公开(公告)号：US11795675B2

公开(公告)日：2023-10-24

申请号：US16553135

申请日：2019-08-27

申请人： Kai-Yi Chen ,  Chia-Shin Weng ,  Li-Chuan Wang ,  Chiao-Tsu Chiang ,  Sheng-Chieh Tang

发明人： Kai-Yi Chen ,  Chia-Shin Weng ,  Li-Chuan Wang ,  Chiao-Tsu Chiang ,  Sheng-Chieh Tang

IPC分类号： E03D9/00 ,  E04B2/82 ,  H04R1/02 ,  E04B1/348 ,  A47K4/00

CPC分类号： E03D9/007 ,  A47K4/00 ,  E04B1/34869 ,  E04B2/827 ,  H04R1/025

摘要： A smart sanitary system and a control method thereof are provided. A fixed display, a movable display, a shower unit and a toilet unit are provided. Motion of the movable display is controlled relative to the fixed display. The operation of the shower unit or the toilet unit is controlled according to the position of the movable display. Accordingly, a diversified space is provided, and the operation of sanitary equipment is triggered with the variation of the space.

公开(公告)号：US09331012B2

公开(公告)日：2016-05-03

申请号：US13414825

申请日：2012-03-08

申请人： Kai D. Feng ,  Wai-Kin Li ,  Ping-Chuan Wang ,  Zhijian Yang

发明人： Kai D. Feng ,  Wai-Kin Li ,  Ping-Chuan Wang ,  Zhijian Yang

IPC分类号： H01K3/10 ,  H01L23/522 ,  H01L23/528 ,  H04L9/32 ,  H05K1/02

CPC分类号： H01L23/5222 ,  H01L21/0274 ,  H01L21/3212 ,  H01L21/76816 ,  H01L21/76834 ,  H01L21/76837 ,  H01L21/7684 ,  H01L21/76877 ,  H01L23/5226 ,  H01L23/528 ,  H01L2924/0002 ,  H04L9/3278 ,  H04L2209/12 ,  H05K1/0289 ,  Y10T29/49117 ,  Y10T29/49165 ,  H01L2924/00

摘要： A method for fabricating an interconnect function array includes forming a first plurality of conductive lines on a substrate, forming an insulator layer over the first plurality of conductive lines and the substrate, removing portions of the insulator layer to define cavities in the insulator layer that expose portions of the substrate and the first plurality of conductive lines, wherein the removal of the portions of the insulator layer results in a substantially random arrangement of cavities exposing portions of the substrate and the first plurality of conductive lines, depositing a conductive material in the cavities, and forming a second plurality of conductive lines on portions of the conductive material in the cavities and the insulator layer.

摘要翻译： 一种用于制造互连功能阵列的方法包括在衬底上形成第一多条导线，在第一多条导线和衬底之上形成绝缘体层，去除绝缘体层的部分以限定暴露在绝缘体层中的空腔 衬底和第一多个导电线的部分，其中去除绝缘体层的部分导致暴露衬底和第一多个导电线的部分的空腔的基本上随机的排列，在腔中沉积导电材料 并且在所述空腔和所述绝缘体层中的所述导电材料的部分上形成第二多个导电线。

公开(公告)号：US09134627B2

公开(公告)日：2015-09-15

申请号：US13328264

申请日：2011-12-16

申请人： Wen-Chuan Wang ,  Shy-Jay Lin ,  Pei-Yi Liu ,  Jaw-Jung Shin ,  Burn Jeng Lin

发明人： Wen-Chuan Wang ,  Shy-Jay Lin ,  Pei-Yi Liu ,  Jaw-Jung Shin ,  Burn Jeng Lin

IPC分类号： H01L21/66 ,  G03F7/20 ,  H01L23/544

CPC分类号： G03F7/70633 ,  H01L23/544 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2223/5446 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for fabricating a semiconductor device is disclosed. An exemplary method includes forming a first structure in a first layer by a first exposure and determining placement information of the first structure. The method further includes forming a second structure in a second layer overlying the first layer by a second exposure and determining placement information of the second structure. The method further includes forming a third structure including first and second substructures in a third layer overlying the second layer by a third exposure. Forming the third structure includes independently aligning the first substructure to the first structure and independently aligning the second substructure to the second structure.

摘要翻译： 公开了一种制造半导体器件的方法。 一种示例性方法包括通过第一曝光在第一层中形成第一结构并确定第一结构的放置信息。 该方法还包括通过第二曝光在覆盖第一层的第二层中形成第二结构，并确定第二结构的放置信息。 该方法还包括在第三层中形成第三结构，该第三结构包括通过第三次曝光覆盖第二层的第三层中的第一和第二子结构。 形成第三结构包括将第一子结构独立地对准第一结构并且将第二子结构独立地对准到第二结构。

公开(公告)号：US09124633B1

公开(公告)日：2015-09-01

申请号：US13434527

申请日：2012-03-29

申请人： Soheil Eizadi ,  Steven Whittle ,  Chuan Wang

发明人： Soheil Eizadi ,  Steven Whittle ,  Chuan Wang

IPC分类号： G06F15/173 ,  H04L29/12

CPC分类号： H04L61/2007 ,  G06F9/45558 ,  G06F9/5077 ,  G06F17/30377 ,  G06F2009/45595 ,  H04L61/1511 ,  H04L61/20 ,  H04L61/2076

摘要： Provisioning an Internet Protocol address is disclosed. A request to provision an Internet Protocol address to a virtual resource is received. An Internet Protocol address is automatically determined to allocate to the virtual resource. An Internet Protocol Address Management appliance is used to automatically allocate the determined Internet Protocol address to the virtual resource.

摘要翻译： 公开了提供互联网协议地址。 接收到向虚拟资源提供Internet协议地址的请求。 Internet协议地址被自动确定为分配给虚拟资源。 互联网协议地址管理设备用于自动将确定的因特网协议地址分配给虚拟资源。

公开(公告)号：US09105637B2

公开(公告)日：2015-08-11

申请号：US13475542

申请日：2012-05-18

申请人： Ronald G. Filippi ,  Naftali Lustig ,  Ping-Chuan Wang ,  Lijuan Zhang

发明人： Ronald G. Filippi ,  Naftali Lustig ,  Ping-Chuan Wang ,  Lijuan Zhang

IPC分类号： H01L23/52 ,  H01L21/768 ,  H01L23/525 ,  H01L27/10

CPC分类号： H01L23/5252 ,  H01L21/76807 ,  H01L21/76816 ,  H01L27/101 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method including a first interconnect level including a first electrode embedded in a first dielectric layer, a top surface of the first electrode is substantially flush with a top surface of the first dielectric layer, a second interconnect level including a via embedded in a second dielectric layer above the first dielectric layer, a third dielectric layer in direct contact with and separating the first dielectric layer and the second dielectric layer, an entire top surface of the first electrode is in direct physical contact with a bottom surface of the third dielectric layer, and an interface between the first dielectric layer and the third dielectric layer extending from the top surface of the first electrode to the via, the interface including a length less than a minimum width of the via, a bottom surface of the via is in direct physical contact with the first dielectric layer.

摘要翻译： 一种包括第一互连电平的方法，包括嵌入在第一电介质层中的第一电极，第一电极的顶表面基本上与第一电介质层的顶表面平齐，第二互连电平包括嵌入第二电介质中的通孔 在与第一介电层和第二介电层直接接触和分离的第三电介质层上，第一电极的整个顶表面与第三电介质层的底表面直接物理接触， 以及从第一电极的顶表面延伸到通孔的第一介电层和第三电介质层之间的界面，所述界面包括小于通孔的最小宽度的长度，通孔的底表面是直接物理的 与第一电介质层接触。

公开(公告)号：US20150062720A1

公开(公告)日：2015-03-05

申请号：US14133642

申请日：2013-12-19

申请人： Sheng-Tang Lai ,  Kuo-Chuan Wang

发明人： Sheng-Tang Lai ,  Kuo-Chuan Wang

IPC分类号： G02B13/04 ,  G02B13/18

CPC分类号： G02B9/10 ,  G02B3/02 ,  G02B9/62 ,  G02B13/04 ,  G02B13/18

摘要： A fixed-focus lens including a first lens group and a second lens group is provided. The first lens group having a negative refractive power includes a first lens, a second lens and a third lens arranged in sequence from an object side to an image side, in which refractive powers of the first, second and third lenses are negative, negative and positive in sequence. The second lens group having a positive refractive power is located between the first lens group and the image side, and the second lens group includes a fourth lens, a fifth lens and a sixth lens arranged in sequence from the object side to the image side, in which refractive powers of the fourth, fifth and sixth lenses are positive, negative and positive in sequence. The first, second, third, fourth, fifth and sixth lenses are separated from each other.

摘要翻译： 提供了包括第一透镜组和第二透镜组的固定焦点透镜。 具有负屈光力的第一透镜组包括第一透镜，第二透镜和从物体侧到像侧依次排列的第三透镜，其中第一透镜，第二透镜和第三透镜的折射力为负的，负的为 顺序为正。 具有正折光力的第二透镜组位于第一透镜组和图像侧之间，并且第二透镜组包括从物体侧到像侧依次布置的第四透镜，第五透镜和第六透镜， 其中第四，第五和第六透镜的屈光力依次为正，负和正。 第一，第二，第三，第四，第五和第六透镜彼此分离。

公开(公告)号：US08897027B2

公开(公告)日：2014-11-25

申请号：US13117614

申请日：2011-05-27

申请人： Han-Chung Chen ,  Chun-Yi Wu ,  Shih-Cheng Wang ,  Chin-Mei Huang ,  Tsui-Chuan Wang ,  Pei-Fang Tsai

发明人： Han-Chung Chen ,  Chun-Yi Wu ,  Shih-Cheng Wang ,  Chin-Mei Huang ,  Tsui-Chuan Wang ,  Pei-Fang Tsai

IPC分类号： H05K7/10 ,  H05K7/12 ,  H05K1/02 ,  H05K1/11 ,  H01L33/62 ,  H05K3/34 ,  H01L23/00

CPC分类号： H05K1/111 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/8338 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2924/12041 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H05K1/0295 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10636 ,  H05K2203/048 ,  Y02P70/611

摘要： A bonding pad structure is disclosed, which is composed of two bonding pad units that are symmetrically disposed with respect to an axial line. Each bonding pad units is further composed of at least two bonding pads, i.e. each bonding pad unit is composed of at least one first bonding pad and at least one second bonding pad. In an embodiment, the first bonding pad is arranged next to the axial line and the second bonding pad is arranged at a side of the corresponding first bonding pad away from the axial line while enabling the first bonding pad and the corresponding second bonding pad to be interconnected to each other by a first neck portion. Thereby, a plurality of solder areas of different sizes can be formed by the interconnecting of the at least two bonding pad units that can be used for soldering electronic components of different sizes.

摘要翻译： 公开了一种焊盘结构，其由相对于轴线对称设置的两个焊盘单元组成。 每个焊盘单元进一步由至少两个焊盘组成，即每个焊盘单元由至少一个第一焊盘和至少一个第二接合焊盘构成。 在一个实施例中，第一焊盘靠近轴线布置，并且第二焊盘布置在相对应的第一焊盘的远离轴线的一侧，同时使得第一焊盘和相应的第二焊盘是 通过第一颈部部彼此互连。 因此，可以通过互连可以用于焊接不同尺寸的电子部件的至少两个焊盘单元来形成不同尺寸的多个焊料区域。

公开(公告)号：US08758963B2

公开(公告)日：2014-06-24

申请号：US13554209

申请日：2012-07-20

申请人： Shih-Ming Chang ,  Chung-Hsing Chang ,  Wen-Chuan Wang ,  Chi-Lun Lu ,  Sheng-Chi Chin ,  Chin-Hsiang Lin ,  Chun-Kuang Chen

发明人： Shih-Ming Chang ,  Chung-Hsing Chang ,  Wen-Chuan Wang ,  Chi-Lun Lu ,  Sheng-Chi Chin ,  Chin-Hsiang Lin ,  Chun-Kuang Chen

IPC分类号： G03F1/00 ,  G03F7/00

CPC分类号： G03F1/14 ,  G03F1/50 ,  G03F7/70283 ,  G03F7/70416 ,  G03H1/0005 ,  G03H1/0244 ,  G03H1/08 ,  G03H1/2205 ,  G03H2001/0094 ,  G03H2001/0833 ,  G03H2210/30 ,  G03H2224/04 ,  G03H2240/12 ,  G03H2240/13 ,  G03H2240/23 ,  G03H2270/52

摘要： A hologram reticle and method of patterning a target. A layout pattern for an image to be transferred to a target is converted into a holographic representation of the image. A hologram reticle is manufactured that includes the holographic representation. The hologram reticle is then used to pattern the target. Three-dimensional patterns may be formed in a photoresist layer of the target in a single patterning step. These three-dimensional patterns may be filled to form three-dimensional structures or else used in a multi-surface imaging composition. The holographic representation of the image may also be transferred to a top photoresist layer of a top surface imaging (TSI) semiconductor device, either directly or using the hologram reticle. The top photoresist layer may then be used to pattern an underlying photoresist layer with the image. The lower photoresist layer is used to pattern a material layer of the device.

摘要翻译： 全息图掩模版和图案化目标的方法。 要传输到目标的图像的布局图案被转换成图像的全息图。 制造包括全息图的全息标线。 然后使用全息图标线来对目标进行图案化。 可以在单个图案化步骤中在靶的光致抗蚀剂层中形成三维图案。 这些三维图案可以被填充以形成三维结构，或者用于多表面成像组合物中。 图像的全息图也可以直接地或使用全息图掩模图传递到顶表面成像（TSI）半导体器件的顶部光致抗蚀剂层。 然后可以使用顶部光致抗蚀剂层来用图像对下面的光致抗蚀剂层进行图案化。 下部光致抗蚀剂层用于对该器件的材料层进行图案化。

公开(公告)号：US08716101B2

公开(公告)日：2014-05-06

申请号：US13530999

申请日：2012-06-22

申请人： Kaushik Chandra ,  Ronald G. Filippi ,  Wai-Kin Li ,  Ping-Chuan Wang ,  Chih-Chao Yang

发明人： Kaushik Chandra ,  Ronald G. Filippi ,  Wai-Kin Li ,  Ping-Chuan Wang ,  Chih-Chao Yang

IPC分类号： H01L21/76

CPC分类号： H01L23/528 ,  H01L21/7682 ,  H01L21/76831 ,  H01L23/5329 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

摘要： A structure for reducing electromigration cracking and extrusion effects in semiconductor devices includes a first metal line formed in a first dielectric layer; a cap layer formed over the first metal line and first dielectric layer; a second dielectric layer formed over the cap layer; and a void formed in the second dielectric layer, stopping on the cap layer, wherein the void is located in a manner so as to isolate structural damage due to electromigration effects of the first metal line, the effects including one or more of extrusions of metal material from the first metal line and cracks from delamination of the cap layer with respect to the first dielectric layer.

摘要翻译： 用于减少半导体器件中的电迁移破裂和挤出效应的结构包括形成在第一介电层中的第一金属线; 形成在第一金属线和第一介电层上的盖层; 形成在所述盖层上的第二电介质层; 以及形成在所述第二介电层中的空隙，停止在所述盖层上，其中所述空隙以这样的方式定位，以便隔离由于所述第一金属线的电迁移效应引起的结构损坏，所述效果包括一种或多种金属挤压 来自第一金属线的材料和帽层相对于第一介电层分层的裂纹。

公开(公告)号：US08675292B2

公开(公告)日：2014-03-18

申请号：US13273210

申请日：2011-10-13

申请人： Kuo-Chuan Wang ,  Yi-Hao Kang ,  Chi-Tang Hsieh ,  Chia-Chang Lee

发明人： Kuo-Chuan Wang ,  Yi-Hao Kang ,  Chi-Tang Hsieh ,  Chia-Chang Lee

IPC分类号： G02B13/16

CPC分类号： G02B13/16 ,  G02B19/0014 ,  G02B19/0047

摘要： A projection lens for projecting an image beam is provided. The image beam is converted by a light valve from an illumination beam irradiating the light valve. The projection lens includes a first lens group, a second lens group, and a third lens group. The first lens group is disposed on a transmission path of the image beam, and has a first optical axis. The second lens group is disposed on both a transmission path of the illumination beam and the transmission path of the image beam, and between the light valve and the first lens group. The second lens group has a second optical axis. The second optical axis is inclined with respect to the first optical axis. The third lens group is disposed on the transmission path of the image beam, and between the first lens group and the second lens group. A projection apparatus is also provided.

摘要翻译： 提供了用于投影图像束的投影透镜。 图像光束通过光阀从照射光阀的照明光束转换。 投影透镜包括第一透镜组，第二透镜组和第三透镜组。 第一透镜组设置在图像束的传输路径上，并且具有第一光轴。 第二透镜组设置在照明光束的传输路径和图像束的传输路径之间，以及光阀和第一透镜组之间。 第二透镜组具有第二光轴。 第二光轴相对于第一光轴倾斜。 第三透镜组设置在图像束的传输路径上，并且位于第一透镜组和第二透镜组之间。 还提供投影设备。