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公开(公告)号：US07868430B2
公开(公告)日：2011-01-11
申请号：US12238468
申请日：2008-09-26
申请人： Stefan Paulus , Manfred Fries , Martin Petz , Thomas Mueller
发明人： Stefan Paulus , Manfred Fries , Martin Petz , Thomas Mueller
IPC分类号： H01L29/72
CPC分类号： H01L23/49861 , H01L23/24 , H01L24/48 , H01L24/49 , H01L24/83 , H01L2224/45014 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/83 , H01L2924/00014 , H01L2924/01068 , H01L2924/01078 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： This application relates to a semiconductor device comprising multiple separate leads molded in a molded structure, and a chip attached to the molded structure over at least two of the multiple separate leads.
摘要翻译： 本申请涉及包括模制在模制结构中的多个分离引线的半导体器件，以及在多个分离引线中的至少两个上连接到模制结构的芯片。
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公开(公告)号：US08174426B2
公开(公告)日：2012-05-08
申请号：US12887567
申请日：2010-09-22
申请人： Stephan Henzler
发明人： Stephan Henzler
IPC分类号： H03M1/50
CPC分类号： G04F10/005
摘要： A method and a system for converting time intervals are provided. In one embodiment, the system comprises a first time-to-digital converter having a first resolution configured to convert a first time interval, a second time-to-digital converter having a second resolution configured to convert a second time interval, and a third time-to-digital converter having a third resolution and coupled to the first time-to-digital converter and the second time-to-digital converter, the third time-to-digital converter configured to convert a third time interval and a fourth time interval.
摘要翻译： 提供了一种用于转换时间间隔的方法和系统。 在一个实施例中，该系统包括具有被配置为转换第一时间间隔的第一分辨率的第一时间数字转换器，具有被配置为转换第二时间间隔的第二分辨率的第二时间数字转换器，以及第三时间 时间数字转换器，其具有第三分辨率并耦合到第一时间数字转换器和第二时间 - 数字转换器，第三时间数字转换器被配置为将第三时间间隔和第四时间 间隔。
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公开(公告)号：US07911039B2
公开(公告)日：2011-03-22
申请号：US11860556
申请日：2007-09-25
IPC分类号： H01L23/495
CPC分类号： H05K3/284 , H01L23/3107 , H01L23/4334 , H01L23/49531 , H01L24/48 , H01L25/162 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2924/00014 , H01L2924/01068 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , H05K1/0306 , H05K1/142 , H05K2201/09063 , H05K2201/09072 , H05K2201/1034 , H05K2201/10977 , H05K2203/049 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A component arrangement comprising a carrier, a component in a housing with electrical contacts and a moulding compound that encloses the carrier, the semiconductor component in the housing and the electrical contacts, wherein the component is applied on the carrier, and wherein the carrier is provided with holes, and a method for producing a component arrangement, wherein the carrier is provided with holes, the component is positioned on the carrier, the component is connected to the carrier, the component with the carrier is positioned in the leadframe, and this arrangement is enclosed by a moulding compound.
摘要翻译： 一种部件装置，包括载体，具有电触头的壳体中的部件和封装载体的模制化合物，壳体中的半导体部件和电触点，其中将部件施加在载体上，并且其中提供载体 具有孔，以及用于制造部件布置的方法，其中，所述载体设置有孔，所述部件位于所述载体上，所述部件连接到所述载体，所述部件与所述载体位于所述引线框架中，并且所述布置 被模塑料包围。
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公开(公告)号：US07847375B2
公开(公告)日：2010-12-07
申请号：US12185829
申请日：2008-08-05
申请人： Joachim Mahler , Ralf Wombacher , Ralf Otremba
发明人： Joachim Mahler , Ralf Wombacher , Ralf Otremba
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , B81C1/00253 , H01L23/49513 , H01L23/49524 , H01L24/33 , H01L24/40 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/40247 , H01L2224/45014 , H01L2224/45015 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73219 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/83825 , H01L2224/8384 , H01L2224/85205 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01068 , H01L2924/01078 , H01L2924/01082 , H01L2924/078 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/00 , H01L2224/83205 , H01L2924/2076 , H01L2224/37099
摘要： This application relates to a semiconductor device, the semiconductor device comprising a metal carrier, an insulating foil partially covering the metal carrier, a first chip attached to the metal carrier over the insulating foil, and a second chip attached to the metal carrier over a region not covered by the insulating foil.
摘要翻译： 本申请涉及一种半导体器件，该半导体器件包括金属载体，部分覆盖金属载体的绝缘箔，在绝缘箔上连接到金属载体上的第一芯片，以及在区域上附着到金属载体上的第二芯片 不被绝缘箔覆盖。
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5.发明授权Apparatus and system with a time delay path and method for propagating a timing event 有权具有时间延迟路径的装置和系统以及用于传播定时事件的方法公开(公告)号：US08243555B2
公开(公告)日：2012-08-14
申请号：US12187404
申请日：2008-08-07
申请人： Stephan Henzler , Siegmar Koeppe
发明人： Stephan Henzler , Siegmar Koeppe
CPC分类号： G04F10/00 , G04F10/005 , H03K5/133 , H03K2005/00123 , H03K2005/0013 , H03K2005/00143
摘要： Implementations are presented herein that include a time delay path.
摘要翻译： 这里给出了包括时间延迟路径的实现。
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公开(公告)号：US08637367B2
公开(公告)日：2014-01-28
申请号：US13207056
申请日：2011-08-10
申请人： Martin Poelzl
发明人： Martin Poelzl
IPC分类号： H01L21/336
CPC分类号： H01L29/7813 , H01L29/407 , H01L29/42368 , H01L29/66734
摘要： Method for producing an insulation layer between a first electrode and a second electrode in a trench of a semiconductor body, wherein the method comprises the following features: providing a semiconductor body with a trench formed therein, wherein a first electrode is formed in a lower part of the trench, producing an insulation layer on the first electrode and at the sidewalls of the trench in an upper part of the trench in such a way that the insulation layer is formed in a U-shaped fashion in the trench, producing a protective layer on the insulation layer at least at the bottom of the remaining void in the trench, removing the insulation layer at the sidewalls of the trench in the upper part of the trench, removing the protective layer, producing a second electrode at least on the insulation layer above the first electrode.
摘要翻译： 一种在半导体主体的沟槽中的第一电极和第二电极之间制造绝缘层的方法，其中所述方法包括以下特征：提供半导体本体，其中形成有沟槽，其中第一电极形成在下部 在沟槽的上部的第一电极和沟槽的侧壁处产生绝缘层，使得绝缘层在沟槽中形成为U形形式，从而产生保护层 至少在沟槽中的剩余空隙的底部的绝缘层上，去除沟槽上部沟槽侧壁处的绝缘层，去除保护层，至少在绝缘层上产生第二电极 在第一电极之上。
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公开(公告)号：US08552906B2
公开(公告)日：2013-10-08
申请号：US12722511
申请日：2010-03-11
CPC分类号： H03D7/00 , H03D2200/0045
摘要： A mixer for mixing a received signal and a local oscillator signal is provided. The local oscillator signal is modulated by means of a modulation signal and the modulated local oscillator signal is injected into the received signal.
摘要翻译： 提供了一种用于混合接收信号和本地振荡器信号的混频器。 本地振荡器信号通过调制信号进行调制，并将调制的本地振荡器信号注入到接收信号中。
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公开(公告)号：US08143694B2
公开(公告)日：2012-03-27
申请号：US12131134
申请日：2008-06-02
申请人： Vianney Choserot , Gunther Lehmann , Franz Ungar
发明人： Vianney Choserot , Gunther Lehmann , Franz Ungar
IPC分类号： H01L23/52
CPC分类号： G11C17/16 , G11C17/18 , H01L23/5256 , H01L2924/0002 , H01L2924/00
摘要： Implementations are presented herein that relate to a fuse device, an integrated circuit including a fuse device, a method of implementing a fuse device and a method of programming a fuse device.
摘要翻译： 本文提供了与保险丝装置，包括熔丝装置的集成电路，实现熔丝装置的方法和编程熔丝装置的方法相关的实施方式。
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公开(公告)号：US08093689B2
公开(公告)日：2012-01-10
申请号：US11772272
申请日：2007-07-02
IPC分类号： H01L23/58
CPC分类号： H01L23/60 , H01L2223/6677 , H01L2924/0002 , H01L2924/3011 , H01L2924/3025 , H01L2924/00
摘要： A semiconductor sensor device is electrically coupled to an object. An attachment member attaches the semiconductor sensor device to the object. The attachment member comprises a first conductive contact region and a second conductive contact region. An insulating portion is electrically isolates the semiconductor sensor device from the first conductive contact region and second conductive contact region.
摘要翻译： 半导体传感器装置电耦合到物体。 附接构件将半导体传感器装置附接到物体。 附接构件包括第一导电接触区域和第二导电接触区域。 绝缘部分将半导体传感器装置与第一导电接触区域和第二导电接触区域电隔离。
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10.发明授权Circuit arrangement with a test circuit and a reference circuit and corresponding method 有权具有测试电路和参考电路的电路布置及相应的方法公开(公告)号：US08081003B2
公开(公告)日：2011-12-20
申请号：US12363839
申请日：2009-02-02
CPC分类号： G01R31/3181 , G01R31/2856 , G01R31/3016 , G01R31/31703
摘要： Implementations are presented herein that include a test circuit and a reference circuit.
摘要翻译： 本文给出了包括测试电路和参考电路的实现。
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