摘要:
A light module includes a light emitting diode assembly defining a front side light emitting diode array and a rear side. The rear side is in thermal communication with a thermally conductive spreader, and a thermally conductive core is in thermal communication with the conductive spreader. The thermally conductive core includes an electrical conductor in operative communication with the front side light emitting diode array, and a plurality of appendages disposed about the thermally conductive core such that they are in thermal communication with the conductive spreader.
摘要:
A protective cap is deposited over the top and sides of an air bridge structure located on an integrated circuit chip. The protective cap provides mechanical strength during the application of a high density interconnect structure over the chips, to prevent deformation of the sensitive (air bridge) structure, and also to prevent any contamination from intruding under the air bridge. More importantly, the protective cap does not impede the performance of the air bridge and therefore does not need to be removed, thereby eliminating the necessity of ablating the HDI structure. Furthermore, the protective cap allows additional area for metallization to provide alternate circuits for coupling, power or ground planes, etc.
摘要:
An improved varistor-controlled multiplexed liquid crystal display of the type having columns of front electrodes and rows of rear electrodes connected in series with combinations of varistor elements and electrical capacitances, has a capacitance of increased magnitude formed in parallel with the capacitance of the liquid crystal layer in each of the multiplicity of the display cells, for reducing capacitive crosstalk between an addressed and unaddressed cell elements of the display. The increased capacitance is provided by auxiliary data electrodes positioned below, and spaced by a thin film dielectric layer from, the reflective rear cell row electrodes of the display, and spaced from the varistor member by at least one thick film dielectric layer. A pair of thick film layers may support the row scan electrodes therebetween, or the scan electrodes may be formed between a single layer and the varistor surface.
摘要:
Information is written into a matrix-addressed electroscopic display by means of a writing stylus having a magnetic tip, utilized to attract a moveable plate electrode in a selected one of the display matrix cells. A capacitance detector, connected to sequential ones of the column electrodes of the display via a first multiplexer and to sequential ones of the row electrodes of the matrix display via a second multiplexer, detects the change in cell interelectrode capacitance caused by movement of the moveable plate electrode. The capacitance of each display cell is compared with the data for the output state commanded for that cell, to recognize input data sites programmed by the magnetic writing stylus.
摘要:
A lighting apparatus (10) comprises a light engine (12) producing ultra violet radiation. An enclosure (14) surrounds a radiation generating area of the light engine (12) to encompass the radiation. At least one wall (28) of the enclosure (14) is substantially reflective of the ultraviolet radiation. The enclosure (14) includes a replaceable top portion (30) which includes a phosphor portion (32). The phosphor portion (32) is spaced from the radiation generating area of the light engine (12) by a height of the enclosure (14).
摘要:
A semiconductor device die (10, 116) is disposed on a heat-sinking support structure (30, 100). Nanotube regions (52, 120) contain nanotubes (54, 126) are arranged on a surface of or in the heatsinking support structure (30, 100). The nanotube regions (52, 120) are arranged to contribute to heat transfer from the semiconductor device die (10, 116) to the heat-sinking support structure (30, 100). In one embodiment, the semiconductor device die (10) includes die electrodes (20, 22), and the support structure (30) includes contact pads (40, 42) defined by at least some of the nanotube regions (52). The contact pads (40, 42) electrically and mechanically contact the die electrodes (20, 22). In another embodiment, the heat-sinking support structure (100) includes microchannels (120) arranged laterally in the support structure (100). At least some of the nanotube regions are disposed inside the microchannels (100).
摘要:
Electronics circuits having a relatively high density of relatively narrow conductors therein, are fabricated by cutting a groove into the surface of an insulating layer, as by use of laser machining apparatus and the like, for each conductor. Conductive material is placed into each groove to form each of at least one conductor on each of at least one level of the circuit. A thick film dielectric material is applied, over each insulative layer having at least one conductor embedded therein, to form insulative planes between different planes of conductor. Via interconnects are formed between conductor planes by filling a hole therebetween with conductive material.
摘要:
Electronics circuits having a relatively high density of relatively narrow conductors therein, are fabricated by cutting a groove into the surface of an insulating layer, as by use of laser machining apparatus and the like, for each conductor. Conductive material is placed into each groove to form each of at least one conductor on each of at least one level of the circuit. A thick film dielectric material is applied, over each insulative layer having at least one conductor embedded therein, to form insulative planes between different planes of conductor. Via interconnects are formed between conductor planes by filling a hole therebetween with conductive material.