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公开(公告)号：US08259460B2
公开(公告)日：2012-09-04
申请号：US12303572
申请日：2007-06-05
Applicant: Rabin Bhattacharya , Pieter Jacob Snijder , Liesbeth Van Pieterson , Erich Zainzinger , Martijn Krans , Sima Asvadi , Alexander Ulrich Douglas , Jacqueline Van Driel , Martinus Jacobus Johannes Hack
Inventor： Rabin Bhattacharya , Pieter Jacob Snijder , Liesbeth Van Pieterson , Erich Zainzinger , Martijn Krans , Sima Asvadi , Alexander Ulrich Douglas , Jacqueline Van Driel , Martinus Jacobus Johannes Hack
CPC classification number: H05K3/301 , H05K1/038 , H05K3/308 , H05K3/321 , H05K2201/029 , H05K2201/10106 , H05K2201/10325 , H05K2201/10651 , H05K2201/10818 , H05K2201/10825 , H05K2201/10962 , H05K2201/209 , H05K2203/1446
Abstract: A submount for arranging electronic components on a substrate is provided. The submount comprises a head member and at least one substrate-engaging member protruding from the head member. The head member comprises at least two, from each other isolated, electrically conductive portions, where each electrically conductive portion comprises a component contact, adapted for connection of electronic components thereto, and a substrate contact on arranged on said substrate side, adapted for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate. The submount of the present invention may be used to attach electronic components, such as light-emitting diodes, to a textile substrate, without the need for soldering the electronic component directly on the substrate.
Abstract translation: 提供了一种用于在基板上布置电子部件的基座。 底座包括头部构件和从头部构件突出的至少一个衬底接合构件。 头部构件包括彼此隔离的导电部分中的至少两个，其中每个导电部分包括适于将电子部件连接到其上的部件接触件和布置在所述基板侧上的基板接触件，适于使所述 与包括在所述衬底中的电路接触的导电部分。 本发明的基座可以用于将诸如发光二极管的电子部件附接到纺织品基板，而不需要将电子部件直接焊接在基板上。
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82.发明授权公开(公告)号：US08162671B2
公开(公告)日：2012-04-24
申请号：US12837517
申请日：2010-07-16
Applicant: Ryou Matsubara , Shouichi Mimura , Hirotsugu Fusayasu , Masafumi Kumoi , Toshiyuki Nakaie
Inventor： Ryou Matsubara , Shouichi Mimura , Hirotsugu Fusayasu , Masafumi Kumoi , Toshiyuki Nakaie
IPC: H01R12/00
CPC classification number: H01R43/16 , H01R12/724 , H01R13/6582 , H05K1/111 , H05K1/141 , H05K3/3426 , H05K2201/0373 , H05K2201/09709 , H05K2201/09727 , H05K2201/1034 , H05K2201/10757 , H05K2201/10818 , Y02P70/611
Abstract: A receptacle structure includes a housing structure, a terminal insulating board, a first terminal and a second terminal. The housing structure is configured to be mounted on a printed wiring board and to accommodate a plug. The terminal insulating board includes a top face and a bottom face that is opposite to the top face. The terminal insulating board is disposed inside the housing structure with the bottom face facing towards the printed wiring board. The first terminal is connected to the printed wiring board via the first rear connection part and to the terminal insulating board. The second terminal is connected to the printed wiring board via the first front connection part and to the terminal insulating board. The first front connection part has a width narrower than the first rear connection part and is connected to the printed wiring board away from the first rear connection part.
Abstract translation: 插座结构包括壳体结构，端子绝缘板，第一端子和第二端子。 壳体结构被配置为安装在印刷线路板上并容纳插头。 端子绝缘板包括顶面和与顶面相对的底面。 端子绝缘板设置在壳体结构内部，底面朝向印刷线路板。 第一端子经由第一后连接部和端子绝缘板与印刷电路板连接。 第二端子经由第一前连接部和端子绝缘板与印刷电路板连接。 第一前连接部分具有比第一后连接部分窄的宽度，并且与第一后连接部分连接到印刷线路板。
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公开(公告)号：US20120007136A1
公开(公告)日：2012-01-12
申请号：US13240871
申请日：2011-09-22
Applicant: Kyong Jun KIM
Inventor： Kyong Jun KIM
IPC: H01L33/62
CPC classification number: F21V23/00 , F21K9/00 , G02B6/0031 , G02B6/0068 , G02B6/0083 , G02B6/0085 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H05K1/189 , H05K3/0058 , H05K3/281 , H05K3/3426 , H05K3/3452 , H05K2201/10106 , H05K2201/10651 , H05K2201/10818 , H05K2201/2009 , H05K2203/0577 , Y02P70/613 , H01L2924/00012 , H01L2924/00014
Abstract: Provides are a light emitting apparatus and a light unit having the same. The light emitting apparatus comprises a light emitting device comprising a light emitting element and a plurality of external leads, and a plurality of electrode pads under the light emitting device.
Abstract translation: 提供一种发光装置和具有该发光装置的光单元。 发光装置包括发光装置，其包括发光元件和多个外部引线，以及在发光器件下方的多个电极焊盘。
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公开(公告)号：US08052321B2
公开(公告)日：2011-11-08
申请号：US12365483
申请日：2009-02-04
Applicant: Kyong Jun Kim
Inventor： Kyong Jun Kim
IPC: F21V7/04
CPC classification number: F21V23/00 , F21K9/00 , G02B6/0031 , G02B6/0068 , G02B6/0083 , G02B6/0085 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H05K1/189 , H05K3/0058 , H05K3/281 , H05K3/3426 , H05K3/3452 , H05K2201/10106 , H05K2201/10651 , H05K2201/10818 , H05K2201/2009 , H05K2203/0577 , Y02P70/613 , H01L2924/00012 , H01L2924/00014
Abstract: Provides are a light emitting apparatus and a light unit having the same. The light emitting apparatus comprises a light emitting device comprising a light emitting element and a plurality of external leads, and a plurality of electrode pads under the light emitting device.
Abstract translation: 提供一种发光装置和具有该发光装置的光单元。 发光装置包括发光装置，其包括发光元件和多个外部引线，以及在发光器件下方的多个电极焊盘。
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公开(公告)号：US07960740B2
公开(公告)日：2011-06-14
申请号：US12012379
申请日：2008-02-01
Applicant: Sheng-Jia Sheu , Chien-Chang Pei
Inventor： Sheng-Jia Sheu , Chien-Chang Pei
IPC: H01L33/00
CPC classification number: H05K3/326 , H01L33/62 , H01L2924/0002 , H05K3/202 , H05K2201/0382 , H05K2201/10106 , H05K2201/10651 , H05K2201/10818 , H05K2201/1084 , Y10T29/41 , H01L2924/00
Abstract: A structure of a light emitting diode is provided. The light emitting diode comprises a light emitting diode die; two conductive frames electronically and respectively connecting to the cathode and anode of the light emitting diode die, and two substrates. Each conductive frame has a fixing hole and each substrate has a protrusive pillar. The upper opening of the fixing hole is broader than the bottom opening. The protrusive pillar is inserted into the fixing hole and the shape of the protrusive pillar is deformed for fitting and binding with the fixing hole.
Abstract translation: 提供发光二极管的结构。 发光二极管包括发光二极管管芯; 电子地分别连接到发光二极管管芯的阴极和阳极的两个导电框架和两个基板。 每个导电框架具有固定孔，并且每个基板具有突出支柱。 固定孔的上部开口比底部开口宽。 突出柱插入到固定孔中，突出柱的形状变形以与固定孔嵌合。
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Patent Agency Ranking
公开(公告)号：US07948007B2
公开(公告)日：2011-05-24
申请号：US11403169
申请日：2006-04-12
Applicant: Jürgen Steger , Yvonne Manz
Inventor： Jürgen Steger , Yvonne Manz
IPC: H01L23/02
CPC classification number: H01L25/072 , H01L23/492 , H01L23/49811 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/49111 , H01L2924/00014 , H01L2924/19107 , H01L2924/30107 , H05K1/0306 , H05K1/142 , H05K3/0061 , H05K3/222 , H05K3/3426 , H05K2201/10818 , H05K2201/1084 , Y02P70/613 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A power semiconductor module includes a housing, terminal elements leading to the outside of the housing, an electrically insulated substrate arranged inside the housing, with the substrate being comprised of an insulating body and having on the first main face facing away from the base plate a plurality of connecting tracks electrically insulated from each other. The terminal and connecting elements are arranged on a connecting track in with contact faces contacting connecting tracks or power semiconductor components, with the individual contact faces having a plurality of partial contact faces. In one optional embodiment, each partial contact face has a maximum area of 20 mm2. In another embodiment, partial contact faces each are arranged at a distance of approximately 5 mm with regard to each other and the connection of the partial faces to the connecting tracks or the power semiconductor components is flush.
Abstract translation: 功率半导体模块包括壳体，通向壳体外部的端子元件，布置在壳体内部的电绝缘基板，其中基板由绝缘体构成，并且在第一主面上背离基板a 多个连接轨道彼此电绝缘。 端子和连接元件布置在连接轨道上，接触面接触连接轨道或功率半导体部件，各个接触面具有多个部分接触面。 在一个可选实施例中，每个部分接触面的最大面积为20mm 2。 在另一个实施例中，部分接触面各自相对于彼此以大约5mm的距离布置，并且部分面与连接轨道或功率半导体部件的连接是齐平的。
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公开(公告)号：US20110103061A1
公开(公告)日：2011-05-05
申请号：US13004666
申请日：2011-01-11
Applicant: Kyong Jun KIM
Inventor： Kyong Jun KIM
CPC classification number: F21V23/00 , F21K9/00 , G02B6/0031 , G02B6/0068 , G02B6/0083 , G02B6/0085 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H05K1/189 , H05K3/0058 , H05K3/281 , H05K3/3426 , H05K3/3452 , H05K2201/10106 , H05K2201/10651 , H05K2201/10818 , H05K2201/2009 , H05K2203/0577 , Y02P70/613 , H01L2924/00012 , H01L2924/00014
Abstract: A light emitting apparatus includes a light emitting diode including a body with a light emitting diode chip packaged therein and a plurality of lead electrodes contacted with one side of the body and a board including a plurality of electrode pads connected to lower surfaces of the lead electrodes of the light emitting diode. The lower surfaces of the lead electrodes of the light emitting diode correspond to top surfaces of electrode pads of the board with same shapes. The lower surfaces of the lead electrodes of the light emitting diode are disposed within a region of top surfaces of the electrode pads of the board, respectively.
Abstract translation: 发光装置包括：发光二极管，包括具有封装在其中的发光二极管芯片的主体和与本体的一侧接触的多个引线电极;以及板，包括连接到引线电极的下表面的多个电极焊盘 的发光二极管。 发光二极管的引线电极的下表面对应于具有相同形状的电路板的电极焊盘的顶表面。 发光二极管的引线电极的下表面分别设置在电路板的电极焊盘的顶表面的区域内。
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公开(公告)号：US07632150B2
公开(公告)日：2009-12-15
申请号：US12007017
申请日：2008-01-04
Applicant: Ming-Ta Chen
Inventor： Ming-Ta Chen
IPC: H01M2/10
CPC classification number: H01R43/0256 , H01M10/425 , H05K1/116 , H05K3/3405 , H05K3/3447 , H05K3/403 , H05K2201/09181 , H05K2201/09463 , H05K2201/09854 , H05K2201/10818
Abstract: A printed circuit board (PCB), which can be implemented on a battery set, having a plurality of soldering holes thereon. A soldering portion and a non-soldering portion are separately arranged around each of the soldering holes on both surfaces of the PCB. Each corresponding conductive stick can respectively pierce each soldering hole and be fixed to each soldering portion of the PCB with the fused solder or move from the soldering portion to the non-soldering portion in the soldering hole. Thus, this invention provides a convenient and efficient way for assembling the PCB on the battery set or disassembling the PCB apart from the battery set.
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公开(公告)号：US20080203422A1
公开(公告)日：2008-08-28
申请号：US12012379
申请日：2008-02-01
Applicant: Sheng-Jia Sheu , Chien-Chang Pei
Inventor： Sheng-Jia Sheu , Chien-Chang Pei
IPC: H01L33/00
CPC classification number: H05K3/326 , H01L33/62 , H01L2924/0002 , H05K3/202 , H05K2201/0382 , H05K2201/10106 , H05K2201/10651 , H05K2201/10818 , H05K2201/1084 , Y10T29/41 , H01L2924/00
Abstract: A structure of a light emitting diode is provided. The light emitting diode comprises a light emitting diode die; two conductive frames electronically and respectively connecting to the cathode and anode of the light emitting diode die, and two substrates. Each conductive frame has a fixing hole and each substrate has a protrusive pillar. The upper opening of the fixing hole is broader than the bottom opening. The protrusive pillar is inserted into the fixing hole and the shape of the protrusive pillar is deformed for fitting and binding with the fixing hole.
Abstract translation: 提供发光二极管的结构。 发光二极管包括发光二极管管芯; 电子地分别连接到发光二极管管芯的阴极和阳极的两个导电框架和两个基板。 每个导电框架具有固定孔，并且每个基板具有突出支柱。 固定孔的上部开口比底部开口宽。 突出柱插入到固定孔中，突出柱的形状变形以与固定孔嵌合。
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公开(公告)号：US07278853B1
公开(公告)日：2007-10-09
申请号：US11425171
申请日：2006-06-20
Applicant: William L. Brodsky
Inventor： William L. Brodsky
IPC: H01R12/00
CPC classification number: H05K3/366 , H05K2201/10189 , H05K2201/10818
Abstract: Electrically conductive L-shaped blades are disposed in an insulative body as a mechanism for mechanically and electrically connecting circuit cards to circuit boards. In particular, the interconnection device herein provides a mechanism for providing greater thermal and electrical properties for connections from voltage regulator modules to high current conducting planes within a printed wire board while at the same time increasing the available bulk material cross-sectional area available for current flow.
Abstract translation: 导电L形叶片设置在绝缘体中，作为将电路卡机械地和电连接到电路板的机构。 特别地，本文中的互连装置提供了一种机制，用于为印刷线路板内的电压调节器模块到高电流传导平面的连接提供更大的热和电特性，同时增加可用于电流的可用体积材料横截面积 流。
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