has a first control contact, a first switch contact and a first body contact. The body switching network includes a first switchable path and a second switchable path. The first switchable path is connected between the first body contact and the first control contact of the first switch. Additionally, the second switchable path is connected between the first body contact and the first switch contact. Accordingly, the first body contact is can be appropriately biased by the switchable paths without requiring a resistor network and thus there is less loading. This maintains the Q factor of the RF switching circuitry.

Abstract translation: 公开了射频（RF）切换电路的实施例，其包括（至少）与第一开关可操作地相关联的第一开关和主体切换网络。 第一开关具有第一控制触点，第一开关触点和第一体接触。 身体切换网络包括第一切换路径和第二切换路径。 第一可切换路径连接在第一开关的第一主体接点和第一控制触点之间。 此外，第二可切换路径连接在第一主体接触件和第一开关触头之间。 因此，可以通过可切换路径适当地偏置第一体接触，而不需要电阻网络，因此具有较少的负载。 这维持了RF开关电路的Q因子。

公开(公告)号：US20140361849A1

公开(公告)日：2014-12-11

申请号：US14298863

申请日：2014-06-06

Applicant: RF Micro Devices, Inc.

Inventor： George Maxim ,  Dirk Robert Walter Leipold ,  Baker Scott

IPC: H03H7/46

CPC classification number: H03H7/465 ,  H03F1/565 ,  H03F3/193 ,  H03F3/245 ,  H03F3/68 ,  H03F3/72 ,  H03F2200/111 ,  H03F2200/267 ,  H03F2200/451 ,  H03F2203/7209 ,  H03H7/0115 ,  H03H7/0153 ,  H03H7/09 ,  H03H7/1775 ,  H03H7/46 ,  H03H7/463 ,  H03H2210/012 ,  H03H2210/025 ,  H03H2210/04 ,  H04B1/1027 ,  H04B1/18

Abstract: RF communications circuitry, which includes a first RF filter structure, is disclosed. The first RF filter structure includes a first tunable RF filter path and a second tunable RF filter path. The first tunable RF filter path includes a pair of weakly coupled resonators. Additionally, a first filter parameter of the first tunable RF filter path is tuned based on a first filter control signal. A first filter parameter of the second tunable RF filter path is tuned based on a second filter control signal.

Abstract translation: 公开了包括第一RF滤波器结构的RF通信电路。 第一RF滤波器结构包括第一可调谐RF滤波器路径和第二可调谐RF滤波器路径。 第一可调谐RF滤波器路径包括一对弱耦合谐振器。 另外，基于第一滤波器控制信号来调整第一可调谐RF滤波器路径的第一滤波器参数。 基于第二滤波器控制信号调整第二可调谐RF滤波器路径的第一滤波器参数。

公开(公告)号：US20140361839A1

公开(公告)日：2014-12-11

申请号：US14298872

申请日：2014-06-06

Applicant: RF Micro Devices, Inc.

Inventor： Baker Scott ,  George Maxim ,  Dirk Robert Walter Leipold ,  Christian Rye Iversen ,  Eric K. Bolton ,  Daniel Charles Kerr

IPC: H03F3/193

CPC classification number: H03H7/465 ,  H03F1/565 ,  H03F3/193 ,  H03F3/245 ,  H03F3/68 ,  H03F3/72 ,  H03F2200/111 ,  H03F2200/267 ,  H03F2200/451 ,  H03F2203/7209 ,  H03H7/0115 ,  H03H7/0153 ,  H03H7/09 ,  H03H7/1775 ,  H03H7/46 ,  H03H7/463 ,  H03H2210/012 ,  H03H2210/025 ,  H03H2210/04 ,  H04B1/1027 ,  H04B1/18

Abstract: An apparatus, which includes a first electronic device, a first nonlinear capacitance compensation circuit, and a capacitance compensation control circuit, is disclosed. The first electronic device has a first nonlinear capacitance and is coupled to the first nonlinear capacitance compensation circuit, which has a first compensation capacitance and receives a first compensation control signal. The capacitance compensation control circuit adjusts the first compensation capacitance using the first compensation control signal to at least partially linearize the first nonlinear capacitance.

Abstract translation: 公开了一种装置，其包括第一电子装置，第一非线性电容补偿电路和电容补偿控制电路。 第一电子设备具有第一非线性电容并且耦合到具有第一补偿电容并且接收第一补偿控制信号的第一非线性电容补偿电路。 电容补偿控制电路使用第一补偿控制信号来调整第一补偿电容，以使第一非线性电容至少部分线性化。

公开(公告)号：US20140266531A1

公开(公告)日：2014-09-18

申请号：US14215800

申请日：2014-03-17

Applicant: RF Micro Devices, Inc.

Inventor： Dirk Robert Walter Leipold ,  George Maxim ,  Baker Scott ,  Danny W. Chang

IPC: H01F27/38 ,  H01F27/28

CPC classification number: H03F1/3241 ,  H01F27/28 ,  H01F27/385 ,  H03F1/22 ,  H03F1/32 ,  H03F1/34 ,  H03F3/19 ,  H03F3/195 ,  H03F3/211 ,  H03F3/213 ,  H03H7/09 ,  H03H7/1775

Abstract: Radio frequency (RF) filters configured to filter undesired signal components (e.g., noise and harmonics) from RF signals are disclosed. In one embodiment, an RF filter includes a first inductor coil having a first winding and a second inductor coil having a second winding and a third winding. The second winding of the second inductor coil is configured to have a first mutual magnetic coupling with the first winding, while the third winding of the second inductor coil is configured to have a second mutual magnetic coupling with the first winding. The second winding is connected to the third winding such that the first mutual magnetic coupling and the second mutual magnetic coupling are in opposition. In this manner, the first inductor coil and the second inductor coil may be provided in a compact arrangement while providing weak mutual magnetic coupling between the first inductor coil and the second inductor coil.

Abstract translation: 公开了用于从RF信号滤波不期望的信号分量（例如，噪声和谐波）的射频（RF）滤波器。 在一个实施例中，RF滤波器包括具有第一绕组的第一电感线圈和具有第二绕组和第三绕组的第二电感线圈。 第二电感线圈的第二绕组被配置为具有与第一绕组的第一互耦合，而第二电感线圈的第三绕组被配置为具有与第一绕组的第二互耦合耦合。 第二绕组连接到第三绕组，使得第一互磁耦合和第二互磁耦合相对。 以这种方式，第一电感线圈和第二电感线圈可以以紧凑的布置提供，同时在第一电感线圈和第二电感线圈之间提供弱的互耦合。

公开(公告)号：US10121718B2

公开(公告)日：2018-11-06

申请号：US14885202

申请日：2015-10-16

Applicant: RF Micro Devices, Inc.

Inventor： Dirk Robert Walter Leipold ,  Julio C. Costa ,  Baker Scott ,  George Maxim

IPC: H01L23/29 ,  H01L23/31 ,  H01L21/304 ,  H01L21/02 ,  H01L21/683 ,  H01L23/373 ,  H01L23/00 ,  H05K1/02 ,  H05K1/18 ,  H01Q1/50 ,  H01L23/36 ,  H01L21/56 ,  H01L23/20 ,  H01L23/367 ,  H01L21/306 ,  H01L23/522 ,  H01L49/02

CPC classification number: H01L23/315 ,  H01L21/02266 ,  H01L21/02282 ,  H01L21/304 ,  H01L21/30604 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/20 ,  H01L23/291 ,  H01L23/293 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3731 ,  H01L23/3737 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/5228 ,  H01L23/562 ,  H01L24/17 ,  H01L28/10 ,  H01L28/20 ,  H01L28/40 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/0002 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01Q1/50 ,  H05K1/0203 ,  H05K1/181 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A printed circuit module having a protective layer in place of a low-resistivity handle layer and methods for manufacturing the same are disclosed. The printed circuit module includes a printed circuit substrate with a thinned die attached to the printed circuit substrate. The thinned die includes at least one device layer over the printed circuit substrate and at least one deep well within the at least one device layer. A protective layer is disposed over the at least one deep well, wherein the protective layer has a thermal conductivity greater than 2 watts per meter Kelvin (W/mK) and an electrical resistivity of greater than 106 Ohm-cm.

公开(公告)号：US09899289B2

公开(公告)日：2018-02-20

申请号：US14885202

申请日：2015-10-16

Applicant: RF Micro Devices, Inc.

Inventor： Dirk Robert Walter Leipold ,  Julio C. Costa ,  Baker Scott ,  George Maxim

IPC: H01L23/29 ,  H01L23/31 ,  H01L21/304 ,  H01L21/02 ,  H01L21/683 ,  H01L23/373 ,  H01L23/00 ,  H05K1/02 ,  H05K1/18 ,  H01Q1/50 ,  H01L23/36 ,  H01L21/56 ,  H01L23/20 ,  H01L23/367 ,  H01L21/306 ,  H01L23/522 ,  H01L49/02

CPC classification number: H01L23/315 ,  H01L21/02266 ,  H01L21/02282 ,  H01L21/304 ,  H01L21/30604 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/20 ,  H01L23/291 ,  H01L23/293 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3731 ,  H01L23/3737 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/5228 ,  H01L23/562 ,  H01L24/17 ,  H01L28/10 ,  H01L28/20 ,  H01L28/40 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/0002 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01Q1/50 ,  H05K1/0203 ,  H05K1/181 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A printed circuit module having a protective layer in place of a low-resistivity handle layer and methods for manufacturing the same are disclosed. The printed circuit module includes a printed circuit substrate with a thinned die attached to the printed circuit substrate. The thinned die includes at least one device layer over the printed circuit substrate and at least one deep well within the at least one device layer. A protective layer is disposed over the at least one deep well, wherein the protective layer has a thermal conductivity greater than 2 watts per meter Kelvin (W/mK) and an electrical resistivity of greater than 106 Ohm-cm.