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公开(公告)号：US09640737B2
公开(公告)日：2017-05-02
申请号：US13018013
申请日：2011-01-31
Applicant: Matthew Donofrio , John Adam Edmond , James Ibbetson , David Todd Emerson , Michael John Bergmann , Kevin Haberern , Raymond Rosado , Jeffrey Carl Britt
Inventor： Matthew Donofrio , John Adam Edmond , James Ibbetson , David Todd Emerson , Michael John Bergmann , Kevin Haberern , Raymond Rosado , Jeffrey Carl Britt
CPC classification number: H01L33/505 , H01L33/20 , H01L33/507
Abstract: Horizontal light emitting diodes include anode and cathode contacts on the same face and a transparent substrate having an oblique sidewall. A conformal phosphor layer having an average equivalent particle diameter d50 of at least about 10 μm is provided on the oblique sidewall. High aspect ratio substrates may be provided. The LED may be directly attached to a submount.
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公开(公告)号：USD709464S1
公开(公告)日：2014-07-22
申请号：US29423422
申请日：2012-05-31
Applicant: Amber C. Abare , Jeffrey Carl Britt , Joseph G. Clark , Raymond Rosado , Harsh Sundani
Designer： Amber C. Abare , Jeffrey Carl Britt , Joseph G. Clark , Raymond Rosado , Harsh Sundani
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公开(公告)号：US20130141905A1
公开(公告)日：2013-06-06
申请号：US13312508
申请日：2011-12-06
Applicant: Christopher P. Hussell , Justin Lydon , Raymond Rosado , Jeffrey C. Britt
Inventor： Christopher P. Hussell , Justin Lydon , Raymond Rosado , Jeffrey C. Britt
CPC classification number: H01L33/54 , H01L24/49 , H01L33/20 , H01L33/58 , H01L2224/49113 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2933/005 , H01L2933/0058 , Y10T29/49117 , Y10T29/4913 , Y10T29/49169 , H01L2224/45099 , H01L2924/00
Abstract: Light emitter devices with improved light extraction and related methods are disclosed. In one embodiment, the light emitter device can include a submount, at least one light emitting chip disposed over the submount, and a lens disposed over the light emitting chip. The lens can include a lens base that can have substantially the same geometry as a geometry of the submount.
Abstract translation: 公开了具有改进的光提取和相关方法的发光器件。 在一个实施例中，发光器件可以包括底座，设置在底座上的至少一个发光芯片和设置在发光芯片上的透镜。 透镜可以包括透镜基座，其可以具有与基座的几何形状基本相同的几何形状。
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公开(公告)号：US20120193660A1
公开(公告)日：2012-08-02
申请号：US13018013
申请日：2011-01-31
Applicant: Matthew Donofrio , John Adam Edmond , James Ibbetson , David Todd Emerson , Michael John Bergmann , Kevin Haberern , Raymond Rosado , Jeffrey Carl Britt
Inventor： Matthew Donofrio , John Adam Edmond , James Ibbetson , David Todd Emerson , Michael John Bergmann , Kevin Haberern , Raymond Rosado , Jeffrey Carl Britt
CPC classification number: H01L33/505 , H01L33/20 , H01L33/507
Abstract: Horizontal light emitting diodes include anode and cathode contacts on the same face and a transparent substrate having an oblique sidewall. A conformal phosphor layer having an average equivalent particle diameter d50 of at least about 10 μm is provided on the oblique sidewall. High aspect ratio substrates may be provided. The LED may be directly attached to a submount.
Abstract translation: 水平发光二极管包括在同一面上的阳极和阴极触点以及具有倾斜侧壁的透明衬底。 在倾斜侧壁上设置平均当量粒径d50为至少约10μm的保形荧光体层。 可以提供高纵横比基底。 LED可以直接连接到底座。
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公开(公告)号：US10439112B2
公开(公告)日：2019-10-08
申请号：US13554776
申请日：2012-07-20
Applicant: Joseph G. Clark , Jeffrey Carl Britt , Amber C. Abare , Raymond Rosado , Harsh Sundani , David T. Emerson , Jeremy Scott Nevins
Inventor： Joseph G. Clark , Jeffrey Carl Britt , Amber C. Abare , Raymond Rosado , Harsh Sundani , David T. Emerson , Jeremy Scott Nevins
IPC: H01L33/58 , F21V21/00 , F21V7/00 , H01L33/48 , H01L33/62 , H01L33/64 , F21V29/74 , F21Y105/10 , F21K9/233 , F21Y115/10
Abstract: Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A light emitter chip can be disposed over the submount such that the light emitter chip is mounted over at least a portion of the cathode and wirebonded to at least a portion of the anode.
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Patent Agency Ranking
6.发明授权Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction 有权采用发光二极管（LED）的发光器件和方法，用于改进光提取公开(公告)号：US09496466B2
公开(公告)日：2016-11-15
申请号：US13312508
申请日：2011-12-06
Applicant: Christopher P. Hussell , Justin Lydon , Raymond Rosado , Jeffrey C. Britt
Inventor： Christopher P. Hussell , Justin Lydon , Raymond Rosado , Jeffrey C. Britt
CPC classification number: H01L33/54 , H01L24/49 , H01L33/20 , H01L33/58 , H01L2224/49113 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2933/005 , H01L2933/0058 , Y10T29/49117 , Y10T29/4913 , Y10T29/49169 , H01L2224/45099 , H01L2924/00
Abstract: Light emitter devices with improved light extraction and related methods are disclosed. In one embodiment, the light emitter device can include a submount, at least one light emitting chip disposed over the submount, and a lens disposed over the light emitting chip. The lens can include a lens base that can have substantially the same geometry as a geometry of the submount.
Abstract translation: 公开了具有改进的光提取和相关方法的发光器件。 在一个实施例中，发光器件可以包括底座，设置在底座上的至少一个发光芯片和设置在发光芯片上的透镜。 透镜可以包括透镜基座，其可以具有与基座的几何形状基本相同的几何形状。
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公开(公告)号：US08896013B2
公开(公告)日：2014-11-25
申请号：US13017502
申请日：2011-01-31
Applicant: Peter Scott Andrews , Raymond Rosado , Michael P. Laughner , David T. Emerson , Amber C. Abare , Jeffrey C. Britt
Inventor： Peter Scott Andrews , Raymond Rosado , Michael P. Laughner , David T. Emerson , Amber C. Abare , Jeffrey C. Britt
IPC: H01L33/62 , H01L25/075 , H01L33/58
Abstract: High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.
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8.发明申请LIGHT EMITTER DEVICES AND METHODS WITH REDUCED DIMENSIONS AND IMPROVED LIGHT OUTPUT 有权光发射器件和具有减小的尺寸和改进的光输出的方法公开(公告)号：US20130141920A1
公开(公告)日：2013-06-06
申请号：US13312518
申请日：2011-12-06
Applicant: David T. Emerson , Justin Lydon , Raymond Rosado , Jeffrey C. Britt
Inventor： David T. Emerson , Justin Lydon , Raymond Rosado , Jeffrey C. Britt
IPC: F21V5/04
CPC classification number: H01L33/486 , H01L33/20 , H01L33/54 , H01L33/58 , H01L2924/0002 , H01L2924/00
Abstract: Light emitter devices and methods with reduced dimensions and improved light output are provided. In one embodiment, a light emitter device includes a submount having an area of approximately 6 square millimeters (mm2) or less. The device can further include a light emitting chip on the submount and a lens disposed over the light emitting chip and positioned on the submount. The device can be operable for emitting light at approximately 100 lumens or higher.
Abstract translation: 提供了具有减小的尺寸和改善的光输出的发光器件和方法。 在一个实施例中，发光器件包括具有大约6平方毫米（mm 2）或更小的面积的底座。 该装置还可以包括在底座上的发光芯片和设置在发光芯片上并位于底座上的透镜。 该装置可操作用于发射大约100流明或更高的光。
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9.发明申请公开(公告)号：US20130322068A1
公开(公告)日：2013-12-05
申请号：US13554776
申请日：2012-07-20
Applicant: JOSEPH G. CLARK , JEFFREY CARL BRITT , AMBER C. ABARE , RAYMOND ROSADO , HARSH SUNDANI , DAVID T. EMERSON , JEREMY SCOTT NEVINS
Inventor： JOSEPH G. CLARK , JEFFREY CARL BRITT , AMBER C. ABARE , RAYMOND ROSADO , HARSH SUNDANI , DAVID T. EMERSON , JEREMY SCOTT NEVINS
CPC classification number: H01L33/58 , F21K9/233 , F21V7/00 , F21V21/00 , F21V29/74 , F21Y2105/10 , F21Y2115/10 , H01L33/48 , H01L33/486 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01S5/02244 , H01L2924/00014
Abstract: Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A light emitter chip can be disposed over the submount such that the light emitter chip is mounted over at least a portion of the cathode and wirebonded to at least a portion of the anode.
Abstract translation: 公开了具有改进性能的光发射器封装，系统和方法。 在一个方面，光发射器封装可以包括可以包括阳极和阴极的底座。 光发射器芯片可以设置在基座上方，使得发光芯片安装在阴极的至少一部分上并且引线键合到阳极的至少一部分。
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公开(公告)号：US20120193661A1
公开(公告)日：2012-08-02
申请号：US13112502
申请日：2011-05-20
Applicant: David Todd Emerson , Raymond Rosado , Matthew Donofrio , John Adam Edmond
Inventor： David Todd Emerson , Raymond Rosado , Matthew Donofrio , John Adam Edmond
IPC: H01L33/58
CPC classification number: H01L33/52 , H01L25/0753 , H01L33/20 , H01L33/486 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2924/0002 , H01L2924/00
Abstract: A horizontal LED die is flip-chip mounted on a mounting substrate to define a gap that extends between the closely spaced apart anode and cathode contacts of the LED die, and between the closely spaced apart anode and cathode pads of the substrate. An encapsulant is provided on the light emitting diode die and the mounting substrate. The gap is configured to prevent sufficient encapsulant from entering the gap that would degrade operation of the LED.
Abstract translation: 水平LED管芯被倒装安装在安装基板上以限定在LED管芯的紧密间隔开的阳极和阴极接触件之间以及衬底的间隔开的阳极和阴极焊盘之间延伸的间隙。 密封剂设置在发光二极管管芯和安装基板上。 间隙被配置成防止足够的密封剂进入间隙，这将降低LED的操作。
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