公开(公告)号：US08109687B2

公开(公告)日：2012-02-07

申请号：US12219002

申请日：2008-07-15

申请人： Da-Hui Xu ,  Hong-Ying Li

发明人： Da-Hui Xu ,  Hong-Ying Li

IPC分类号： A47B57/06

CPC分类号： F16B7/105 ,  Y10T403/32467 ,  Y10T403/32483 ,  Y10T403/32524

摘要： A telescopic adjusting mechanism includes: an outer tube having a positioning unit; an inner tube having a hole and displaceable relative to the outer tube along a longitudinal axis; a locking unit displaceable along with the inner tube, and including a locking member movable along a transverse axis between a locking position, where the locking member extends through the hole to engage the positioning unit, and an unlocking position, where the locking member is disengaged from the positioning unit, and a biasing member biasing the locking member to the locking position, the locking unit being formed with an engaging member; a restraining member engaging releasably the engaging member when the locking member is at the unlocking position to prevent the locking unit from hindering retraction of the inner tube into the outer tube; and a drive unit operable to move the locking member from the locking position to the unlocking position.

摘要翻译： 伸缩调节机构包括：具有定位单元的外管; 内管，其具有孔，并且沿着纵向轴线相对于所述外管可移位; 锁定单元可与内管一起移动，并且包括可沿着横向轴线移动的锁定构件，其在锁定构件延伸穿过孔以接合定位单元的锁定位置和锁定构件脱离位置之间的解锁位置 以及偏置构件将所述锁定构件偏置到所述锁定位置，所述锁定单元形成有接合构件; 所述限制构件在所述锁定构件处于所述解锁位置时可释放地接合所述接合构件，以防止所述锁定单元阻碍所述内管进入所述外管的缩回; 以及驱动单元，其可操作以将所述锁定构件从所述锁定位置移动到所述解锁位置。

公开(公告)号：US07531442B2

公开(公告)日：2009-05-12

申请号：US11290087

申请日：2005-11-30

申请人： Jayanthi Pallinti ,  Dilip Vijay ,  Hemanshu Bhatt ,  Sey-Shing Sun ,  Hong Ying ,  Chiyi Kao ,  Peter Burke ,  Ramaswamy Ranganathan ,  Qwai Low

发明人： Jayanthi Pallinti ,  Dilip Vijay ,  Hemanshu Bhatt ,  Sey-Shing Sun ,  Hong Ying ,  Chiyi Kao ,  Peter Burke ,  Ramaswamy Ranganathan ,  Qwai Low

IPC分类号： H01L21/44

CPC分类号： H01L21/76801 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00

摘要： Different ways to reduce or eliminate the IMC cracking issues in wire bonded parts, including: changing to more compressive dielectric films for top, R1, and R2; changing the top passivation film stacks to more compressive films; changing the low k film to a higher compressive film; reducing the R layer thickness and pattern density to reduce tensile stress; and minimizing anneal and dielectric deposition temperatures. Each of the methods can be used individually or in combination with each other to reduce overall tensile stresses in the Cu/low-k wafer thus reducing or eliminating the IMC cracking issue currently seen in the post wire bonded parts.

摘要翻译： 减少或消除电线接合部件中IMC裂纹问题的不同方式，包括：更换为顶部，R1和R2的更多压电绝缘膜; 将顶部钝化膜堆叠更改为更多的压缩膜; 将低k膜改为较高的压缩膜; 降低R层厚度和图案密度以降低拉伸应力; 并最小化退火和介电沉积温度。 每个方法可以单独使用或彼此组合使用以减少Cu / low-k晶片中的总拉伸应力，从而减少或消除了现在在后引线接合部件中看到的IMC裂纹问题。

公开(公告)号：US07150844B2

公开(公告)日：2006-12-19

申请号：US10685462

申请日：2003-10-16

申请人： Neil N. Deeman ,  Hong Ying Wang ,  Gennady Gauzner ,  Nobuo Kurataka

发明人： Neil N. Deeman ,  Hong Ying Wang ,  Gennady Gauzner ,  Nobuo Kurataka

IPC分类号： B29C33/42 ,  C25D1/10

CPC分类号： C25D1/20 ,  C25D1/00 ,  C25D1/10

摘要： A method of manufacturing a stamper/imprinter for use in patterning of a recording medium comprises sequential steps of: (a) providing a substrate/workpiece comprising a topographically patterned surface including a plurality of projections and depressions corresponding to a pattern to be formed in a surface of the recording medium; (b) forming a thin release layer in conformal contact with the topographically patterned surface by means of a dry process; (c) forming a thicker layer of a material in conformal contact with the thin passivation layer on the topographically patterned surface; and (d) separating the thicker layer of material from the topographically patterned surface to form therefrom a stamper/imprinter including an imprinting surface having a negative image replica of the topographically patterned surface, separation of the thicker layer of material from the topographically patterned surface being facilitated by the thin release layer formed by the dry process.

摘要翻译： 一种制造用于记录介质图形化的压模/打印机的方法包括以下步骤：（a）提供基板/工件，该基板/工件包括地形图形表面，其包括对应于待形成的图案的多个凸起和凹陷 记录介质的表面; （b）通过干法形成与地形图形表面保形接触的薄释放层; （c）在地形图形表面上形成与薄钝化层保形接触的材料的较厚层; 以及（d）将厚层材料与地形图案化的表面分离以形成压模/打印机，其包括具有地形图形表面的负图像复制品的压印表面，较厚的材料层与地形图形表面的分离是 由通过干法形成的薄释放层促进。

公开(公告)号：US06815342B1

公开(公告)日：2004-11-09

申请号：US09996118

申请日：2001-11-27

申请人： Chuan-cheng Cheng ,  Sethuraman Lakshminarayanan ,  Peter J. Wright ,  Hong Ying

发明人： Chuan-cheng Cheng ,  Sethuraman Lakshminarayanan ,  Peter J. Wright ,  Hong Ying

IPC分类号： H01L214763

CPC分类号： H01L21/76838 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

摘要： Low resistance interconnect lines and methods for fabricating them are described herein. IC fabrication processes are used to create interconnect lines of Al and Cu layers. The Cu layer is thinner than in the known art, but in combination with the Al layer, the aggregate Cu/Al resistance is lowered to a point where it is comparable to that of a very thick Cu layer, without the additional cost and yield problems caused by using a thicker Cu deposition. Fuses for memory repair can also be fabricated using the methods taught by the present invention with only small variations in the process.

摘要翻译： 本文描述了低电阻互连线及其制造方法。 IC制造工艺用于制造Al和Cu层的互连线。 Cu层比现有技术更薄，但与Al层结合时，聚集的Cu / Al电阻降低到与非常厚的Cu层相当的点，而没有额外的成本和产率问题 由于使用较厚的铜沉积引起。 用于记忆修复的保险丝也可以使用本发明教导的方法制造，只有该过程的变化很小。

公开(公告)号：US06764734B2

公开(公告)日：2004-07-20

申请号：US09314262

申请日：1999-05-18

申请人： Stanley Dale Vierk ,  Hong Ying Wang

发明人： Stanley Dale Vierk ,  Hong Ying Wang

IPC分类号： G11B582

CPC分类号： G11B5/7315 ,  G11B5/5965 ,  G11B5/74 ,  G11B11/10584 ,  G11B11/10586 ,  Y10T428/24994 ,  Y10T428/256 ,  Y10T428/258 ,  Y10T428/259

摘要： A substract for use in a data storage system is disclosed. The substrate includes at least one core layer comprising at least one plastic or plastic composite material exhibiting a modulus of about 350 kpsi or greater, and damping agents, reinforcing agents, or combinations thereof. The damping agents, reinforcing agents, or combinations thereof, are substantially uniformly distributed within the plastic or plastic composite material. Optionally, one or more skin layers are disposed adjacent the at least one core layer.

摘要翻译： 公开了一种用于数据存储系统的子系统。 该基材包括至少一个包含至少一种显示约350kpsi或更大的模量的塑料或塑料复合材料的芯层，以及阻尼剂，增强剂或其组合。 阻尼剂，增强剂或其组合基本均匀地分布在塑料或塑料复合材料内。 可选地，一个或多个表皮层邻近所述至少一个芯层设置。

公开(公告)号：US06623788B1

公开(公告)日：2003-09-23

申请号：US09852084

申请日：2001-05-10

申请人： Hong Ying Wang ,  Neil Deeman ,  Gene Gauzner

发明人： Hong Ying Wang ,  Neil Deeman ,  Gene Gauzner

IPC分类号： B05D512

CPC分类号： B82Y10/00 ,  G11B5/743 ,  G11B5/84 ,  G11B5/8404 ,  G11B5/855

摘要： A method of manufacturing a magnetic recording medium comprises steps of providing a non-magnetic substrate for a magnetic recording medium, the substrate including at least one major surface; forming a layer of a sol-gel on the at least one major surface; forming a pattern, e.g., a servo pattern in an exposed surface of the layer of said sol-gel; and converting the layer of sol-gel to a glass or glass-like layer while preserving the pattern in an exposed surface of said glass or glass-like layer. Embodiments of the invention include magnetic media including a patterned glass or glass-like layer formed from a layer of a hydrophilic sol-gel with the pattern embossed therein by means of a stamper having a hydrophilic surface including a negative image of the pattern.

摘要翻译： 制造磁记录介质的方法包括以下步骤：提供用于磁记录介质的非磁性基板，所述基板包括至少一个主表面; 在所述至少一个主表面上形成溶胶 - 凝胶层; 在所述溶胶 - 凝胶层的暴露表面中形成图案，例如伺服图案; 并且将所述溶胶 - 凝胶层转变成玻璃或玻璃状层，同时将所述图案保留在所述玻璃或玻璃状层的暴露表面中。 本发明的实施例包括磁性介质，其包括由亲水溶胶 - 凝胶层形成的图案化玻璃或玻璃状层，其中图案通过具有包含图案的负像的亲水表面的压模压印在其中。

公开(公告)号：US06555874B1

公开(公告)日：2003-04-29

申请号：US09649380

申请日：2000-08-28

申请人： Sheng Teng Hsu ,  Douglas James Tweet ,  Bruce Dale Ulrich ,  Hong Ying

发明人： Sheng Teng Hsu ,  Douglas James Tweet ,  Bruce Dale Ulrich ,  Hong Ying

IPC分类号： H01L310392

CPC分类号： H01L21/84 ,  H01L27/1203 ,  H01L29/7378

摘要： A semiconductor structure includes, on a SOI substrate, a CMOS formed on the substrate; and a SiGe HBT formed on the substrate. A method of fabricating a semiconductor structure includes preparing a SOI substrate having plural active regions thereon; forming a CMOS on the SOI substrate in a first active region; and forming a SiGe HBT on the SOI substrate in another active region.

摘要翻译： 半导体结构在SOI衬底上包括在衬底上形成的CMOS; 和形成在衬底上的SiGe HBT。 制造半导体结构的方法包括制备其上具有多个有源区的SOI衬底; 在第一有源区中在SOI衬底上形成CMOS; 以及在另一有源区的SOI衬底上形成SiGe HBT。

公开(公告)号：US20080093336A1

公开(公告)日：2008-04-24

申请号：US11583845

申请日：2006-10-20

申请人： Kim Y. Lee ,  Hong Ying Wang ,  Nobuo Kurataka ,  Christopher Formato ,  David S. Kuo ,  Dieter K. Weller

发明人： Kim Y. Lee ,  Hong Ying Wang ,  Nobuo Kurataka ,  Christopher Formato ,  David S. Kuo ,  Dieter K. Weller

IPC分类号： B44C1/22 ,  C03C25/68

CPC分类号： G11B5/855 ,  G11B5/667 ,  G11B5/732

摘要： A method of fabricating a patterned magnetic recording medium, comprises steps of: (a) providing a layer stack including an uppermost non-magnetic interlayer; (b) forming a resist layer on the interlayer; (c) forming a first pattern comprising a first group of recesses extending through the resist layer and exposing a first group of spaced apart surface portions of the interlayer; (d) filling the first group of recesses with a layer of a hard mask material; (e) selectively removing the resist layer to form a second pattern comprising a second group of recesses extending through the hard mask layer and exposing a second group of spaced apart surface portions of the interlayer; and (f) filling the second group of recesses with a layer of a magnetically hard material forming a magnetic recording layer.

摘要翻译： 一种制造图案化磁记录介质的方法，包括以下步骤：（a）提供包括最上面的非磁性中间层的层堆叠; （b）在所述中间层上形成抗蚀剂层; （c）形成第一图案，其包括延伸穿过抗蚀剂层的第一组凹槽，并暴露出中间层的第一组间隔开的表面部分; （d）用一层硬掩模材料填充第一组凹槽; （e）选择性地去除所述抗蚀剂层以形成第二图案，所述第二图案包括延伸穿过所述硬掩模层并暴露所述中间层的第二组间隔开的表面部分的第二组凹部; 和（f）用形成磁记录层的磁性硬质材料层填充第二组凹部。

公开(公告)号：US20070114667A1

公开(公告)日：2007-05-24

申请号：US11283219

申请日：2005-11-18

申请人： Hemanshu Bhatt ,  Dilip Vijay ,  Jayanthi Pallinti ,  Sey-Shing Sun ,  Hong Ying ,  Chiyi Kao

发明人： Hemanshu Bhatt ,  Dilip Vijay ,  Jayanthi Pallinti ,  Sey-Shing Sun ,  Hong Ying ,  Chiyi Kao

IPC分类号： H01L23/52

CPC分类号： H05K1/0271 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05009 ,  H01L2224/05073 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/05558 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/45144 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/107 ,  Y10T428/12396 ,  H01L2924/00014 ,  H01L2924/00

摘要： Passivation integration schemes and pad structures to reduce the stress gradients and/or improve the contact surface existing between the Al in the pad and the gold wire bond. One of the pad structures provides a plurality of recessed pad areas which are formed in a single aluminum pad. An oxide mesa can be provided under the aluminum pad. Another pad structure provides a single recessed pad area which is formed in a single aluminum pad, and the aluminum pad is disposed above a copper pad and a plurality of trench/via pads. Still another pad structure provides a single recessed pad area which is formed in a single aluminum pad, and the aluminum pad is disposed above a portion of a copper pad, such that the aluminum pad and the copper pad are staggered relative to each other.

摘要翻译： 钝化整合方案和焊盘结构以减少应力梯度和/或改善焊盘中的Al和金线键之间存在的接触表面。 垫结构之一提供了形成在单个铝垫中的多个凹陷区域。 可以在铝垫下方设置氧化物台面。 另一个垫结构提供形成在单个铝垫中的单个凹陷区域，并且铝垫设置在铜焊盘和多个沟槽/通孔焊盘之上。 另一个衬垫结构提供形成在单个铝垫中的单个凹陷区域，并且铝垫设置在铜垫的一部分上方，使得铝垫和铜垫相对于彼此交错。

公开(公告)号：US07033685B2

公开(公告)日：2006-04-25

申请号：US10679419

申请日：2003-10-07

申请人： Jean L. Lee ,  Thomas P. Nolan ,  Hong Ying Wang ,  Gary C. Rauch

发明人： Jean L. Lee ,  Thomas P. Nolan ,  Hong Ying Wang ,  Gary C. Rauch

IPC分类号： G11B5/667 ,  G11B5/673

CPC分类号： G11B5/667 ,  G11B5/656 ,  G11B5/8404 ,  Y10T428/24248

摘要： A method of manufacturing a perpendicular magnetic recording medium, comprises steps of: (a) providing a substrate of an amorphous thermoplastic polymer material having softening and glass transition temperatures as low as about 95° C.; and (b) forming at least one stack of thin film layers atop at least one surface of the substrate, the at least one layer stack including at least one granular magnetic recording layer of perpendicular type, wherein oxides and/or nitrides provide physical de-coupling of adjacent magnetic grains; and wherein each of the thin film layers is formed by depositing at a substrate temperature not greater than about 70° C., and the coercivity (Hc) of the resultant perpendicular magnetic recording medium is at least about 4,000 Oe.

摘要翻译： 制造垂直磁记录介质的方法包括以下步骤：（a）提供具有低至约95℃的软化和玻璃化转变温度的无定型热塑性聚合物材料的基底; 和（b）在所述衬底的至少一个表面上方形成至少一层薄膜层，所述至少一层堆叠包括至少一个垂直型粒状磁记录层，其中氧化物和/或氮化物提供物理去除层， 相邻磁性颗粒的耦合; 并且其中每个薄膜层通过在不大于约70℃的衬底温度下沉积而形成，并且所得到的垂直磁记录介质的矫顽力（H C）至少约为 4000盎司