公开(公告)号：US20060138620A1

公开(公告)日：2006-06-29

申请号：US11362784

申请日：2006-02-28

申请人： Hiroshi Yagi

发明人： Hiroshi Yagi

IPC分类号： H01L23/495 ,  H01L23/28

CPC分类号： H01L23/4951 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49548 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A resin-encapsulated package includes a semiconductor IC chip, wherein the ratio of the size of the semiconductor IC chip to the package size of the resin-encapsulated package including the semiconductor IC chip is large to miniaturize the resin-encapsulated package. The resin-encapsulated package includes a semiconductor IC chip sealed in a resin molding, and a lead member having an arrangement of a plurality of discrete terminal sections. Each terminal section has inner terminal parts to be electrically connected to terminals of the semiconductor IC chip, outer terminal parts to be connected to external circuits, and connecting parts interconnecting the inner and the outer terminal parts. The contact surfaces of the inner terminal parts and the outer terminal parts face toward opposite directions, respectively. The contact surfaces of the inner terminal parts of the terminal sections are flush with each other.

公开(公告)号：US07018844B2

公开(公告)日：2006-03-28

申请号：US10856991

申请日：2004-06-01

申请人： Hiroshi Yagi ,  Masanao Watanabe ,  Takeshi Sekiguchi ,  Chikao Ikenaga ,  Makoto Nakamura

发明人： Hiroshi Yagi ,  Masanao Watanabe ,  Takeshi Sekiguchi ,  Chikao Ikenaga ,  Makoto Nakamura

IPC分类号： H01L21/44 ,  H01L21/46

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  H01F5/003 ,  H01F5/06 ,  H01F41/042 ,  H01L21/568 ,  H01L23/49855 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  Y10T436/17 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A non-contact data carrier includes a semiconductor device (11), a coil antenna (12), and a sealing resin coating (13) sealing the semiconductor device (11) and the coil antenna (12) therein. The electrodes (11a) of the semiconductor device (11) are connected to the opposite ends (12a, 12b) of the coil antenna (12) by wires (14). The surface of the coil antenna (12) opposite to the sealing resin coating (13) is covered with a protective layer (16) for protection.

摘要翻译： 非接触式数据载体包括半导体器件（11），线圈天线（12）和将半导体器件（11）和线圈天线（12）密封在其中的密封树脂涂层（13）。 半导体器件（11）的电极（11a）通过导线（14）连接到线圈天线（12）的相对端（12a，12b）。 与密封树脂涂层（13）相对的线圈天线（12）的表面被保护层（16）覆盖以进行保护。

公开(公告)号：US20050092553A1

公开(公告)日：2005-05-05

申请号：US10942107

申请日：2004-09-16

申请人： Hiroshi Yagi ,  Ryoji Uto

发明人： Hiroshi Yagi ,  Ryoji Uto

IPC分类号： B60K15/04 ,  B01D35/02 ,  B60K15/077 ,  F01M11/04 ,  F15B1/26 ,  G01F23/30 ,  G01F23/58

CPC分类号： G01F23/58

摘要： The invention is an object of the invention to provide a strainer for an oil supply mouth, preventing the oil flowing when supplying the oil from colliding with the float so as to accurately detect the height of the liquid level. The strainer for an oil supply mouth of the invention has a guide hole equipped in vertical directions and a float for an oil level gauge passing movably in vertical directions through this guide hole. When the oil comes up to an at least reference liquid level, the float is received at a lower end within the guide hole.

摘要翻译： 本发明的目的在于提供一种用于供油口的过滤器，防止油在与浮子碰撞时油流动，从而准确地检测出液面的高度。 本发明的供油口的过滤器具有沿垂直方向设置的导向孔和用于通过该导向孔在垂直方向上可移动地移动的油位计的浮子。 当油达到至少参考液位时，浮子被容纳在引导孔内的下端。

公开(公告)号：US06465734B2

公开(公告)日：2002-10-15

申请号：US09804149

申请日：2001-03-13

申请人： Syuichi Yamada ,  Makoto Nakamura ,  Takayuki Takeshita ,  Hiroshi Yagi

发明人： Syuichi Yamada ,  Makoto Nakamura ,  Takayuki Takeshita ,  Hiroshi Yagi

IPC分类号： H01L2348

CPC分类号： H01L21/6835 ,  H01L21/4828 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/49548 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2221/68377 ,  H01L2224/05599 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1433 ,  H01L2924/15311 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49169 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： There is disclosed a resin-sealed semiconductor device in which plural circuit portions integrally having inner and outer terminals are arranged two-dimensionally substantially in a plane and electrically independent of one another, and have leads for integrally interconnecting the inner and outer terminals, surfaces of the circuit portions are semiconductor element mounted faces with the inner and outer terminals and the leads forming one plane, the inner terminals and the leads are thinner than the outer terminals, back surfaces of the circuit portions are provided with terminal faces of the inner and outer terminals, a terminal mounted face of the semiconductor element is mounted via an insulating layer onto the semiconductor element mounted faces of the circuit portions, and the semiconductor element terminals are electrically connected with wires to the terminal faces of the inner terminal, and the whole is sealed with a resin in such a manner that the outer terminals are partially exposed to the outside. An occupation ratio of the semiconductor element in the semiconductor device is enhanced, the semiconductor device can be miniaturized, and a mounting density onto a circuit board can be enhanced. By forming outer electrodes on the outer terminals, multiple pins can further be provided, which is difficult with a small-sized semiconductor device such as conventional TSOP and the like.

摘要翻译： 公开了一种树脂密封半导体器件，其中整体地具有内端子和外端子的多个电路部分基本上彼此平行地布置并且彼此电独立地布置，并且具有用于将内部和外部端子， 电路部分是具有内端和外端的半导体元件安装面，并且引线形成一个平面，内端子和引线比外端子薄，电路部分的后表面设置有内外端子 端子，半导体元件的端子安装面通过绝缘层安装在电路部分的半导体元件安装面上，半导体元件端子与导线电连接到内部端子的端子面，整体上是 用树脂密封，外部端子是偏心的 y暴露在外面。 半导体器件中的半导体元件的占有率增加，可以使半导体器件小型化，并且可以提高对电路板的安装密度。 通过在外部端子上形成外部电极，可以进一步提供多个引脚，这对于诸如常规TSOP等的小尺寸半导体器件是困难的。

公开(公告)号：US6154887A

公开(公告)日：2000-12-05

申请号：US337690

申请日：1999-06-22

申请人： Hiroshi Yagi

发明人： Hiroshi Yagi

IPC分类号： A42C5/00 ,  A42B7/00

CPC分类号： A42B7/00

摘要： A headgear which includes a crown put on a head and having an insertion through portion, and a headgear blow-away preventing device including a connection member having one end provided with a clip clipped to a wear. The other end of the connection member has a stopper mechanism for avoiding the connection member from falling out of the insertion through portion of the crown.

摘要翻译： 一种头帽，其包括放置在头部上并具有插入部分的冠部，以及包括连接构件的头带防脱开装置，所述连接构件的一端设置有夹持在磨损部的夹子。 连接构件的另一端具有用于避免连接构件从冠部的插入部分脱落的止动机构。

公开(公告)号：US4829663A

公开(公告)日：1989-05-16

申请号：US173076

申请日：1988-03-25

申请人： Sho Masujima ,  Hiroshi Yagi ,  Masakazu Kamoshida ,  Atsuzo Tamashima

发明人： Sho Masujima ,  Hiroshi Yagi ,  Masakazu Kamoshida ,  Atsuzo Tamashima

IPC分类号： B23P21/00 ,  H05K3/30 ,  H05K13/00 ,  H05K13/02 ,  H05K13/04

CPC分类号： H05K13/0408 ,  H05K13/003 ,  H05K3/305 ,  H01L2224/83385 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10984 ,  H05K2203/0537 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/53178

摘要： A method of mounting surface-mounted type electronic components on a printed circuit board adapted to be carried out using an electronic component series which comprises a carrier tape formed with a plurality of tiny recess portions for receiving therein adhesives for use in temporary fixing of surface-mounted type electronic components on a printed circuit board, adhesives received in the respective recess portions, and a plurality of surface-mounted type electronic components held on the carrier tape through the adhesives. In the present invention, the taking up of the electronic component from the carrier tape is performed while pushing up the tiny recess portion of the carrier tape to cause the same portion to be deformed, so that the electronic component can be easily removed together with the adhesive from the carrier tape, and the removed electronic component is then placed on a printed circuit board to be temporarily held on the printed circuit board through the adhesive having adhered on the bottom surface of the electronic component.

摘要翻译： 一种将表面安装型电子部件安装在适于使用电子部件系列执行的印刷电路板的方法，所述电子部件系列包括形成有多个微小凹部的载带，用于在其中容纳用于临时固定表面安装型电子部件的粘合剂， 印刷电路板上的安装型电子部件，容纳在各个凹部中的粘合剂，以及通过粘合剂保持在载带上的多个表面安装型电子部件。 在本发明中，在将载带的微细凹部向上推的同时，使载带的电子部件卷绕，使得相同部分发生变形，能够容易地将电子部件与 然后将移除的电子部件放置在印刷电路板上，通过粘附在电子部件的底面上的粘合剂将其暂时保持在印刷电路板上。

公开(公告)号：US4798538A

公开(公告)日：1989-01-17

申请号：US53760

申请日：1987-05-26

申请人： Hiroshi Yagi

发明人： Hiroshi Yagi

IPC分类号： A61B5/08 ,  A63B23/02 ,  A63B23/18 ,  A63B24/00 ,  A61B5/02

CPC分类号： A63B23/0244 ,  A61B5/08 ,  A63B23/18 ,  A61B5/7239

摘要： A training instruction based on an ideal breath pattern to obtain the relaxation state in which the alpha wave mainly appears is informed by the acoustic output and/or photoelectric display in order to perform the respiration training. The state of the abdominal respiration of a person to be examined is detected by a sensor attached to the abdominal region. The detected breath pattern by the abdominal respiration is compared with the ideal breath pattern. A degree of similarity between them is informed.

摘要翻译： 为了进行呼吸训练，通过声输出和/或光电显示来通知基于理想呼吸模式获得α波主要出现的松弛状态的训练指令。 被检查者的腹部呼吸状态由附接到腹部的传感器检测。 将检测到的腹部呼吸模式与理想呼吸模式进行比较。 通知他们之间的相似程度。

公开(公告)号：US4777719A

公开(公告)日：1988-10-18

申请号：US833349

申请日：1986-02-25

申请人： Hiroshi Yagi ,  Hisashi Fujita ,  Morikazu Kamoshida ,  Yoshio Harada ,  Keiichi Ihara

发明人： Hiroshi Yagi ,  Hisashi Fujita ,  Morikazu Kamoshida ,  Yoshio Harada ,  Keiichi Ihara

IPC分类号： H05K13/04 ,  B23P19/00

CPC分类号： H05K13/0452 ,  Y10T29/5137 ,  Y10T29/53183 ,  Y10T29/53317

摘要： A simplified apparatus for automatically inserting electronic components of different forms into printed circuitboards successively conveyed along a travel path which extends along a horizontal plane includes a feed mechanism for separately and simultaneously feeding different pluralities of electronic components of different forms to a pallet operative for separately and simultaneously receiving and conveying the electronic components to an inserting device operative for separately and simultaneously inserting the electronic components into successive printed circuitboards, each board in its turn.

摘要翻译： 用于将不同形式的电子部件自动插入沿着沿着水平面延伸的行进路径连续输送的印刷电路板的简化装置包括用于分别地并且同时地将不同形式的不同多个电子部件供给到单独操作的托盘的进给机构， 同时将电子部件接收并传送到插入装置，该插入装置可操作用于单独并同时将电子部件插入连续的印刷电路板中，每个板依次插入。

公开(公告)号：US4750263A

公开(公告)日：1988-06-14

申请号：US741303

申请日：1985-06-04

申请人： Hiroshi Yagi ,  Tetsuro Ito ,  Yoshio Harada

发明人： Hiroshi Yagi ,  Tetsuro Ito ,  Yoshio Harada

IPC分类号： H05K13/04 ,  H05K3/32

CPC分类号： H05K13/0417 ,  Y10T29/49139 ,  Y10T29/5142 ,  Y10T29/53183

摘要： Apparatus for supplying and transferring electronic components includes a plurality of pallets each for receiving and holding one electronic component. An endless conveying mechanism conveys the pallets in and intermittent fashion on a substantially horizontal plane. A supply unit mechanism selectively supplies electronic components to the pallets.

摘要翻译： 用于提供和传送电子部件的装置包括多个用于接收和保持一个电子部件的托盘。 无端输送机构将托盘以间歇方式传送到基本水平的平面上。 供应单元机构选择性地将电子部件供应到托盘。

公开(公告)号：US4590659A

公开(公告)日：1986-05-27

申请号：US486423

申请日：1983-04-19

申请人： Hiroshi Yagi ,  Yoshio Harada

发明人： Hiroshi Yagi ,  Yoshio Harada

IPC分类号： H01R43/20 ,  H05K13/04 ,  B23D15/04

CPC分类号： H05K13/0417 ,  H01R43/205 ,  Y10T29/49139 ,  Y10T29/5142 ,  Y10T29/5149

摘要： Apparatus for inserting square pins into a printed circuit board wherein during one stroke of a master cylinder, each square pin is cut by a movable cutter in combination with a fixed cutter from an elongated square pin-forming wire held in a chuck. The square pin is held by the movable cutter and then is moved over a guide member and then is further transferred into the guide member in accordance with the movement of a push rod moved by a main slider actuated by the master cylinder. The square pin is finally inserted into a printed circuit board by further movement of the push rod.

摘要翻译： 用于将方形销插入印刷电路板的装置，其中在主缸的一个行程期间，每个方形销由可移动刀具与来自固定在卡盘中的细长方形销形成线的固定切割器组合地切割。 方形销由可动刀具保持，然后在引导构件上移动，然后根据由主缸驱动的主滑块移动的推杆的移动进一步转移到引导构件中。 方形销最后通过推杆的进一步移动插入印刷电路板。