公开(公告)号：US08618669B2

公开(公告)日：2013-12-31

申请号：US12174212

申请日：2008-07-16

申请人： Toru Furuta

发明人： Toru Furuta

IPC分类号： H01L23/52

CPC分类号： H05K1/186 ,  H01L23/49838 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3511 ,  H05K1/113 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/0394 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A combination substrate includes a first substrate having multiple wiring board mounting pads for installing a printed wiring board and multiple connection pads on the opposite side of the wiring board mounting pads, a second substrate having multiple package substrate mounting pads for loading one or more package substrates and multiple connection pads on the opposite side of the package substrate mounting pads, a resin component filling a space between the first substrate and the second substrate, and multiple component loading pads positioned to load an electronic component between the first substrate and the second substrate and formed on one of the first substrate and the second substrate. The connection pads of the second substrate are electrically connected to the connection pads of the first substrate.

摘要翻译： 组合基板包括具有用于安装印刷线路板的多个布线板安装焊盘和在布线板安装焊盘的相对侧上的多个连接焊盘的第一基板，具有用于装载一个或多个封装基板的多个封装基板安装焊盘的第二基板 以及在所述封装衬底安装衬垫的相对侧上的多个连接焊盘，填充所述第一衬底和所述第二衬底之间的空间的树脂部件以及被定位成在所述第一衬底和所述第二衬底之间加载电子部件的多个部件装载垫，以及 形成在第一基板和第二基板中的一个上。 第二基板的连接焊盘电连接到第一基板的连接焊盘。

公开(公告)号：US20100218983A1

公开(公告)日：2010-09-02

申请号：US12685731

申请日：2010-01-12

申请人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Akihiro Miyata ,  Fumitaka Takagi

发明人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Akihiro Miyata ,  Fumitaka Takagi

IPC分类号： H05K1/09 ,  C23F1/00 ,  B05D5/12 ,  H05K1/11

CPC分类号： C23F1/02 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K3/108 ,  H05K3/243 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2203/0369 ,  H05K2203/049 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the etching and plating resists, and forming a wiring having a pad for wire-bonding an electrode of an electronic component and a conductive circuit thinner than the pad by removing the metal film exposed after the plating resist is removed, a solder-resist layer on the surface of the board and wiring, an opening in the layer exposing the pad and a portion of the circuit contiguous to the pad, and a metal coating on the pad and portion of the circuit exposed through the opening.

摘要翻译： 一种制造印刷电路板的方法，包括在绝缘板的表面上形成金属膜，在金属膜上形成电镀抗蚀剂，以及在电镀抗蚀剂暴露的金属膜上的镀金属膜，覆盖一部分 具有抗蚀剂的电镀金属膜，蚀刻以减少从抗蚀剂暴露的电镀金属膜的厚度，去除蚀刻和电镀抗蚀剂，以及形成具有用于将电子部件的电极引线接合的焊盘的布线，以及 通过去除在电镀抗蚀剂之后暴露的金属膜而比焊盘更薄的导电电路被去除，在该板和布线的表面上的阻焊层，暴露该焊盘的该层中的一个开口和该电路的一部分与 焊盘和焊盘上的金属涂层以及通过开口露出的电路部分。

公开(公告)号：US20100218980A1

公开(公告)日：2010-09-02

申请号：US12582050

申请日：2009-10-20

申请人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

发明人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

IPC分类号： H05K1/09 ,  H05K1/11

CPC分类号： H05K1/111 ,  H01L2224/16225 ,  H01L2224/73204 ,  H05K3/108 ,  H05K3/243 ,  H05K3/323 ,  H05K3/4602 ,  H05K2201/0949 ,  H05K2201/09736 ,  H05K2201/10674 ,  H05K2203/0369 ,  H05K2203/0574 ,  Y02P70/611

摘要： A printed wiring board has an insulative board having a first surface and a second surface on the opposite side of the first surface, a wiring formed on the first surface of the insulative board and having a pad and a conductive circuit contiguous to the pad, and a metal film formed on the pad. The pad is provided to mount an electronic component having a gold bump. The pad has a thickness which is greater than a thickness of the conductive circuit.

摘要翻译： 印刷电路板具有绝缘板，其具有在第一表面的相对侧上的第一表面和第二表面，在绝缘板的第一表面上形成的布线，并具有与该焊盘相邻的焊盘和导电电路，以及 形成在垫上的金属膜。 提供垫以安装具有金凸块的电子部件。 焊盘的厚度大于导电电路的厚度。

公开(公告)号：US08468367B2

公开(公告)日：2013-06-18

申请号：US12662585

申请日：2010-04-23

申请人： Tatsuya Sasahara ,  Hideaki Takahashi ,  Toru Furuta ,  Kinya Saito ,  Shinobu Sasaki ,  Daisuke Tomii

发明人： Tatsuya Sasahara ,  Hideaki Takahashi ,  Toru Furuta ,  Kinya Saito ,  Shinobu Sasaki ,  Daisuke Tomii

IPC分类号： G06F21/00

CPC分类号： H04L9/321 ,  H04L9/083 ,  H04L2209/38

摘要： A storage apparatus includes a key control part to judge a validity of a data access from a request source based on authorization information received therefrom and authorization information created from an enciphering key included in enciphering key information received from a key management apparatus, and a control part to make the data access to the recording medium using the enciphering key in response to an access request from the request source, if the validity of the data access is confirmed. The authorization information from the request source includes a unique code created from the enciphering key if an authentication is successful in the key management apparatus in response to an authentication request from the request source.

摘要翻译： 存储装置包括：密钥控制部分，用于根据从其接收的授权信息来判断来自请求源的数据访问的有效性，以及从密钥管理装置接收的加密密钥信息中包含的加密密钥创建的授权信息，以及控制部分 如果确认了数据访问的有效性，则使用加密密钥响应于来自请求源的访问请求使数据访问记录介质。 如果在密钥管理装置中响应来自请求源的认证请求成功验证，则来自请求源的授权信息包括从加密密钥创建的唯一代码。

公开(公告)号：US08410374B2

公开(公告)日：2013-04-02

申请号：US12582050

申请日：2009-10-20

申请人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

发明人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

IPC分类号： H05K1/11

CPC分类号： H05K1/111 ,  H01L2224/16225 ,  H01L2224/73204 ,  H05K3/108 ,  H05K3/243 ,  H05K3/323 ,  H05K3/4602 ,  H05K2201/0949 ,  H05K2201/09736 ,  H05K2201/10674 ,  H05K2203/0369 ,  H05K2203/0574 ,  Y02P70/611

摘要： A printed wiring board has an insulative board having a first surface and a second surface on the opposite side of the first surface, a wiring formed on the first surface of the insulative board and having a pad and a conductive circuit contiguous to the pad, and a metal film formed on the pad. The pad is provided to mount an electronic component having a gold bump. The pad has a thickness which is greater than a thickness of the conductive circuit.

摘要翻译： 印刷电路板具有绝缘板，其具有在第一表面的相对侧上的第一表面和第二表面，在绝缘板的第一表面上形成的布线，并具有与该焊盘相邻的焊盘和导电电路，以及 形成在垫上的金属膜。 提供垫以安装具有金凸块的电子部件。 焊盘的厚度大于导电电路的厚度。

公开(公告)号：US20130048355A1

公开(公告)日：2013-02-28

申请号：US13537885

申请日：2012-06-29

申请人： Toru FURUTA ,  Hirofumi FUTAMURA ,  Hisashi MINOURA

发明人： Toru FURUTA ,  Hirofumi FUTAMURA ,  Hisashi MINOURA

IPC分类号： H05K1/11 ,  H05K1/09 ,  H05K1/00

CPC分类号： H05K3/4602 ,  H05K1/0373 ,  H05K3/4644 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/09563 ,  H05K2201/09854

摘要： A printed wiring board has a core substrate including an insulative base material and having a penetrating hole, a first conductive circuit formed on a first surface of the substrate, a second conductive circuit formed on a second surface of the substrate, and a through-hole conductor including a copper-plated film and formed in the penetrating hole such that the through-hole conductor is connecting the first and second conductive circuits. The insulative base material of the substrate includes reinforcing material and resin and has a thermal expansion coefficient in a Z direction which is set at or above a thermal expansion coefficient of the copper-plated film of the through-hole conductor and set at or below 23 ppm, and the insulative base material of the substrate has a thermal expansion coefficient in an XY direction which is set lower than the thermal expansion coefficient of the copper-plated film of the through-hole conductor.

摘要翻译： 印刷电路板具有包括绝缘基材并具有贯通孔的芯基板，形成在基板的第一表面上的第一导电电路，形成在基板的第二表面上的第二导电电路和通孔 导体，其包括镀铜膜，并形成在贯通孔中，使得通孔导体连接第一和第二导电电路。 基板的绝缘基材包括增强材料和树脂，并且在Z方向上的热膨胀系数设定在通孔导体的镀铜膜的热膨胀系数以上且设定在23以下 ppm，并且基板的绝缘基材的XY方向的热膨胀系数设定为低于通孔导体的镀铜膜的热膨胀系数。

公开(公告)号：US20120103931A1

公开(公告)日：2012-05-03

申请号：US13347022

申请日：2012-01-10

申请人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Akihiro Miyata ,  Fumitaka Takagi

发明人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Akihiro Miyata ,  Fumitaka Takagi

IPC分类号： H05K3/06

CPC分类号： C23F1/02 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K3/108 ,  H05K3/243 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2203/0369 ,  H05K2203/049 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the etching and plating resists, and forming a wiring having a pad for wire-bonding an electrode of an electronic component and a conductive circuit thinner than the pad by removing the metal film exposed after the plating resist is removed, a solder-resist layer on the surface of the board and wiring, an opening in the layer exposing the pad and a portion of the circuit contiguous to the pad, and a metal coating on the pad and portion of the circuit exposed through the opening.

摘要翻译： 一种制造印刷电路板的方法，包括在绝缘板的表面上形成金属膜，在金属膜上形成电镀抗蚀剂，以及在电镀抗蚀剂暴露的金属膜上的镀金属膜，覆盖一部分 具有抗蚀剂的电镀金属膜，蚀刻以减少从抗蚀剂暴露的电镀金属膜的厚度，去除蚀刻和电镀抗蚀剂，以及形成具有用于将电子部件的电极引线接合的焊盘的布线，以及 通过去除在电镀抗蚀剂之后暴露的金属膜而比焊盘更薄的导电电路被去除，在该板和布线的表面上的阻焊层，暴露该焊盘的该层中的一个开口和该电路的一部分与 焊盘和焊盘上的金属涂层以及通过开口露出的电路部分。

公开(公告)号：US08153905B2

公开(公告)日：2012-04-10

申请号：US12685716

申请日：2010-01-12

申请人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

发明人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

IPC分类号： H05K1/11 ,  H05K3/10

CPC分类号： H05K1/111 ,  H01L21/4846 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/108 ,  H05K3/3484 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2203/0369 ,  H05K2203/043 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156 ,  H01L2224/0401

摘要： A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal film with an etching resist, etching to reduce thickness of the plated-metal film exposed from the etching resist, removing the resists, and forming a wiring having a pad and a conductive circuit thinner than the pad by removing the metal film exposed through the removing of the plating resist, a solder-resist layer on the surface of the board and wiring, in the layer an opening exposing the pad and a portion of the circuit contiguous to the pad, a solder film on the pad and portion of the circuit exposed through the opening, and a solder bump on the pad by solder reflow.

摘要翻译： 一种制造印刷电路板的方法，包括在绝缘板的表面上形成金属膜，在金属膜上形成电镀抗蚀剂，以及在电镀抗蚀剂暴露的金属膜上的镀金属膜，覆盖一部分 具有抗蚀剂的镀金属膜，蚀刻以减少从抗蚀剂暴露的镀金属膜的厚度，去除抗蚀剂，以及通过除去暴露的金属膜，形成具有焊盘和比焊盘更薄的导电电路的布线 通过去除电镀抗蚀剂，在基板和布线的表面上形成阻焊层，在该层中，露出焊盘的开口和与焊盘相邻的电路的一部分，焊盘上的焊料膜和 通过开口暴露的电路，以及通过焊料回流焊盘上的焊料凸块。

公开(公告)号：US20100221414A1

公开(公告)日：2010-09-02

申请号：US12491282

申请日：2009-06-25

申请人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

发明人： Toru Furuta ,  Kotaro Takagi ,  Michio Ido ,  Fumitaka Takagi

IPC分类号： B05D5/12

CPC分类号： H05K1/111 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2924/0002 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15151 ,  H05K3/06 ,  H05K3/108 ,  H05K3/243 ,  H05K3/244 ,  H05K3/323 ,  H05K3/3452 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2201/0989 ,  H05K2203/0369 ,  H05K2203/0574 ,  Y02P70/611 ,  H01L2224/05552 ,  H01L2924/00

摘要： A method for manufacturing a printed wiring board includes preparing insulative board having first and second surfaces, forming metal film on the first surface, plating resist on the metal film and plated-metal film on the metal film exposed by the plating resist, covering portion of the plated-metal film with etching resist, etching to reduce thickness of the plated-metal film exposed by the etching resist, removing the etching and plating resists, by removing the metal film exposed after removing the plating resist, forming wiring comprising pad for electronic component having gold bump and conductive circuit which is thinner than the pad, forming solder-resist layer on the first surface and the wiring, and forming opening in the solder-resist layer to expose the pad and portion of the conductive circuit contiguous to the pad and metal coating on the pad and portion of the conductive circuit, which are exposed through the opening.

摘要翻译： 一种制造印刷电路板的方法，包括制备具有第一表面和第二表面的绝缘板，在第一表面上形成金属膜，在金属膜上形成电镀抗蚀剂和在电镀抗蚀剂暴露的金属膜上的镀金属膜，覆盖部分 具有抗蚀剂的电镀金属膜，通过去除在去除电镀抗蚀剂之后暴露的金属膜，蚀刻以减少由抗蚀剂暴露的电镀金属膜的厚度，去除蚀刻和电镀抗蚀剂的蚀刻，形成包括用于电子的焊盘的布线 具有比焊盘薄的金凸块和导电电路的部件，在第一表面和布线上形成阻焊层，以及在阻焊层中形成开口以暴露焊盘和与焊盘相邻的导电电路的部分 以及通过开口暴露在焊盘和导电电路的部分上的金属涂层。

公开(公告)号：US08927875B2

公开(公告)日：2015-01-06

申请号：US13562508

申请日：2012-07-31

申请人： Toru Furuta ,  Fumitaka Takagi

发明人： Toru Furuta ,  Fumitaka Takagi

IPC分类号： H05K1/03 ,  H05K3/34 ,  H05K1/02 ,  H05K3/10 ,  H05K1/11 ,  H05K3/46

CPC分类号： H05K1/0296 ,  H01L2224/48091 ,  H05K1/114 ,  H05K3/10 ,  H05K3/3452 ,  H05K3/4652 ,  Y10T29/49155 ,  H01L2924/00014

摘要： A wiring board includes an interlayer insulation layer, conductive patterns formed on the interlayer insulation layer, and a solder-resist layer formed on the interlayer insulation layer and having an opening partially exposing the conductive patterns. The solder-resist layer has an edge portion bordering the opening and intersecting the conductive patterns, and the edge portion of the solder-resist layer has a concavo-convex shape having convex portions and concave portions such that the convex portions and the concave portions are alternately intersecting the conductive patterns.

摘要翻译： 布线板包括层间绝缘层，形成在层间绝缘层上的导电图案，以及形成在层间绝缘层上的具有部分地暴露导电图案的开口的阻焊层。 阻焊层具有与开口相邻并且与导电图案相交的边缘部分，阻焊层的边缘部分具有凹凸形状，具有凸部和凹部，使得凸部和凹部为 交替地与导电图案相交。