公开(公告)号：US06184479B2

公开(公告)日：2001-02-06

申请号：US08761027

申请日：1996-12-05

申请人： Shuhichi Okabe ,  Keizo Sakurai

发明人： Shuhichi Okabe ,  Keizo Sakurai

IPC分类号： H01R909

CPC分类号： H05K1/111 ,  H01L24/45 ,  H01L2224/45144 ,  H01L2224/4847 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19107 ,  H05K3/0023 ,  H05K3/328 ,  H05K3/4644 ,  H05K2201/09736 ,  Y02P70/611 ,  H01L2924/00014

摘要： The multilayer printed circuit board includes a substrate, a first conductive circuit layer, a photosensitive dielectric layer and a second conductive circuit layer which is electrically connected to the first conductive circuit layer through photo-via holes formed in the photosensitive dielectric layer. The second conductive circuit layer includes a wiring area where a plurality of wires are arranged and a pad area to which an external wire is to be connected using thermocompression bonding. Significantly, to avoid depressing the photosensitive dielectric layer underneath the pad area during the thermocompression bonding, the thickness of the second conductive circuit layer at least in the pad area, is made greater than that in the wiring area by extending this thickness into the photosensitive dielectric layer.

摘要翻译： 多层印刷电路板包括基板，第一导电电路层，感光介电层和第二导电电路层，其通过形成在感光介电层中的光通孔与第一导电电路层电连接。 第二导电电路层包括布置多个导线的布线区域和使用热压接将外部布线连接的焊盘区域。 重要的是，为了避免在热压接期间压下焊盘区域下面的感光介电层，至少在焊盘区域中的第二导电电路层的厚度通过将该厚度延伸到光敏电介质中而大于布线区域 层。

公开(公告)号：US07021521B2

公开(公告)日：2006-04-04

申请号：US10205118

申请日：2002-07-25

申请人： Hiroyuki Sakurai ,  Keizo Sakurai

发明人： Hiroyuki Sakurai ,  Keizo Sakurai

IPC分类号： B23K31/02 ,  B23K37/04

CPC分类号： H01L24/11 ,  H01L24/45 ,  H01L2224/1134 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  Y10T29/53204 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/01008 ,  H01L2924/01001 ,  H01L2924/01007 ,  H01L2224/0401

摘要： A bump connection is formed by stacking at least two metallic balls of different kinds of metals on a conductor of an electronic component such as a semiconductor device. The bump connection is obtained by forming the metallic balls using metallic wires. An apparatus for forming the connection includes a support, capillary member for having a wire pass therethrough, a pair of clamps for clamping the wire, and a “torch” (e.g., electrode, gas flame) which heats the tip of the wire, forming the ball. Successive balls can be formed by this apparatus atop the initially formed ball to provide a stacked configuration.

公开(公告)号：US06455785B1

公开(公告)日：2002-09-24

申请号：US09412241

申请日：1999-10-05

申请人： Hiroyuki Sakurai ,  Keizo Sakurai

发明人： Hiroyuki Sakurai ,  Keizo Sakurai

IPC分类号： H05K116

CPC分类号： H01L24/11 ,  H01L24/45 ,  H01L2224/1134 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  Y10T29/53204 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/01008 ,  H01L2924/01001 ,  H01L2924/01007 ,  H01L2224/0401

摘要： A bump connection is formed by stacking at least two metallic balls of different kinds of metals on a conductor of an electronic component such as a semiconductor device. The bump connection is obtained by forming the metallic balls using metallic wires. An apparatus for forming the connection includes a support, capillary member for having a wire pass therethrough, a pair of clamps for clamping the wire, and a “torch” (e.g., electrode, gas flame) which heats the tip of the wire, forming the ball. Successive balls can be formed by this apparatus atop the initially formed ball to provide a stacked configuration.

摘要翻译： 通过在诸如半导体器件的电子部件的导体上堆叠至少两种不同种类的金属的金属球来形成凸点连接。 通过使用金属线形成金属球来获得凸块连接。 一种用于形成连接的装置包括支撑件，用于穿过其中的导线的毛细管构件，用于夹紧线的一对夹具以及加热导线末端的“炬”（例如，电极，气体火焰），形成 球。 该装置可以在初始形成的球体上形成连续的球，以提供堆叠构型。

公开(公告)号：US6105243A

公开(公告)日：2000-08-22

申请号：US266658

申请日：1999-03-11

申请人： Shuhichi Okabe ,  Keizo Sakurai

发明人： Shuhichi Okabe ,  Keizo Sakurai

IPC分类号： H01L21/48 ,  H01L23/498 ,  H05K3/00 ,  H05K3/32 ,  H05K3/38 ,  H05K3/46 ,  H05K3/36

CPC分类号： H01L23/49811 ,  H01L21/4853 ,  H01L21/486 ,  H05K3/0023 ,  H05K3/328 ,  H01L2924/0002 ,  H01L2924/19107 ,  H05K2201/2072 ,  H05K3/38 ,  H05K3/4644 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49149

摘要： A method for fabricating a multilayer printed circuit board, as well as the resulting multilayer printed circuit board, is disclosed. The multilayer printed circuit board includes a substrate, a first conductive circuit layer, a photosensitive dielectric layer and a second conductive circuit layer which is electrically connected to the first conductive circuit layer through photo-via holes formed in the photosensitive dielectric layer. The second conductive circuit layer includes a wiring area where a plurality of wires are arranged and a pad area to which an external wire is to be connected using thermocompression bonding. Significantly, to avoid depressing the photosensitive dielectric layer underneath the pad area during the thermocompression bonding, the thickness of the second conductive circuit layer at least in the pad area, is made greater than that in the wiring area by extending this thickness into the photosensitive dielectric layer.

摘要翻译： 公开了一种制造多层印刷电路板的方法以及所得到的多层印刷电路板。 多层印刷电路板包括基板，第一导电电路层，感光介电层和第二导电电路层，其通过形成在感光介电层中的光通孔与第一导电电路层电连接。 第二导电电路层包括布置多个导线的布线区域和使用热压接将外部布线连接的焊盘区域。 重要的是，为了避免在热压接期间压下焊盘区域下面的感光介电层，至少在焊盘区域中的第二导电电路层的厚度通过将该厚度延伸到光敏电介质中而大于布线区域 层。

公开(公告)号：US5060843A

公开(公告)日：1991-10-29

申请号：US532219

申请日：1990-06-01

申请人： Tadao Yasuzato ,  Keizo Sakurai

发明人： Tadao Yasuzato ,  Keizo Sakurai

IPC分类号： B23K20/00 ,  H01L21/60 ,  H01L21/607 ,  H01L23/485

CPC分类号： H01L24/12 ,  B23K20/007 ,  H01L24/11 ,  H01L24/78 ,  H01L2224/1134 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/141 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/78251 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L24/45 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01021 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082

摘要： A process of forming bumps on respective electrodes of a semiconductor chip comprises the steps of a) preparing a bonding apparatus equipped with a bonding tool three-dimensionally movable, b) forming a small ball at the leading end of a wire passing through the bonding tool, c) causing the bonding tool to press the small ball against the upper surface of one of the electrodes for bonding thereto, d) moving the bonding tool in a direction leaving from the upper surface of the electrode by a distance, e) moving the bonding tool in a horizontal direction substantially parallel to the upper surface of the electrode so that the wire is cut from the small ball with the leading end of the bonding tool, and f) repeating the steps b) to e) for producing bumps on the respective upper surfaces of the other electrodes, in which the horizontal direction is different depending upon the location of the electrode.

摘要翻译： 在半导体芯片的各个电极上形成凸块的工艺包括以下步骤：a）制备具有三维可移动的接合工具的接合装置，b）在通过接合工具的导线的前端形成小球 c）使所述接合工具将所述小球压靠在所述电极中的一个的上表面上以与其接合，d）使所述接合工具沿从所述电极的上表面离开一定距离的方向移动，e） 在大致平行于电极的上表面的水平方向上焊接工具，使得电线从焊接工具的前端从小球切割，以及f）重复步骤b）至e）以在其上产生凸块 其他电极的相应上表面，其中水平方向根据电极的位置而不同。