Abstract:
A non-volatile memory cell has a substrate layer with a fin shaped semiconductor member of a first conductivity type on the substrate layer. The fin shaped member has a first region of a second conductivity type and a second region of the second conductivity type, spaced apart from the first region with a channel region extending between the first region and the second region. The fin shaped member has a top surface and two side surfaces between the first region and the second region. A word line is adjacent to the first region and is capacitively coupled to the top surface and the two side surfaces of a first portion of the channel region. A floating gate is adjacent to the word line and is insulated from the top surface and is capacitively coupled to the two side surfaces of a second portion of the channel region. A coupling gate is capacitively coupled to the floating gate. An erase gate is insulated from the second region and is adjacent to the floating gate and coupling gate.
Abstract:
Various circuits include MOS transistors that have a bulk voltage terminal for receiving a bulk voltage that is different from a supply voltage and ground. The bulk voltage may be selectively set so that some MOS transistors have a bulk voltage set to the supply voltage or ground and other MOS transistors have a bulk voltage that is different. The bulk voltage may be set to forward or reverse bias pn junctions in the MOS transistor. The various circuits include comparators, operational amplifiers, sensing circuits, decoding circuits and the other circuits. The circuits may be included in a memory system.
Abstract:
Systems of electrically programmable and erasable memory cell are disclosed. In one exemplary implementation, a cell may have two storage transistors in a substrate of semiconductor material of a first cooductivity type The first storage transistor is of the type having a first region and a second region each of a second conductivity type in the substrate The second storage transistor is of the type having a third region and a fourth region each of a second conductivity type in the substrate. Arrays formed of such memory cells and non-volatile memory cells are also disclosed.
Abstract:
Systems and methods associated with semiconductor articles are disclosed, including forming a first layer of material on a substrate, etching trenches within regions defining a passive element in the first layer, forming metal regions on sidewalls of the trenches, and forming a region of dielectric or polymer material over or in the substrate. Moreover, an exemplary method may also include forming areas of metal regions on the sidewalls of the trenches such that planar strip portions of the areas form electrically conductive regions of the passive element(s) that are aligned substantially perpendicularly with respect to a primary plane of the substrate. Other exemplary embodiments may comprise various articles or methods including capacitive and/or inductive aspects, Titanium- and/or Tantalum-based resistive aspects, products, products by processes, packages and composites consistent with one or more aspects of the innovations set forth herein.
Abstract:
Nonvolatile flash memory systems and methods are disclosed having a semiconductor substrate of a first conductivity type, including non-diffused channel regions through which electron flow is induced by application of voltage to associated gate elements. A plurality of floating gates are spaced apart from one another and each insulated from the channel region. A plurality of control gates are spaced apart from one another and insulated from the channel region, with each control gate being located between a first floating gate and a second floating gate and capacitively coupled thereto to form a subcell. A plurality of spaced-apart assist gates are insulated from the channel region, with each assist gate being located between and insulated from adjacent subcells. The channel is formed of three regions, two beneath adjacent control gate elements as well as a third region between the first two and beneath an associated assist gate.
Abstract:
A digital multilevel memory system includes a charge pump and a voltage regulator for generating regulated high voltages for various memory operations. The charge pump may include a plurality of boost circuits to boost the output of the charge pump during a fast start up. Afterwards, the boost circuits are disabled to allow the charge pump to generate high voltages without boosting. The boost circuits may be successively enabled to boost the voltage. The boost circuits may be loadless. The voltage regulator may operate in an open loop and may include a resistive divider as a reference voltage for regulating the high voltage from the charge pump. The charge pump may include spread spectrum pump clocking to reduce electromagnetic inference for capacitor or inductor on-chip charge pumping.
Abstract:
A method of forming an array of floating gate memory cells, and an array formed thereby, wherein each memory cell includes a substrate of semiconductor material having a first conductivity type, source and drain regions formed in the substrate, a block of conductive material disposed over and electrically connected to the source, and a floating gate having a first portion disposed over and insulated from the source region and a second portion disposed over and insulated from the channel region. The floating gate first portion includes a sloped upper surface and a side surface that meet at an acute edge. An electrically conductive control gate is disposed over and insulated from the channel region for controlling a conductivity thereof.
Abstract:
A memory system includes a sense amplifier for detecting content of data memory cells by comparison with a voltage stored in a reference cell. The sense amplifier may comprise a comparator, first and second load circuits, and a low impedance circuit. A first input of the comparator is coupled to the low impedance circuit and a reference voltage node. A second input of the comparator is coupled to a data voltage node. The first load circuit loads a reference cell coupled to the reference voltage node. The second load circuit loads a data cell coupled to the data voltage node.
Abstract:
A non-volatile memory device comprises an interface circuit for receiving a plurality of signals. The plurality of signals provides multiplexed address and data and command signals in a serial format. An input buffer stores a plurality of the plurality of signals received in serial format and reconstitutes the address, data and command signals, and has an output. A command circuit receives the output of the input buffer and stores the command signals therefrom. An address circuit receives the output of the input buffer and stores the address signals therefrom. A data buffer circuit receives the output of the input buffer and stores the data signals therefrom. An array of non-volatile memory cells stores data from and provides data to the data buffer in response to address signals from the address decoder. A state machine is connected to the command circuit and controls the array of non-volatile memory cells. An output buffer receives data from the data buffer circuit and provides data to the interface circuit.
Abstract:
An output buffer circuit for a non-volatile memory stores a plurality of data bits and a plurality of error correction check (“ECC”) bits associated with the plurality of data bits. The output buffer circuit comprises an error check circuit for receiving the plurality of data bits and the plurality of ECC bits to determine if the plurality of data bits need to be corrected. The error check circuit supplies the plurality of data bits as its output, and generates a correction signal. An error correction circuit receives the plurality of data hits and the plurality of ECC bits and generates a plurality of corrected data bits in response to the correction signal. The output buffer circuit further has three or more storage circuits with each storage circuit having an input/output port. A bus connects to each of the storage circuits and to each other and supplies data bits between each storage circuit and between the nonvolatile memory and the storage circuits, and supplies data bits as the output of the output buffer circuit. A switch circuit is associated with each storage circuit for receiving the plurality of data bits; or the plurality of corrected data bits, and supplies same to the input/output port of the associated storage circuit and stores same as storage bits in the storage circuit, and supplies the storage bits as output of the storage circuit.