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    Simple rugged motor and compressors built thereby
    1.
    发明授权
    Simple rugged motor and compressors built thereby 有权

    公开(公告)号：US10707785B2

    公开(公告)日：2020-07-07

    申请号：US15649805

    申请日：2017-07-14

    申请人： Pen-Yi Liao

    发明人： Pen-Yi Liao

    IPC分类号： H02N2/14 ,  H02N2/12 ,  H02N2/04 ,  H02N2/16 ,  H02K1/14 ,  H02K1/24 ,  H02K7/14 ,  H02K7/04 ,  H02K19/10 ,  H02K1/06 ,  H02N2/06 ,  H02K16/02

    摘要： A simple rugged motor has a stator and a rotor formed by stacked silicon steel sheets operates by having a plurality of major and minor coil windings of the stator individually electrified under signals of a control unit, so as to steadily drive a rotor thereof. The simple rugged motor further has an orbit coupling balance assembly engaging an orbiting scroll for a corresponding fixed scroll disposed in a compression chamber to orbit for air compression, so as to form a scroll compressor. Or the simple rugged motor has a coupling assembly engaging a female screw compressor rotor to compress the air by a rotatable male screw compressor rotor disposed in a compression chamber, so as to form a screw compressor.

    Capacitive touch sensitive housing and method for making the same
    3.
    发明授权
    Capacitive touch sensitive housing and method for making the same 有权
    电容式触控式外壳及其制作方法

    公开(公告)号：US08692790B2

    公开(公告)日：2014-04-08

    申请号：US13285219

    申请日：2011-10-31

    申请人： Sheng-Hung Yi ,  Pen-Yi Liao

    发明人： Sheng-Hung Yi ,  Pen-Yi Liao

    IPC分类号： G06F3/041

    CPC分类号： H03K17/962 ,  G06F3/03547 ,  G06F3/044 ,  G06F2203/0339 ,  H03K2017/9602 ,  H03K2217/960755

    摘要： A capacitive touch sensitive housing comprises: a housing wall; an array of capacitive touch sensor pads formed on the housing wall; a plurality of conductive bonding pads formed on the housing wall; and a plurality of conductive lines formed on the housing wall. Each conductive line extends from a respective one of the touch sensor pads to a respective one of the bonding pads and cooperates with the respective one of the capacitive touch sensor pads and the respective one of the bonding pads to define a touch sensor unit having a layered structure including an active metal layer and an electroless deposited metal layer. The active metal layer contains an active metal capable of initiating electroless deposition.

    摘要翻译： 一种电容式触敏壳体，包括：壳体壁; 形成在壳体壁上的电容式触摸传感器焊盘阵列; 形成在所述壳体壁上的多个导电接合焊盘; 以及形成在壳体壁上的多条导线。 每个导电线从相应的一个触摸传感器焊盘延伸到相应的一个接合焊盘，并且与电容式触摸传感器焊盘和相应的一个接合焊盘相应的一个配合以限定具有分层的触摸传感器单元 包括活性金属层和无电沉积金属层的结构。 活性金属层含有能够引发无电沉积的活性金属。

    Non-deleterious technique for creating continuous conductive circuits
    4.
    发明授权
    Non-deleterious technique for creating continuous conductive circuits 有权
    用于创建连续导电电路的无害技术

    公开(公告)号：US08621749B2

    公开(公告)日：2014-01-07

    申请号：US13035531

    申请日：2011-02-25

    申请人： Shen-Hung Yi ,  Pen-Yi Liao

    发明人： Shen-Hung Yi ,  Pen-Yi Liao

    IPC分类号： H01R43/00 ,  H05K13/00

    CPC分类号： H05K3/188 ,  C25D5/02 ,  C25D5/10 ,  H05K3/027 ,  H05K3/185 ,  H05K3/24 ,  H05K2203/107 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156

    摘要： A non-deleterious method for producing a continuous conductive circuit upon a non-conductive substrate can begin with the application of a metallic base layer upon a surface of a non-conductive substrate. A circuit pattern can be created within the metallic base layer based upon a circuit design. The metallic base layer comprising the circuit pattern can be physically separated from the remainder of the metallic base layer on the non-conductive substrate. The region of the non-conductive substrate surface that encloses the circuit pattern can be called the plating region. The remainder of the non-conductive substrate surface can be called the non-plating region. A first metal layer can be added upon the metallic base layer. A second metal layer can be added upon the first metal layer of the plating region. The second metal layer can be electrically conductive and restricted from forming on the first metal layer of the non-plating region.

    摘要翻译： 在非导电衬底上制造连续导电电路的非有害方法可以开始于在非导电衬底的表面上施加金属基底层。 可以基于电路设计在金属基底层内形成电路图案。 包括电路图案的金属基层可以与非导电基底上的金属基底层的其余部分物理分离。 包围电路图案的非导电性基板表面的区域可以称为电镀区域。 非导电性基板表面的其余部分可以称为非电镀区域。 可以在金属基底层上添加第一金属层。 可以在电镀区域的第一金属层上添加第二金属层。 第二金属层可以导电并限制在非电镀区域的第一金属层上的形成。

    CIRCUIT DEVICE AND METHOD FOR MAKING THE SAME
    5.
    发明申请
    CIRCUIT DEVICE AND METHOD FOR MAKING THE SAME 审中-公开
    电路装置及其制造方法

    公开(公告)号：US20140014401A1

    公开(公告)日：2014-01-16

    申请号：US13547454

    申请日：2012-07-12

    申请人： Pen-Yi LIAO ,  Ming-Chun WU ,  I-Lin TSENG ,  Tsung-Han WU ,  Jung-Chi LIN

    发明人： Pen-Yi LIAO ,  Ming-Chun WU ,  I-Lin TSENG ,  Tsung-Han WU ,  Jung-Chi LIN

    IPC分类号： H05K1/09 ,  H05K3/00

    CPC分类号： H05K3/184 ,  H05K3/107 ,  H05K2201/0376 ,  H05K2203/0713 ,  H05K2203/107

    摘要： A circuit device includes: a substrate having an insulative upper surface; a hydrophobic anti-plating layer of a hydrophobic material formed on the upper surface of the substrate and having at least one patterned through-hole for exposing a plating portion of the upper surface of the substrate; an active metal layer formed on the plating portion of the upper surface of the substrate and disposed in the patterned through-hole in the hydrophobic anti-plating layer; and an electroless deposited metal layer electroless deposited on the active metal layer.

    摘要翻译： 电路装置包括：具有绝缘上表面的基板; 疏水性材料的疏水性防镀层形成在所述基板的上表面上并且具有至少一个图案化的通孔，用于暴露所述基板的上表面的镀层部分; 形成在所述基板的上表面的电镀部上并设置在所述疏水性防镀层的所述图案化通孔中的活性金属层; 以及沉积在活性金属层上的无电沉积金属层。

    Nanomaterial processing system
    6.
    发明授权
    Nanomaterial processing system 失效
    纳米材料加工系统

    公开(公告)号：US06871806B2

    公开(公告)日：2005-03-29

    申请号：US10423925

    申请日：2003-04-28

    申请人： I-Shou Tsai ,  Pen-Yi Liao ,  Chin-Chun Chou ,  Wen-I Kuo ,  Lei-Ti Huang

    发明人： I-Shou Tsai ,  Pen-Yi Liao ,  Chin-Chun Chou ,  Wen-I Kuo ,  Lei-Ti Huang

    IPC分类号： B02C19/06

    CPC分类号： B02C19/065 ,  B02C19/06 ,  Y10S977/89

    摘要： A nanomaterial processing system is constructed to include a compressor adapted to compress a flow of air/liquid into a high-pressure flow of air/liquid, a material feeder adapted to feed a material into the high-pressure flow of air/liquid passing out of the compressor, enabling the fed material to be mixed with the high-pressure flow of air/liquid into a high-pressure material flow; a shunt collider adapted to shunt the high-pressure material flow into two sub-flows and to let the shunt sub-flows to collide into a collided material flow, and a high-speed cutting unit, which uses a diamond coating-coated cutting wheel to cut solid substances the collided material flow.

    摘要翻译： 纳米材料处理系统被构造成包括适于将空气/液体流压缩成空气/液体的高压流的压缩机，适于将材料进料到高压空气/液体流中的材料进料器 的压缩机，使供料材料与空气/液体的高压流体混合成高压物料流; 分流对撞机，适于将高压物料流分流成两个子流，并使分流子流碰撞到相互碰撞的物料流;以及高速切割单元，其使用金刚石涂层切割轮 切割固体物质的相互碰撞物质流动。

    NON-DELETERIOUS TECHNIQUE FOR CREATING CONTINUOUS CONDUCTIVE CIRCUITS UPON THE SURFACES OF A NON-CONDUCTIVE SUBSTRATE
    7.
    发明申请
    NON-DELETERIOUS TECHNIQUE FOR CREATING CONTINUOUS CONDUCTIVE CIRCUITS UPON THE SURFACES OF A NON-CONDUCTIVE SUBSTRATE 有权
    用于在非导电基板的表面上创建连续导电电路的非永久性技术

    公开(公告)号：US20110278050A1

    公开(公告)日：2011-11-17

    申请号：US13035531

    申请日：2011-02-25

    申请人： SHENG-HUNG YI ,  PEN-YI LIAO

    发明人： SHENG-HUNG YI ,  PEN-YI LIAO

    IPC分类号： H05K1/03 ,  H05K3/06 ,  H05K1/09

    CPC分类号： H05K3/188 ,  C25D5/02 ,  C25D5/10 ,  H05K3/027 ,  H05K3/185 ,  H05K3/24 ,  H05K2203/107 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156

    摘要： A non-deleterious method for producing a continuous conductive circuit upon a non-conductive substrate can begin with the application of a metallic base layer upon a surface of a non-conductive substrate. A circuit pattern can be created within the metallic base layer based upon a circuit design. The metallic base layer comprising the circuit pattern can be physically separated from the remainder of the metallic base layer on the non-conductive substrate. The region of the non-conductive substrate surface that encloses the circuit pattern can be called the plating region. The remainder of the non-conductive substrate surface can be called the non-plating region. A first metal layer can be added upon the metallic base layer. A second metal layer can be added upon the first metal layer of the plating region. The second metal layer can be electrically conductive and restricted from forming on the first metal layer of the non-plating region.

    摘要翻译： 在非导电衬底上制造连续导电电路的非有害方法可以开始于在非导电衬底的表面上施加金属基底层。 可以基于电路设计在金属基底层内形成电路图案。 包括电路图案的金属基层可以与非导电基底上的金属基底层的其余部分物理分离。 包围电路图案的非导电性基板表面的区域可以称为电镀区域。 非导电性基板表面的其余部分可以称为非电镀区域。 可以在金属基底层上添加第一金属层。 可以在电镀区域的第一金属层上添加第二金属层。 第二金属层可以导电并限制在非电镀区域的第一金属层上的形成。

    CAPACITIVE TOUCH SENSITIVE HOUSING AND METHOD FOR MAKING THE SAME
    9.
    发明申请
    CAPACITIVE TOUCH SENSITIVE HOUSING AND METHOD FOR MAKING THE SAME 有权
    电容敏感触摸屏及其制作方法

    公开(公告)号：US20120217145A1

    公开(公告)日：2012-08-30

    申请号：US13285219

    申请日：2011-10-31

    申请人： Sheng-Hung YI ,  Pen-Yi LIAO

    发明人： Sheng-Hung YI ,  Pen-Yi LIAO

    IPC分类号： H01H13/705 ,  H01H11/00

    CPC分类号： H03K17/962 ,  G06F3/03547 ,  G06F3/044 ,  G06F2203/0339 ,  H03K2017/9602 ,  H03K2217/960755

    摘要： A capacitive touch sensitive housing comprises: a housing wall; an array of capacitive touch sensor pads formed on the housing wall; a plurality of conductive bonding pads formed on the housing wall; and a plurality of conductive lines formed on the housing wall. Each conductive line extends from a respective one of the touch sensor pads to a respective one of the bonding pads and cooperates with the respective one of the capacitive touch sensor pads and the respective one of the bonding pads to define a touch sensor unit having a layered structure including an active metal layer and an electroless deposited metal layer. The active metal layer contains an active metal capable of initiating electroless deposition.

    摘要翻译： 一种电容式触敏壳体，包括：壳体壁; 形成在壳体壁上的电容式触摸传感器焊盘阵列; 形成在所述壳体壁上的多个导电接合焊盘; 以及形成在壳体壁上的多条导线。 每个导电线从相应的一个触摸传感器焊盘延伸到相应的一个接合焊盘，并且与电容式触摸传感器焊盘和相应的一个接合焊盘相应的一个配合以限定具有分层的触摸传感器单元 包括活性金属层和无电沉积金属层的结构。 活性金属层含有能够引发无电沉积的活性金属。