公开(公告)号：US09048348B2

公开(公告)日：2015-06-02

申请号：US14138923

申请日：2013-12-23

Applicant: Seoul Viosys Co., Ltd.

Inventor： Jong Min Jang ,  Hwa Mok Kim ,  Kyu Ho Lee ,  Chang Hoon Kim ,  Daewoong Suh ,  Chi Hyun In ,  Dae Seok Park ,  Jong Hyeon Chae

IPC: H01L21/30 ,  H01L33/00 ,  H01L33/22

CPC classification number: H01L33/0079 ,  H01L33/007 ,  H01L33/0075 ,  H01L33/0095 ,  H01L33/22

Abstract: A method of fabricating a semiconductor device, the method including: forming a first mask pattern including a masking region and an open region on a substrate; forming a sacrificial layer to cover the substrate and the first mask pattern; patterning the sacrificial layer to form a seed layer and to expose the first mask pattern; forming a second mask pattern on the exposed first mask pattern; forming an epitaxial layer on the seed layer and the second mask pattern, and forming a void between the second mask pattern and the epitaxial layer; and separating the substrate from the epitaxial layer.

Abstract translation: 一种制造半导体器件的方法，所述方法包括：在衬底上形成包括掩模区域和开放区域的第一掩模图案; 形成覆盖衬底和第一掩模图案的牺牲层; 图案化所述牺牲层以形成种子层并暴露所述第一掩模图案; 在所述暴露的第一掩模图案上形成第二掩模图案; 在种子层和第二掩模图案上形成外延层，并在第二掩模图案和外延层之间形成空隙; 以及将衬底与外延层分离。

公开(公告)号：US20150108528A1

公开(公告)日：2015-04-23

申请号：US14588878

申请日：2015-01-02

Applicant: Seoul Viosys Co., Ltd.

Inventor： Jong Hyeon Chae ,  Jong Min Jang ,  Won Young Roh ,  Dae Woong Suh ,  Min Woo Kang ,  Joon Sub Lee ,  Hyun A. Kim

IPC: H01L33/62 ,  H01L33/50 ,  H01L33/38

CPC classification number: H01L33/62 ,  H01L33/20 ,  H01L33/32 ,  H01L33/385 ,  H01L33/405 ,  H01L33/44 ,  H01L33/507 ,  H01L2224/16 ,  H01L2933/0016 ,  H01L2933/0058

Abstract: Provided is a light emitting diode (LED) in which a side surface of a reflective metal layer has a predetermined angle, and occurrence of cracks in a conductive barrier layer formed on the reflective metal layer can be prevented. Also, an LED module using LEDs is disclosed. A reflection pattern electrically connected to a second semiconductor layer is partially exposed by patterning a first insulating layer. Accordingly, a first pad is formed through the partially opened first pad region. Also, a conductive reflection layer electrically connected to a first semiconductor layer forms a second pad region formed by patterning a second insulating layer. A second pad is formed on the second pad region.

Abstract translation: 提供了一种发光二极管（LED），其中反射金属层的侧表面具有预定的角度，并且可以防止在形成在反射金属层上的导电阻挡层中产生裂纹。 此外，公开了一种使用LED的LED模块。 电连接到第二半导体层的反射图案通过图案化第一绝缘层而被部分地曝光。 因此，通过部分打开的第一焊盘区域形成第一焊盘。 而且，电连接到第一半导体层的导电反射层形成通过图案化第二绝缘层形成的第二焊盘区域。 在第二焊盘区域上形成第二焊盘。

公开(公告)号：US12176378B2

公开(公告)日：2024-12-24

申请号：US16943373

申请日：2020-07-30

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon Chae ,  Seom Geun Lee ,  Seong Kyu Jang

IPC: H01L27/15

Abstract: A display panel including a circuit board having pads thereon, and a plurality of pixel regions arranged on the circuit board, each of the pixel regions including a first LED stack disposed on the circuit board, a first bonding layer disposed between the first LED stack and the circuit board, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, first through-vias passing through the first LED stack and the first bonding layer, second through-vias passing through the second LED stack, and third through-vias passing through the third LED stack, in which the first through-vias pass through the first LED stack and the first bonding layer, and are connected to the pads of the circuit board.

公开(公告)号：US12107195B2

公开(公告)日：2024-10-01

申请号：US18098030

申请日：2023-01-17

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Chi Hyun In ,  Jun Yong Park ,  Kyu Ho Lee ,  Dae Woong Suh ,  Jong Hyeon Chae ,  Chang Hoon Kim ,  Sung Hyun Lee

IPC: H01L33/48 ,  H01L33/20 ,  H01L33/44 ,  H01L33/50 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L33/20 ,  H01L33/44 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/16 ,  H01L2933/0033

Abstract: A light emitting diode, including a first type semiconductor layer, an active layer, and a second type semiconductor layer; an ohmic contact layer disposed on the second type semiconductor layer; a first insulating layer disposed on the semiconductor structure and including a first opening overlapping the first type semiconductor layer and a second opening overlapping the ohmic contact layer; a first connection wiring disposed on the first insulating layer, the first connection wiring having a first portion and a second portion; and a second connection wiring disposed on the first insulating layer and spaced apart from the first connection wiring, the second connection wiring electrically connected to the second type semiconductor layer through the second opening. The second connection wiring surrounds at least a portion of the first portion of the first connection wiring in a plan view.

公开(公告)号：US12107081B2

公开(公告)日：2024-10-01

申请号：US18077188

申请日：2022-12-07

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon Chae ,  Chang Yeon Kim ,  Seong Gyu Jang ,  Ho Joon Lee ,  Jong Min Jang ,  Dae Sung Cho

IPC: H01L25/075 ,  H01L33/08 ,  H01L33/38 ,  H01L33/50

CPC classification number: H01L25/0753 ,  H01L33/08 ,  H01L33/38 ,  H01L33/50

Abstract: A display apparatus including a substrate, and pixel regions and at least one separation region between the pixel regions, each pixel region including a first LED stack, a second LED stack adjacent to the first LED stack, a third LED stack adjacent to the second LED stack and each having a side surface forming a first angle, a second angle, and a third angle with the substrate, respectively, electrode pads electrically connected to the first, second, and third LED stacks, and an insulation layer disposed on at least one of the first, second, and third LED stacks, in which the first LED stack is configured to emit light having a longer peak wavelength than that emitted from the second and third LED stacks, and the first angle is different from the second and third angles.

公开(公告)号：US12009384B2

公开(公告)日：2024-06-11

申请号：US17366462

申请日：2021-07-02

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon Chae ,  Chung Hoon Lee ,  Seong Gyu Jang ,  Chang Yeon Kim ,  Ho Joon Lee

IPC: H01L27/15 ,  H01L25/07 ,  H01L25/075 ,  H01L27/12 ,  H01L27/32 ,  H01L33/08 ,  H01L33/10 ,  H01L33/30 ,  H01L33/38 ,  H01L33/40 ,  H01L33/42 ,  H01L33/46 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H10K59/35 ,  H10K59/38 ,  G09G3/32 ,  H01L25/16 ,  H01L29/45 ,  H01L33/00 ,  H01L33/22 ,  H01L33/24 ,  H10K59/32 ,  H10K102/00

CPC classification number: H01L27/156 ,  H01L25/0756 ,  H01L33/10 ,  H01L33/30 ,  H01L33/405 ,  H01L33/504 ,  G09G3/32 ,  H01L25/167 ,  H01L27/1214 ,  H01L29/45 ,  H01L33/0008 ,  H01L33/0093 ,  H01L33/08 ,  H01L33/22 ,  H01L33/24 ,  H01L33/38 ,  H01L33/382 ,  H01L33/385 ,  H01L33/42 ,  H01L33/46 ,  H01L33/58 ,  H01L33/60 ,  H10K59/32 ,  H10K59/35 ,  H10K59/352 ,  H10K59/353 ,  H10K59/38 ,  H10K2102/00

Abstract: A light emitting diode (LED) stack for a display including a substrate, a first LED stack disposed on the substrate, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, a first color filter interposed between the first LED stack and the second LED stack, and a second color filter interposed between the second LED stack and the third LED stack, in which the second LED stack and the third LED stack are configured to transmit light generated from the first LED stack to the outside, and the third LED stack is configured to transmit light generated from the second LED stack to the outside.

公开(公告)号：US11973104B2

公开(公告)日：2024-04-30

申请号：US17826127

申请日：2022-05-26

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Chung Hoon Lee ,  Jong Hyeon Chae ,  Seong Gyu Jang ,  Ho Joon Lee

IPC: H01L27/15 ,  G09G3/20 ,  G09G3/32 ,  H01L25/075 ,  H01L25/16 ,  H01L33/30 ,  H01L33/40 ,  H01L33/50

CPC classification number: H01L27/156 ,  G09G3/2003 ,  G09G3/32 ,  H01L25/0756 ,  H01L33/30 ,  H01L33/405 ,  H01L33/504 ,  G09G2300/0452 ,  G09G2310/0267 ,  G09G2310/08 ,  H01L25/167

Abstract: A light emitting diode pixel for a display including a first LED sub-unit, a second LED sub-unit disposed on a first portion of the first LED sub-unit, and a third LED sub-unit disposed on a second portion of the second LED sub-unit, in which each of the first, second, and third LED sub-units includes a first conductivity type semiconductor layer and a second conductivity type semiconductor layer, light generated from the first LED sub-unit is configured to be emitted outside of the light emitting diode pixel through a third portion of the first LED sub-unit different from the first portion, and light generated from the second LED sub-unit is configured to be emitted outside of the light emitting diode pixel through a fourth portion of the second LED sub-unit different from the second portion.

公开(公告)号：US11923348B2

公开(公告)日：2024-03-05

申请号：US17963147

申请日：2022-10-10

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Seong Gyu Jang ,  Ho Joon Lee ,  Jong Hyeon Chae ,  Chung Hoon Lee

IPC: H01L33/38 ,  H01L25/075 ,  H01L25/13 ,  H01L33/40 ,  H01L33/50 ,  H01L33/00 ,  H01L33/20 ,  H01L33/62

CPC classification number: H01L25/13 ,  H01L25/0756 ,  H01L33/38 ,  H01L33/405 ,  H01L33/505 ,  H01L33/0093 ,  H01L33/20 ,  H01L33/62

Abstract: A light emitting diode pixel for a display includes a first subpixel including a first LED sub-unit, a second subpixel including a second LED sub-unit, a third subpixel including a third LED sub-unit, and a bonding layer overlapping the first, second, and third subpixels, in which each of the first, second, and third LED sub-units includes a first type of semiconductor layer and a second type of semiconductor layer, each of the first, second, and third LED sub-units is disposed on a different plane, and light generated from the second subpixel is configured to be emitted to an outside of the light emitting diode pixel by passing through a lesser number of LED sub-units than light generated from the first subpixel and emitted to the outside.

公开(公告)号：US11626391B2

公开(公告)日：2023-04-11

申请号：US17149731

申请日：2021-01-15

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon Chae

IPC: H01L25/075 ,  H01L33/62

Abstract: A light emitting device including a first LED stack, a second LED stack disposed under the first LED stack, a third LED stack disposed under the second LED stack, and a plurality of pillars disposed adjacent to side surfaces of the first, second, and third LED stacks, the pillars including a first pillar commonly electrically connected to the first, second, and third LED stacks, and a second pillar, a third pillar, and a fourth pillar electrically connected to the first, second, and third LED stacks, respectively.

公开(公告)号：US11563052B2

公开(公告)日：2023-01-24

申请号：US17366420

申请日：2021-07-02

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon Chae ,  Chung Hoon Lee ,  Seong Gyu Jang ,  Chang Yeon Kim ,  Ho Joon Lee

IPC: H01L27/15 ,  H01L27/12 ,  H01L27/32 ,  H01L25/07 ,  H01L25/16 ,  H01L33/10 ,  H01L33/30 ,  H01L33/40 ,  H01L33/50 ,  H01L33/60 ,  H01L33/38 ,  H01L33/00 ,  H01L33/08 ,  H01L33/42 ,  H01L33/46 ,  H01L33/58 ,  H01L33/22 ,  H01L33/24 ,  H01L25/075 ,  G09G3/32 ,  H01L29/45

Abstract: A light emitting diode (LED) pixel for a display including a substrate, a first LED stack disposed on the substrate, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, and through-hole vias formed through the substrate, in which each of the first, second, and third LED stacks includes a first conductivity type semiconductor layer and a second conductivity type semiconductor layer, and each of the through-hole vias is electrically connected to at least one of the first, second, and third LED stacks.