公开(公告)号：US09480156B2

公开(公告)日：2016-10-25

申请号：US13406915

申请日：2012-02-28

申请人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

发明人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

IPC分类号： H05K3/20 ,  H05K1/11 ,  H01L21/48 ,  H01L23/498 ,  H05K3/10 ,  H05K3/34 ,  H05K3/46

CPC分类号： H05K1/111 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/108 ,  H05K3/3484 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2203/0369 ,  H05K2203/043 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2224/0401

摘要： A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the resists, and forming a wiring having a pad and a conductive circuit thinner than the pad by removing the metal film exposed through the removing of the plating resist, a solder-resist layer on the surface of the board and wiring, in the layer an opening exposing the pad and a portion of the circuit contiguous to the pad, a solder film on the pad and portion of the circuit exposed through the opening, and a solder bump on the pad by solder reflow.

摘要翻译： 一种制造印刷电路板的方法，包括在绝缘板的表面上形成金属膜，在金属膜上形成电镀抗蚀剂，以及在电镀抗蚀剂暴露的金属膜上的镀金属膜，覆盖一部分 具有抗蚀剂的镀金属膜，蚀刻以减少从抗蚀剂暴露的镀金属膜的厚度，去除抗蚀剂，以及通过除去暴露的金属膜，形成具有焊盘和比焊盘更薄的导电电路的布线 通过去除电镀抗蚀剂，在基板和布线的表面上形成阻焊层，在该层中，露出焊盘的开口和与焊盘相邻的电路的一部分，焊盘上的焊料膜和 通过开口暴露的电路，以及通过焊料回流焊盘上的焊料凸块。

公开(公告)号：US20130192877A1

公开(公告)日：2013-08-01

申请号：US13562508

申请日：2012-07-31

申请人： Toru FURUTA ,  Fumitaka TAKAGI

发明人： Toru FURUTA ,  Fumitaka TAKAGI

IPC分类号： H05K1/02 ,  H05K3/10

CPC分类号： H05K1/0296 ,  H01L2224/48091 ,  H05K1/114 ,  H05K3/10 ,  H05K3/3452 ,  H05K3/4652 ,  Y10T29/49155 ,  H01L2924/00014

摘要： A wiring board includes an interlayer insulation layer, conductive patterns formed on the interlayer insulation layer, and a solder-resist layer formed on the interlayer insulation layer and having an opening partially exposing the conductive patterns. The solder-resist layer has an edge portion bordering the opening and intersecting the conductive patterns, and the edge portion of the solder-resist layer has a concavo-convex shape having convex portions and concave portions such that the convex portions and the concave portions are alternately intersecting the conductive patterns.

摘要翻译： 布线板包括层间绝缘层，形成在层间绝缘层上的导电图案，以及形成在层间绝缘层上的具有部分地暴露导电图案的开口的阻焊层。 阻焊层具有与开口相邻并且与导电图案相交的边缘部分，阻焊层的边缘部分具有凹凸形状，具有凸部和凹部，使得凸部和凹部为 交替地与导电图案相交。

公开(公告)号：US20100218983A1

公开(公告)日：2010-09-02

申请号：US12685731

申请日：2010-01-12

申请人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Akihiro Miyata ,  Fumitaka Takagi

发明人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Akihiro Miyata ,  Fumitaka Takagi

IPC分类号： H05K1/09 ,  C23F1/00 ,  B05D5/12 ,  H05K1/11

CPC分类号： C23F1/02 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K3/108 ,  H05K3/243 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2203/0369 ,  H05K2203/049 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the etching and plating resists, and forming a wiring having a pad for wire-bonding an electrode of an electronic component and a conductive circuit thinner than the pad by removing the metal film exposed after the plating resist is removed, a solder-resist layer on the surface of the board and wiring, an opening in the layer exposing the pad and a portion of the circuit contiguous to the pad, and a metal coating on the pad and portion of the circuit exposed through the opening.

摘要翻译： 一种制造印刷电路板的方法，包括在绝缘板的表面上形成金属膜，在金属膜上形成电镀抗蚀剂，以及在电镀抗蚀剂暴露的金属膜上的镀金属膜，覆盖一部分 具有抗蚀剂的电镀金属膜，蚀刻以减少从抗蚀剂暴露的电镀金属膜的厚度，去除蚀刻和电镀抗蚀剂，以及形成具有用于将电子部件的电极引线接合的焊盘的布线，以及 通过去除在电镀抗蚀剂之后暴露的金属膜而比焊盘更薄的导电电路被去除，在该板和布线的表面上的阻焊层，暴露该焊盘的该层中的一个开口和该电路的一部分与 焊盘和焊盘上的金属涂层以及通过开口露出的电路部分。

公开(公告)号：US20100218980A1

公开(公告)日：2010-09-02

申请号：US12582050

申请日：2009-10-20

申请人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

发明人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

IPC分类号： H05K1/09 ,  H05K1/11

CPC分类号： H05K1/111 ,  H01L2224/16225 ,  H01L2224/73204 ,  H05K3/108 ,  H05K3/243 ,  H05K3/323 ,  H05K3/4602 ,  H05K2201/0949 ,  H05K2201/09736 ,  H05K2201/10674 ,  H05K2203/0369 ,  H05K2203/0574 ,  Y02P70/611

摘要： A printed wiring board has an insulative board having a first surface and a second surface on the opposite side of the first surface, a wiring formed on the first surface of the insulative board and having a pad and a conductive circuit contiguous to the pad, and a metal film formed on the pad. The pad is provided to mount an electronic component having a gold bump. The pad has a thickness which is greater than a thickness of the conductive circuit.

摘要翻译： 印刷电路板具有绝缘板，其具有在第一表面的相对侧上的第一表面和第二表面，在绝缘板的第一表面上形成的布线，并具有与该焊盘相邻的焊盘和导电电路，以及 形成在垫上的金属膜。 提供垫以安装具有金凸块的电子部件。 焊盘的厚度大于导电电路的厚度。

公开(公告)号：US08592691B2

公开(公告)日：2013-11-26

申请号：US12685731

申请日：2010-01-12

申请人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Akihiro Miyata ,  Fumitaka Takagi

发明人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Akihiro Miyata ,  Fumitaka Takagi

IPC分类号： H05K1/11

CPC分类号： C23F1/02 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K3/108 ,  H05K3/243 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2203/0369 ,  H05K2203/049 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the etching and plating resists, and forming a wiring having a pad for wire-bonding an electrode of an electronic component and a conductive circuit thinner than the pad by removing the metal film exposed after the plating resist is removed, a solder-resist layer on the surface of the board and wiring, an opening in the layer exposing the pad and a portion of the circuit contiguous to the pad, and a metal coating on the pad and portion of the circuit exposed through the opening.

摘要翻译： 一种制造印刷电路板的方法，包括在绝缘板的表面上形成金属膜，在金属膜上形成电镀抗蚀剂，以及在电镀抗蚀剂暴露的金属膜上的镀金属膜，覆盖一部分 具有抗蚀剂的电镀金属膜，蚀刻以减少从抗蚀剂暴露的电镀金属膜的厚度，去除蚀刻和电镀抗蚀剂，以及形成具有用于将电子部件的电极引线接合的焊盘的布线，以及 通过去除在电镀抗蚀剂之后暴露的金属膜而比焊盘更薄的导电电路被去除，在该板和布线的表面上的阻焊层，暴露该焊盘的该层中的一个开口和该电路的一部分与 焊盘和焊盘上的金属涂层以及通过开口露出的电路部分。

公开(公告)号：US20120151764A1

公开(公告)日：2012-06-21

申请号：US13406915

申请日：2012-02-28

申请人： Toru FURUTA ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

发明人： Toru FURUTA ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

IPC分类号： H05K3/02

CPC分类号： H05K1/111 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/108 ,  H05K3/3484 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2203/0369 ,  H05K2203/043 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2224/0401

摘要： A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the resists, and forming a wiring having a pad and a conductive circuit thinner than the pad by removing the metal film exposed through the removing of the plating resist, a solder-resist layer on the surface of the board and wiring, in the layer an opening exposing the pad and a portion of the circuit contiguous to the pad, a solder film on the pad and portion of the circuit exposed through the opening, and a solder bump on the pad by solder reflow.

摘要翻译： 一种制造印刷电路板的方法，包括在绝缘板的表面上形成金属膜，在金属膜上形成电镀抗蚀剂，以及在电镀抗蚀剂暴露的金属膜上的镀金属膜，覆盖一部分 具有抗蚀剂的镀金属膜，蚀刻以减少从抗蚀剂暴露的镀金属膜的厚度，去除抗蚀剂，以及通过除去暴露的金属膜，形成具有焊盘和比焊盘更薄的导电电路的布线 通过去除电镀抗蚀剂，在基板和布线的表面上形成阻焊层，在该层中，露出焊盘的开口和与焊盘相邻的电路的一部分，焊盘上的焊料膜和 通过开口暴露的电路，以及通过焊料回流焊盘上的焊料凸块。

公开(公告)号：US08410374B2

公开(公告)日：2013-04-02

申请号：US12582050

申请日：2009-10-20

申请人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

发明人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

IPC分类号： H05K1/11

CPC分类号： H05K1/111 ,  H01L2224/16225 ,  H01L2224/73204 ,  H05K3/108 ,  H05K3/243 ,  H05K3/323 ,  H05K3/4602 ,  H05K2201/0949 ,  H05K2201/09736 ,  H05K2201/10674 ,  H05K2203/0369 ,  H05K2203/0574 ,  Y02P70/611

摘要： A printed wiring board has an insulative board having a first surface and a second surface on the opposite side of the first surface, a wiring formed on the first surface of the insulative board and having a pad and a conductive circuit contiguous to the pad, and a metal film formed on the pad. The pad is provided to mount an electronic component having a gold bump. The pad has a thickness which is greater than a thickness of the conductive circuit.

摘要翻译： 印刷电路板具有绝缘板，其具有在第一表面的相对侧上的第一表面和第二表面，在绝缘板的第一表面上形成的布线，并具有与该焊盘相邻的焊盘和导电电路，以及 形成在垫上的金属膜。 提供垫以安装具有金凸块的电子部件。 焊盘的厚度大于导电电路的厚度。

公开(公告)号：US20120103931A1

公开(公告)日：2012-05-03

申请号：US13347022

申请日：2012-01-10

申请人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Akihiro Miyata ,  Fumitaka Takagi

发明人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Akihiro Miyata ,  Fumitaka Takagi

IPC分类号： H05K3/06

CPC分类号： C23F1/02 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K3/108 ,  H05K3/243 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2203/0369 ,  H05K2203/049 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the etching and plating resists, and forming a wiring having a pad for wire-bonding an electrode of an electronic component and a conductive circuit thinner than the pad by removing the metal film exposed after the plating resist is removed, a solder-resist layer on the surface of the board and wiring, an opening in the layer exposing the pad and a portion of the circuit contiguous to the pad, and a metal coating on the pad and portion of the circuit exposed through the opening.

摘要翻译： 一种制造印刷电路板的方法，包括在绝缘板的表面上形成金属膜，在金属膜上形成电镀抗蚀剂，以及在电镀抗蚀剂暴露的金属膜上的镀金属膜，覆盖一部分 具有抗蚀剂的电镀金属膜，蚀刻以减少从抗蚀剂暴露的电镀金属膜的厚度，去除蚀刻和电镀抗蚀剂，以及形成具有用于将电子部件的电极引线接合的焊盘的布线，以及 通过去除在电镀抗蚀剂之后暴露的金属膜而比焊盘更薄的导电电路被去除，在该板和布线的表面上的阻焊层，暴露该焊盘的该层中的一个开口和该电路的一部分与 焊盘和焊盘上的金属涂层以及通过开口露出的电路部分。

公开(公告)号：US08153905B2

公开(公告)日：2012-04-10

申请号：US12685716

申请日：2010-01-12

申请人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

发明人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

IPC分类号： H05K1/11 ,  H05K3/10

CPC分类号： H05K1/111 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/108 ,  H05K3/3484 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2203/0369 ,  H05K2203/043 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2224/0401

摘要： A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the resists, and forming a wiring having a pad and a conductive circuit thinner than the pad by removing the metal film exposed through the removing of the plating resist, a solder-resist layer on the surface of the board and wiring, in the layer an opening exposing the pad and a portion of the circuit contiguous to the pad, a solder film on the pad and portion of the circuit exposed through the opening, and a solder bump on the pad by solder reflow.

摘要翻译： 一种制造印刷电路板的方法，包括在绝缘板的表面上形成金属膜，在金属膜上形成电镀抗蚀剂，以及在电镀抗蚀剂暴露的金属膜上的镀金属膜，覆盖一部分 具有抗蚀剂的镀金属膜，蚀刻以减少从抗蚀剂暴露的镀金属膜的厚度，去除抗蚀剂，以及通过除去暴露的金属膜，形成具有焊盘和比焊盘更薄的导电电路的布线 通过去除电镀抗蚀剂，在基板和布线的表面上形成阻焊层，在该层中，露出焊盘的开口和与焊盘相邻的电路的一部分，焊盘上的焊料膜和 通过开口暴露的电路，以及通过焊料回流焊盘上的焊料凸块。

公开(公告)号：US20100221414A1

公开(公告)日：2010-09-02

申请号：US12491282

申请日：2009-06-25

申请人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

发明人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

IPC分类号： B05D5/12

CPC分类号： H05K1/111 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2924/0002 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15151 ,  H05K3/06 ,  H05K3/108 ,  H05K3/243 ,  H05K3/244 ,  H05K3/323 ,  H05K3/3452 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2201/0989 ,  H05K2203/0369 ,  H05K2203/0574 ,  Y02P70/611 ,  H01L2224/05552 ,  H01L2924/00

摘要： A method for manufacturing a printed wiring board includes preparing insulative board having first and second surfaces, forming metal film on the first surface, plating resist on the metal film and plated-metal film on the metal film exposed by the plating resist, covering portion of the plated-metal film with etching resist, etching to reduce thickness of the plated-metal film exposed by the etching resist, removing the etching and plating resists, by removing the metal film exposed after removing the plating resist, forming wiring comprising pad for electronic component having gold bump and conductive circuit which is thinner than the pad, forming solder-resist layer on the first surface and the wiring, and forming opening in the solder-resist layer to expose the pad and portion of the conductive circuit contiguous to the pad and metal coating on the pad and portion of the conductive circuit, which are exposed through the opening.

摘要翻译： 一种制造印刷电路板的方法，包括制备具有第一表面和第二表面的绝缘板，在第一表面上形成金属膜，在金属膜上形成电镀抗蚀剂和在电镀抗蚀剂暴露的金属膜上的镀金属膜，覆盖部分 具有抗蚀剂的电镀金属膜，通过去除在去除电镀抗蚀剂之后暴露的金属膜，蚀刻以减少由抗蚀剂暴露的电镀金属膜的厚度，去除蚀刻和电镀抗蚀剂的蚀刻，形成包括用于电子的焊盘的布线 具有比焊盘薄的金凸块和导电电路的部件，在第一表面和布线上形成阻焊层，以及在阻焊层中形成开口以暴露焊盘和与焊盘相邻的导电电路的部分 以及通过开口暴露在焊盘和导电电路的部分上的金属涂层。