公开(公告)号：US08299666B2

公开(公告)日：2012-10-30

申请号：US12819678

申请日：2010-06-21

申请人： Yuji Shirakata ,  Dai Nakajima ,  Masahiko Fujita ,  Masaki Kato ,  Kazuyasu Sakamoto ,  Takuya Oga

发明人： Yuji Shirakata ,  Dai Nakajima ,  Masahiko Fujita ,  Masaki Kato ,  Kazuyasu Sakamoto ,  Takuya Oga

IPC分类号： H02K11/00 ,  H02K9/00 ,  H02K7/00

CPC分类号： H02P9/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/181 ,  H01L2924/1815 ,  H02K11/048 ,  H02K19/365 ,  H02P2101/45 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A dynamoelectric machine main body, power circuit modules and a field circuit module, and a control apparatus that has a heatsink that is prepared by die casting, and that is mounted integrally onto the dynamoelectric machine main body are included, the heatsink including a plurality of convex heat receiving portions that are disposed so as to project from a front surface of a base plate, and that have heat receiving surfaces, the power circuit modules and the field circuit module including seal main body portions that are constituted by an electrically insulating resin that seal switching elements so as to expose bottom surfaces of element heat radiating portions on reference surfaces that have a surface shape that corresponds to a shape of the heat receiving surfaces, and electrical insulation supporting layers being interposed between the bottom surfaces of the heat receiving surfaces and the element heat radiating portions.

摘要翻译： 电动机主体，电力电路模块和现场电路模块以及具有通过压铸制造的散热器并且整体安装在电动机械主体上的控制装置的散热器包括多个 凸形受热部，其从基板的前表面突出设置并具有受热面，所述电源电路模块和励磁电路模块包括由电绝缘树脂构成的密封主体部， 密封开关元件，以便露出具有与受热表面形状相对应的表面形状的参考表面上的元件散热部分的底表面，以及插入在热接收表面的底表面之间的电绝缘支撑层，以及 元件散热部分。

公开(公告)号：US20110254148A1

公开(公告)日：2011-10-20

申请号：US12908500

申请日：2010-10-20

申请人： Masaki KATO ,  Masahiko FUJITA ,  Kazuyasu SAKAMOTO

发明人： Masaki KATO ,  Masahiko FUJITA ,  Kazuyasu SAKAMOTO

IPC分类号： H01L23/36

CPC分类号： H05K1/021 ,  H01L23/13 ,  H01L23/36 ,  H01L23/4093 ,  H01L2924/0002 ,  H05K1/184 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/09827 ,  H05K2201/10166 ,  H05K2201/10689 ,  H01L2924/00

摘要： The invention is to provide a semiconductor apparatus configured to position a semiconductor device reliably and easily without having a protruding portion formed in the bottom surface of the semiconductor device in the semiconductor apparatus. A semiconductor apparatus is fabricated by attaching a semiconductor device of a surface mount package type and a wiring member to a heat sink. A fitting portion in which the semiconductor device is fit is provided to the wiring member, so that the semiconductor device is positioned by fitting the semiconductor device into the fitting portion provided to the wiring member. According to the semiconductor apparatus of the invention, it becomes possible to position the semiconductor device at a high degree of accuracy.

摘要翻译： 本发明提供一种半导体装置，其被配置为可靠且容易地定位半导体器件，而不会在半导体器件中的半导体器件的底表面中形成突出部分。 通过将表面安装封装型半导体器件和布线构件附接到散热器来制造半导体器件。 在配线部件上设置有将半导体装置配合的嵌合部，通过将半导体装置嵌入到配线部件的嵌合部中来定位半导体装置。 根据本发明的半导体装置，可以高精度地定位半导体器件。

公开(公告)号：US09479032B2

公开(公告)日：2016-10-25

申请号：US13877401

申请日：2011-01-06

申请人： Masaki Kato ,  Masahiko Fujita ,  Kazuyasu Sakamoto

发明人： Masaki Kato ,  Masahiko Fujita ,  Kazuyasu Sakamoto

IPC分类号： H02K11/00 ,  H02K5/22 ,  H02K11/04

CPC分类号： H02K11/046 ,  H02K5/225 ,  H02K11/048

摘要： The rotary electric machine main body includes: a stator; a rotor that includes a rotating shaft and that is rotatable relative to the stator; and a supporting body that supports the stator and the rotor. The controlling apparatus includes a power circuit portion that is disposed around the rotating shaft, and that converts electric power that is received from the rotary electric machine main body or electric power that is supplied to the rotary electric machine main body between alternating current and direct current. The power circuit portion includes: a power module; and an electric power interconnecting part that includes a conductor that is connected to a terminal of the power module. The electric power interconnecting part is disposed so as to avoid overlapping with a region of the power module when the power circuit portion is viewed in an axial direction of the rotating shaft.

摘要翻译： 旋转电机主体包括：定子; 转子，其包括旋转轴并且可相对于所述定子旋转; 以及支撑定子和转子的支撑体。 控制装置包括：电源电路部，其设置在旋转轴的周围，并且将从旋转电机主体接收的电力或供给到旋转电机主体的电力转换为交流电和直流电 。 电源电路部分包括：电源模块; 以及电力互连部，其包括连接到所述电力模块的端子的导体。 电力互连部被设置为当从旋转轴的轴向观察电力电路部时，避免与电​​力模块的区域重叠。

公开(公告)号：US20110175496A1

公开(公告)日：2011-07-21

申请号：US12819678

申请日：2010-06-21

申请人： Yuji SHIRAKATA ,  Dai Nakajima ,  Masahiko Fujita ,  Masaki Kato ,  Kazuyasu Sakamoto ,  Takuya Oga

发明人： Yuji SHIRAKATA ,  Dai Nakajima ,  Masahiko Fujita ,  Masaki Kato ,  Kazuyasu Sakamoto ,  Takuya Oga

IPC分类号： H02K7/00

CPC分类号： H02P9/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/181 ,  H01L2924/1815 ,  H02K11/048 ,  H02K19/365 ,  H02P2101/45 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A dynamoelectric machine main body, power circuit modules and a field circuit module, and a control apparatus that has a heatsink that is prepared by die casting, and that is mounted integrally onto the dynamoelectric machine main body are included, the heatsink including a plurality of convex heat receiving portions that are disposed so as to project from a front surface of a base plate, and that have heat receiving surfaces, the power circuit modules and the field circuit module including seal main body portions that are constituted by an electrically insulating resin that seal switching elements so as to expose bottom surfaces of element heat radiating portions on reference surfaces that have a surface shape that corresponds to a shape of the heat receiving surfaces, and electrical insulation supporting layers being interposed between the bottom surfaces of the heat receiving surfaces and the element heat radiating portions.

摘要翻译： 电动机主体，电力电路模块和现场电路模块以及具有通过压铸制造的散热器并且整体安装在电动机械主体上的控制装置的散热器包括多个 凸形受热部，其从基板的前表面突出设置并具有受热面，所述电源电路模块和励磁电路模块包括由电绝缘树脂构成的密封主体部， 密封开关元件，以便露出具有与受热表面形状相对应的表面形状的参考表面上的元件散热部分的底表面，以及插入在热接收表面的底表面之间的电绝缘支撑层，以及 元件散热部分。

公开(公告)号：US09006879B2

公开(公告)日：2015-04-14

申请号：US12908500

申请日：2010-10-20

申请人： Masaki Kato ,  Masahiko Fujita ,  Kazuyasu Sakamoto

发明人： Masaki Kato ,  Masahiko Fujita ,  Kazuyasu Sakamoto

IPC分类号： H01L23/40 ,  H05K1/02 ,  H01L23/36 ,  H05K1/18

CPC分类号： H05K1/021 ,  H01L23/13 ,  H01L23/36 ,  H01L23/4093 ,  H01L2924/0002 ,  H05K1/184 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/09827 ,  H05K2201/10166 ,  H05K2201/10689 ,  H01L2924/00

摘要： The invention is to provide a semiconductor apparatus configured to position a semiconductor device reliably and easily without having a protruding portion formed in the bottom surface of the semiconductor device in the semiconductor apparatus. A semiconductor apparatus is fabricated by attaching a semiconductor device of a surface mount package type and a wiring member to a heat sink. A fitting portion in which the semiconductor device is fit is provided to the wiring member, so that the semiconductor device is positioned by fitting the semiconductor device into the fitting portion provided to the wiring member. According to the semiconductor apparatus of the invention, it becomes possible to position the semiconductor device at a high degree of accuracy.

摘要翻译： 本发明提供一种半导体装置，其被配置为可靠且容易地定位半导体器件，而不会在半导体器件中的半导体器件的底表面中形成突出部分。 通过将表面安装封装型半导体器件和布线构件附接到散热器来制造半导体器件。 在配线部件上设置有将半导体装置配合的嵌合部，通过将半导体装置嵌入到配线部件的嵌合部中来定位半导体装置。 根据本发明的半导体装置，可以高精度地定位半导体器件。

公开(公告)号：US09401319B2

公开(公告)日：2016-07-26

申请号：US13980997

申请日：2011-06-09

申请人： Takuya Oga ,  Kazuyasu Sakamoto ,  Tsuyoshi Sugihara ,  Masaki Kato ,  Daisuke Nakashima ,  Tsuyoshi Jida ,  Gen Tada

发明人： Takuya Oga ,  Kazuyasu Sakamoto ,  Tsuyoshi Sugihara ,  Masaki Kato ,  Daisuke Nakashima ,  Tsuyoshi Jida ,  Gen Tada

IPC分类号： H01L23/48 ,  H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L25/11

CPC分类号： H01L23/4952 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L25/115 ,  H01L2224/04026 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05567 ,  H01L2224/06181 ,  H01L2224/29201 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/30181 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/4007 ,  H01L2224/40095 ,  H01L2224/40179 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/40249 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48699 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83139 ,  H01L2224/8314 ,  H01L2224/83143 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84138 ,  H01L2224/84143 ,  H01L2224/84205 ,  H01L2224/84801 ,  H01L2224/85205 ,  H01L2224/92157 ,  H01L2224/92246 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2224/83205 ,  H01L2224/37099

摘要： A semiconductor device is provided, in which a first lead (11) is joined with the bottom electrode (23) of a MOS-FET (21) with first solder (51), the top electrode (22) of the MOS-FET is joined with an internal lead (31) with second solder (52), the internal lead is joined with a projection (61) of a second lead with third solder (53), and the first lead, second lead, MOS-FET and internal lead are integrally molded using sealing resin (41), wherein the first solder and second solder include support members (54) and (55), respectively, located thereinside and positions of the internal lead and MOS-FET are stabilized by self-alignment.

摘要翻译： 提供一种半导体器件，其中第一引线（11）与第一焊料（51）与MOS-FET（21）的底部电极（23）接合，MOS-FET的顶部电极（22）为 与第二焊料（52）的内部引线（31）连接，内部引线与第三引线（53）与第二引线的突起（61）接合，并且第一引线，第二引线，MOS-FET和内部引线 引线使用密封树脂（41）整体模制，其中第一焊料和第二焊料分别包括位于其内的支撑部件（54）和（55），并且通过自对准来稳定内部引线和MOS-FET的位置。

公开(公告)号：US20130187497A1

公开(公告)日：2013-07-25

申请号：US13877401

申请日：2011-01-06

申请人： Masaki Kato ,  Masahiko Fujita ,  Kazuyasu Sakamoto

发明人： Masaki Kato ,  Masahiko Fujita ,  Kazuyasu Sakamoto

IPC分类号： H02K11/04

CPC分类号： H02K11/046 ,  H02K5/225 ,  H02K11/048

摘要： The rotary electric machine main body includes: a stator; a rotor that includes a rotating shaft and that is rotatable relative to the stator; and a supporting body that supports the stator and the rotor. The controlling apparatus includes a power circuit portion that is disposed around the rotating shaft, and that converts electric power that is received from the rotary electric machine main body or electric power that is supplied to the rotary electric machine main body between alternating current and direct current. The power circuit portion includes: a power module; and an electric power interconnecting part that includes a conductor that is connected to a terminal of the power module. The electric power interconnecting part is disposed so as to avoid overlapping with a region of the power module when the power circuit portion is viewed in an axial direction of the rotating shaft.

摘要翻译： 旋转电机主体包括：定子; 转子，其包括旋转轴并且可相对于所述定子旋转; 以及支撑定子和转子的支撑体。 控制装置包括：电源电路部，其设置在旋转轴的周围，并且将从旋转电机主体接收的电力或供给到旋转电机主体的电力转换为交流电和直流电 。 电源电路部分包括：电源模块; 以及电力互连部，其包括连接到所述电力模块的端子的导体。 电力互连部被设置为当从旋转轴的轴向观察电力电路部时，避免与电​​力模块的区域重叠。

公开(公告)号：US3615599A

公开(公告)日：1971-10-26

申请号：US3615599D

申请日：1967-05-01

申请人： YOSHIZO SAKAMOTO ,  KAZUYASU SAKAMOTO

发明人： SAKAMOTO YOSHIZO ,  SAKAMOTO KAZUYASU

IPC分类号： A23B7/02 ,  A23L27/00 ,  A23L27/16 ,  A61K36/00 ,  A61K36/8962 ,  A23L1/22

CPC分类号： A61K36/8962

摘要： A method and apparatus for processing garlic wherein the garlic is heated in a closed volume with agitation for uniform heating under nonoxidizing conditions to obtain its solid and volatile components. The volatile component is removed from the closed volume and is separated into its liquid and gaseous fractions. The liquid fraction is collected and at the same time dust is removed from the gaseous fraction and collected.

公开(公告)号：US20130307130A1

公开(公告)日：2013-11-21

申请号：US13980997

申请日：2011-06-09

申请人： Takuya Oga ,  Kazuyasu Sakamoto ,  Tsuyoshi Sugihara ,  Masaki Kato ,  Daisuke Nakashima ,  Tsuyoshi Jida ,  Gen Tada

发明人： Takuya Oga ,  Kazuyasu Sakamoto ,  Tsuyoshi Sugihara ,  Masaki Kato ,  Daisuke Nakashima ,  Tsuyoshi Jida ,  Gen Tada

IPC分类号： H01L23/495

CPC分类号： H01L23/4952 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L25/115 ,  H01L2224/04026 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05567 ,  H01L2224/06181 ,  H01L2224/29201 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/30181 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/4007 ,  H01L2224/40095 ,  H01L2224/40179 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/40249 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48699 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83139 ,  H01L2224/8314 ,  H01L2224/83143 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84138 ,  H01L2224/84143 ,  H01L2224/84205 ,  H01L2224/84801 ,  H01L2224/85205 ,  H01L2224/92157 ,  H01L2224/92246 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2224/83205 ,  H01L2224/37099

摘要： A semiconductor device is provided, in which a first lead (11) is joined with the bottom electrode (23) of a MOS-FET (21) with first solder (51), the top electrode (22) of the MOS-FET is joined with an internal lead (31) with second solder (52), the internal lead is joined with a projection (61) of a second lead with third solder (53), and the first lead, second lead, MOS-FET and internal lead are integrally molded using sealing resin (41), wherein the first solder and second solder include support members (54) and (55), respectively, located thereinside and positions of the internal lead and MOS-FET are stabilized by self-alignment.

摘要翻译： 提供一种半导体器件，其中第一引线（11）与第一焊料（51）与MOS-FET（21）的底部电极（23）接合，MOS-FET的顶部电极（22）为 与第二焊料（52）的内部引线（31）连接，内部引线与第三引线（53）与第二引线的突起（61）接合，并且第一引线，第二引线，MOS-FET和内部引线 引线使用密封树脂（41）整体模制，其中第一焊料和第二焊料分别包括位于其内的支撑部件（54）和（55），并且通过自对准来稳定内部引线和MOS-FET的位置。