摘要:
FIG. 1 is a top perspective view of the block stacking game; FIG. 2 is a top perspective exploded view thereof; FIG. 3 is a top view thereof; FIG. 4 is a bottom view thereof; FIG. 5 is a right side view thereof; FIG. 6 is a left side view thereof; FIG. 7 is a back view thereof; and, FIG. 8 is a front view thereof. The claim is directed to the collective appearance of the block stacking game set shown in the figures. The components of the set are arranged on the drawing sheet for the convenience of illustration, and the relative positioning of the block stacking game forms no part of the claimed design.
摘要:
The present invention relates to a method for producing a conductor structural element, comprising providing a rigid substrate, electrodepositing a copper coating on the rigid substrate, applying a conductor pattern structure to the copper coating, then possibly mounting components, laminating the substrate with at least one electrically insulating layer, detaching the rigid substrate, at least partially removing the remaining copper coating of the rigid substrate in such a way that the conductor pattern structure is exposed.
摘要:
In accordance with the aspects of the present disclosure, a method and apparatus is disclosed for imaging interferometric microscopy (IIM), which can use an immersion medium to enhance resolution up to a resolution of linear systems resolution limit of λ/4n, where λ is the wavelength in free space and n is the index of refraction of a transmission medium.
摘要:
In accordance with the invention, there are imaging interferometric microscopes and methods for imaging interferometric microscopy using structural illumination and evanescent coupling for the extension of imaging interferometric microscopy. Furthermore, there are coherent anti-Stokes Raman (CARS) microscopes and methods for coherent anti-Stokes Raman (CARS) microscopy, wherein imaging interferometric microscopy techniques are applied to get material dependent spectroscopic information.
摘要:
In a method for producing an electronic subassembly, at least one electronic component is fixed in place on an insulating layer of a conductive foil in a first step, the conductive foil with the electronic component is laminated onto a circuit board substrate, and a circuit track structure is then developed by structuring the conductive foil. The expansion coefficient of the insulating layer lies between the expansion coefficient of the circuit board substrate and the expansion coefficient of the circuit track structure, and/or electronic components that require small passages for contacting with the circuit track structure are pressed deeper into the insulating layer than electronic components that require larger passages in the insulating layer.
摘要:
Exemplary embodiments provide an image interferometric microscope (IIM) and methods for image interferometric microscopy. The disclosed IIM can approach the linear systems limits of optical resolution by using a plurality of off-axis illuminations to access high spatial frequencies along with interferometric reintroduction of a zero-order reference beam on the low-NA side of the optical system. In some embodiments, a thin object can be placed normal to the optical axis and the frequency space limit can be extended to about [(1+NA)n/λ], where NA is the numerical-aperture of the objective lens used, n is the refraction index of the transmission medium and λ is an optical wavelength. In other embodiments, tilting the object plane can further allow collection of diffraction information up to the material transmission bandpass limited spatial frequency of about 2n/λ.
摘要:
In accordance with the aspects of the present disclosure, a method and apparatus is disclosed for imaging interferometric microscopy (IIM), which can use an immersion medium to enhance resolution up to a resolution of linear systems resolution limit of λ/4n, where λ is the wavelength in free space and n is the index of refraction of a transmission medium.
摘要:
Exemplary embodiments provide an image interferometric microscope (IIM) and methods for image interferometric microscopy. The disclosed IIM can approach the linear systems limits of optical resolution by using a plurality of off-axis illuminations to access high spatial frequencies along with interferometric reintroduction of a zero-order reference beam on the low-NA side of the optical system. In some embodiments, a thin object can be placed normal to the optical axis and the frequency space limit can be extended to about [(1+NA)n/λ], where NA is the numerical-aperture of the objective lens used, n is the refraction index of the transmission medium and λ is an optical wavelength. In other embodiments, tilting the object plane can further allow collection of diffraction information up to the material transmission bandpass limited spatial frequency of about 2n/λ.
摘要:
In accordance with the invention, there are imaging interferometric microscopes and methods for imaging interferometric microscopy using structural illumination and evanescent coupling for the extension of imaging interferometric microscopy. Furthermore, there are coherent anti-Stokes Raman (CARS) microscopes and methods for coherent anti-Stokes Raman (CARS) microscopy, wherein imaging interferometric microscopy techniques are applied to get material dependent spectroscopic information.
摘要:
A method is provided for making an electrical connection with a microelectronic component arranged on or embedded within a surface of a circuit board layer or a substrate. The microelectronic component has an electrical contact face that is accessible on a surface of the microelectronic component. An electrically conducting bump is applied to the electrical contact face of the microelectronic component. A metal foil or metal coat is applied via a coating of an insulating binder to the surface of the circuit board under an action of pressure and/or heat so that the electrically conducting bump penetrates the coating of the insulating binder to make the electrical connection between the metal foil or metal coat and the electrical contact face.