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    MODULE HAVING BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SUCH MODULE
    2.
    发明申请
    MODULE HAVING BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SUCH MODULE 审中-公开
    具有内置电子元件的模块及其制造方法

    公开(公告)号：US20090115067A1

    公开(公告)日：2009-05-07

    申请号：US12093223

    申请日：2006-11-16

    申请人： Rikiya Okimoto ,  Toshiyuki Kojima ,  Yukihiro Ishimaru

    发明人： Rikiya Okimoto ,  Toshiyuki Kojima ,  Yukihiro Ishimaru

    IPC分类号： H01L23/52 ,  H01L21/44

    CPC分类号： H01L25/0657 ,  H01L23/5389 ,  H01L2224/16235 ,  H01L2224/82047 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2924/01078 ,  H01L2924/01079

    摘要： An electronic component embedded module that can improve reliability of electric connection of inner vias, and a manufacturing method therefor are provided. A first electronic component (11) is embedded in a second electrical insulating layer (13) and connected electrically to a first wiring pattern (14) through first inner vias (16) that penetrate a first electrical insulating layer (12). The first wiring pattern (14) and a second wiring pattern (15) are connected electrically to each other through second inner vias (17) that penetrate the first electrical insulating layer (12) and third inner vias (18) that penetrate the second electrical insulating layer (13). The second inner vias (17) and the third inner vias (18) are arranged continuously.

    摘要翻译： 提供一种能够提高内部通路的电连接的可靠性的电子部件嵌入式模块及其制造方法。 第一电子部件（11）嵌入在第二电绝缘层（13）中，并通过穿过第一电绝缘层（12）的第一内部通孔（16）电连接到第一布线图案（14）。 第一布线图案（14）和第二布线图案（15）通过贯穿第一电绝缘层（12）的第二内通孔（17）和穿过第二电绝缘层（12）的第三内通孔 绝缘层（13）。 第二内部通孔（17）和第三内部通孔（18）被连续布置。

    MULTI-LAYER CIRCUIT SUBSTRATE MANUFACTURING METHOD AND MULTI-LAYER CIRCUIT SUBSTRATE
    5.
    发明申请
    MULTI-LAYER CIRCUIT SUBSTRATE MANUFACTURING METHOD AND MULTI-LAYER CIRCUIT SUBSTRATE 审中-公开
    多层电路基板制造方法及多层电路基板

    公开(公告)号：US20090032285A1

    公开(公告)日：2009-02-05

    申请号：US11814698

    申请日：2005-01-27

    申请人： Yoji Ueda ,  Susumu Matsuoka ,  Rikiya Okimoto ,  Shozo Ochi ,  Satoru Tomekawa

    发明人： Yoji Ueda ,  Susumu Matsuoka ,  Rikiya Okimoto ,  Shozo Ochi ,  Satoru Tomekawa

    IPC分类号： H05K3/46 ,  H05K1/14 ,  H05K1/00

    CPC分类号： H05K1/024 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0191 ,  H05K2201/0355 ,  H05K2201/09318 ,  H05K2201/09327 ,  H05K2201/10378 ,  H05K2203/061 ,  H05K2203/1461 ,  Y10T428/24843

    摘要： A method of manufacturing a multilayered circuit board includes the steps of: manufacturing a laminated body by laminating a prepreg of a predetermined thickness on at least one surface of a double-sided circuit board having a grounding link and a signal wiring patterned on both surfaces thereof; and applying heat and pressure to the laminated body and completing a layered structure in which the signal wiring is laid inside the prepreg at a boundary between the double-sided circuit board and the prepreg, wherein prepreg sheets of a predetermined thickness are used in a completed layered structure so that a thickness of a prepreg of the double-sided circuit board is smaller than a distance between a surface of the prepreg on a side not opposed to the double-sided circuit board and the signal wiring laid inside the prepreg.

    摘要翻译： 一种制造多层电路板的方法包括以下步骤：通过在具有接地链路的双面电路板和在其两个表面上图案化的信号布线的至少一个表面层压预定厚度的预浸料来制造层压体 ; 并且对层压体施加热和压力，并且完成在双面电路板和预浸料坯之间的边界处将信号布线放置在预浸料坯内部的层状结构，其中预定厚度的预浸料片材用于完成 使得双面电路板的预浸料坯的厚度小于与双面电路板不相对的一侧上的预浸料坯的表面与布置在预浸料坯内部的信号线之间的距离。

    ELECTRONIC COMPONENT MODULE AND METHOD OF MANUFACTURING THE SAME
    8.
    发明申请
    ELECTRONIC COMPONENT MODULE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    电子元件模块及其制造方法

    公开(公告)号：US20080296053A1

    公开(公告)日：2008-12-04

    申请号：US12127279

    申请日：2008-05-27

    申请人： Yukihiro Ishimaru ,  Toshiyuki Kojima ,  Rikiya Okimoto

    发明人： Yukihiro Ishimaru ,  Toshiyuki Kojima ,  Rikiya Okimoto

    IPC分类号： H05K1/16 ,  H05K3/30

    CPC分类号： H05K1/186 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0218 ,  H05K3/284 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/162 ,  Y10T29/4913 ,  H01L2924/00

    摘要： A method of manufacturing an electronic component module includes mounting an electronic component on at least one surface of a first board, subsequently inspecting the first board for functions, forming a resin layer burying or covering the electronic component on the one surface of the first board to flatten the one surface side of the first board, aligningly stacking the first board, a plate-like member and a second board so that the other surface of the first board is opposite one surface of the plate-like member and so that the other surface of the plate-like member is opposite one surface of the second board, pressurizing the first board, the plate-like member and the second board which have been stacked, and heating the first board, the plate-like member, and the second board which have been stacked.

    摘要翻译： 一种制造电子部件模块的方法，包括将电子部件安装在第一基板的至少一个面上，随后检查第一基板的功能，在第一基板的一个表面上形成埋入或覆盖电子部件的树脂层， 使第一板的一个表面侧平坦化，对准地堆叠第一板，板状构件和第二板，使得第一板的另一个表面与板状构件的一个表面相对，并且使得另一个表面 所述板状构件与所述第二基板的一个表面相对，对所述第一基板，所述板状构件和所述第二基板进行了加压，对所述第一基板，所述板状构件和所述第二基板 已堆叠。