公开(公告)号：US20130171833A1

公开(公告)日：2013-07-04

申请号：US13775987

申请日：2013-02-25

Applicant: Bryan L. BUCKALEW ,  Steven T. MAYER ,  Thomas A. PONNUSWAMY ,  Robert RASH ,  Brian BLACKMAN ,  Doug HIGLEY

Inventor： Bryan L. BUCKALEW ,  Steven T. MAYER ,  Thomas A. PONNUSWAMY ,  Robert RASH ,  Brian BLACKMAN ,  Doug HIGLEY

IPC: H01L21/02

CPC classification number: C25D7/123 ,  C25D3/12 ,  C25D3/30 ,  C25D3/38 ,  C25D5/00 ,  C25D5/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/56 ,  C25D17/001 ,  C25D21/04 ,  C25D21/12 ,  H01L21/02307 ,  H01L21/2885 ,  H01L21/321 ,  H01L21/67051 ,  H01L21/67138 ,  H01L21/76861 ,  H01L21/76877 ,  H01L21/76879 ,  H01L21/76885 ,  H01L21/76898

Abstract: Disclosed are pre-wetting apparatus designs and methods. In some embodiments, a pre-wetting apparatus includes a degasser, a process chamber, and a controller. The process chamber includes a wafer holder configured to hold a wafer substrate, a vacuum port configured to allow formation of a subatmospheric pressure in the process chamber, and a fluid inlet coupled to the degasser and configured to deliver a degassed pre-wetting fluid onto the wafer substrate at a velocity of at least about 7 meters per second whereby particles on the wafer substrate are dislodged and at a flow rate whereby dislodged particles are removed from the wafer substrate. The controller includes program instructions for forming a wetting layer on the wafer substrate in the process chamber by contacting the wafer substrate with the degassed pre-wetting fluid admitted through the fluid inlet at a flow rate of at least about 0.4 liters per minute.

Abstract translation: 公开了预润湿装置的设计和方法。 在一些实施例中，预润湿装置包括脱气机，处理室和控制器。 处理室包括被配置为保持晶片衬底的晶片保持器，被配置为允许在处理室中形成低于大气压的真空端口，以及耦合到脱气器的流体入口，并被配置为将脱气的预润湿流体输送到 晶片衬底以至少约7米/秒的速度，由此晶片衬底上的颗粒被移除并且以流速从晶片衬底去除移除的颗粒。 控制器包括用于通过使晶片衬底与至少约0.4升/分钟的流速通过流体入口允许的脱气预润湿流体接触来在处理室中在晶片衬底上形成润湿层的程序指令。

公开(公告)号：US20110226613A1

公开(公告)日：2011-09-22

申请号：US13049318

申请日：2011-03-16

Applicant: Robert Rash ,  Richard Abraham ,  David W. Porter ,  Steven T. Mayer

Inventor： Robert Rash ,  Richard Abraham ,  David W. Porter ,  Steven T. Mayer

IPC: C25D21/00

CPC classification number: C25D5/08 ,  C25D5/006 ,  C25D17/00 ,  C25D17/002 ,  C25D21/04 ,  C25D21/06 ,  C25D21/14 ,  C25D21/18

Abstract: An electrolyte, and particularly anolyte, may be circulated via an open loop having a pressure regulator, so that the pressure in the plating chamber is maintained at a constant (or substantially constant) value with respect to atmospheric pressure. In these embodiments, a pressure regulator is in fluid communication with the anode chamber.

公开(公告)号：US07935231B2

公开(公告)日：2011-05-03

申请号：US11932595

申请日：2007-10-31

Applicant: Shantinath Ghongadi ,  Robert Rash ,  Jeff Hawkins ,  Seshasayee Varadarajan ,  Tariq Majid ,  Kousik Ganesan ,  Bryan Buckalew ,  Brian Evans

Inventor： Shantinath Ghongadi ,  Robert Rash ,  Jeff Hawkins ,  Seshasayee Varadarajan ,  Tariq Majid ,  Kousik Ganesan ,  Bryan Buckalew ,  Brian Evans

IPC: C25B9/02 ,  C25D17/06

CPC classification number: C25D17/001 ,  C25D17/004 ,  C25D17/005 ,  C25D21/08

Abstract: Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly and a cone assembly, wherein the cup assembly comprises a cup bottom comprising an opening, a seal surrounding the opening, an electrical contact structure comprising a plurality of electrical contacts disposed around the opening, and an interior cup side that is tapered inwardly in along an axial direction of the cup from a cup top toward the cup bottom.

Abstract translation: 公开了一种在电镀系统在线时能够快速清洁的闭式电镀杯组件的实施例。 一个公开的实施例包括杯组件和锥形组件，其中杯组件包括杯底，其包括开口，围绕开口的密封件，包括围绕开口设置的多个电触点的电接触结构，以及内杯侧 其沿着杯的轴向方向从杯形顶部向杯底部向内渐缩。

公开(公告)号：US08603305B2

公开(公告)日：2013-12-10

申请号：US13051822

申请日：2011-03-18

Applicant: Robert Rash ,  Richard Abraham ,  David W. Porter ,  Steven T. Mayer

Inventor： Robert Rash ,  Richard Abraham ,  David W. Porter ,  Steven T. Mayer

IPC: C25D17/00 ,  C25D21/16 ,  C25D21/12 ,  C25D7/12

CPC classification number: C25D5/08 ,  C25D5/006 ,  C25D17/00 ,  C25D17/002 ,  C25D21/04 ,  C25D21/06 ,  C25D21/14 ,  C25D21/18

Abstract: An electrolyte, and particularly anolyte, may be circulated via an open loop having a pressure regulator, so that the pressure in the plating chamber is maintained at a constant (or substantially constant) value with respect to atmospheric pressure. In these embodiments, a pressure regulator is in fluid communication with the anode chamber.

公开(公告)号：US20130292254A1

公开(公告)日：2013-11-07

申请号：US13852767

申请日：2013-03-28

Applicant: Santosh Kumar ,  Bryan L. Buckalew ,  Steven T. Mayer ,  Thomas Ponnuswamy ,  Chad Michael Hosack ,  Robert Rash ,  Lee Peng Chua ,  David Porter

Inventor： Santosh Kumar ,  Bryan L. Buckalew ,  Steven T. Mayer ,  Thomas Ponnuswamy ,  Chad Michael Hosack ,  Robert Rash ,  Lee Peng Chua ,  David Porter

IPC: C25D17/00

CPC classification number: B08B3/022 ,  B08B3/041 ,  C25D7/12 ,  C25D17/00 ,  C25D17/001 ,  C25D21/00 ,  C25D21/12 ,  H01L21/67051

Abstract: Disclosed herein are methods of cleaning a lipseal and/or cup bottom of an electroplating device by removing metal deposits accumulated in prior electroplating operations. The methods may include orienting a nozzle such that it is pointed substantially at the inner circular edge of the lipseal and/or cup bottom, and dispensing a stream of cleaning solution from the nozzle such that the stream contacts the inner circular edge of the lipseal and/or cup bottom while they are being rotated, removing metal deposits. In some embodiments, the stream has a velocity component against the rotational direction of the lipseal and/or cup bottom. In some embodiments, the deposits may include a tin/silver alloy. Also disclosed herein are cleaning apparatuses for mounting in electroplating devices and for removing electroplated metal deposits from their lipseals and/or cup bottoms. In some embodiments, the cleaning apparatuses may include a jet nozzle.

Abstract translation: 本文公开了通过去除在现有电镀操作中积累的金属沉积物来清洁电镀装置的唇密封和/或杯底的方法。 所述方法可以包括使喷嘴定向成使得其基本上指向唇密封件和/或杯底部的内圆形边缘，并且从喷嘴分配清洁溶液流，使得流接触唇塞的内圆形边缘，并且 /或杯底，同时旋转，去除金属沉积物。 在一些实施例中，流具有抵抗唇密封和/或杯底的旋转方向的速度分量。 在一些实施例中，沉积物可以包括锡/银合金。 本文还公开了用于安装在电镀装置中并用于从其密封件和/或杯底部去除电镀金属沉积物的清洁装置。 在一些实施例中，清洁设备可以包括喷嘴。

公开(公告)号：US08398831B2

公开(公告)日：2013-03-19

申请号：US13079745

申请日：2011-04-04

Applicant: Shantinath Ghongadi ,  Robert Rash ,  Jeff Hawkins ,  Seshasayee Varadarajan ,  Tariq Majid ,  Kousik Ganesan ,  Bryan Buckalew ,  Brian Evans

Inventor： Shantinath Ghongadi ,  Robert Rash ,  Jeff Hawkins ,  Seshasayee Varadarajan ,  Tariq Majid ,  Kousik Ganesan ,  Bryan Buckalew ,  Brian Evans

IPC: C25D17/00 ,  C25D9/00 ,  F16J15/00

CPC classification number: C25D17/001 ,  C25D17/004 ,  C25D17/005 ,  C25D21/08

Abstract: Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly and a cone assembly, wherein the cup assembly comprises a cup bottom comprising an opening, a seal surrounding the opening, an electrical contact structure comprising a plurality of electrical contacts disposed around the opening, and an interior cup side that is tapered inwardly in along an axial direction of the cup from a cup top toward the cup bottom.

Abstract translation: 公开了一种在电镀系统在线时能够快速清洁的闭式电镀杯组件的实施例。 一个公开的实施例包括杯组件和锥形组件，其中杯组件包括杯底，其包括开口，围绕开口的密封件，包括围绕开口设置的多个电触点的电接触结构，以及内杯侧 其沿着杯的轴向方向从杯形顶部向杯底部向内渐缩。

公开(公告)号：US20120181170A1

公开(公告)日：2012-07-19

申请号：US13432767

申请日：2012-03-28

Applicant: Vinay Prabhakar ,  Bryan L. Buckalew ,  Kousik Ganesan ,  Shantinath Ghongadi ,  Zhian He ,  Steven T. Mayer ,  Robert Rash ,  Jonathan D. Reid ,  Yuichi Takada ,  James R. Zibrida

Inventor： Vinay Prabhakar ,  Bryan L. Buckalew ,  Kousik Ganesan ,  Shantinath Ghongadi ,  Zhian He ,  Steven T. Mayer ,  Robert Rash ,  Jonathan D. Reid ,  Yuichi Takada ,  James R. Zibrida

IPC: C25D17/08

CPC classification number: C25D17/001 ,  C25D7/123

Abstract: Methods, apparatuses, and various apparatus components, such as base plates, lipseals, and contact ring assemblies are provided for reducing contamination of the contact area in the apparatuses. Contamination may happen during removal of semiconductor wafers from apparatuses after the electroplating process. In certain embodiments, a base plate with a hydrophobic coating, such as polyamide-imide (PAI) and sometimes polytetrafluoroethylene (PTFE), are used. Further, contact tips of the contact ring assembly may be positioned further away from the sealing lip of the lipseal. In certain embodiments, a portion of the contact ring assembly and/or the lipseal also include hydrophobic coatings.

Abstract translation: 提供了诸如基板，密封圈和接触环组件的方法，装置和各种装置部件，以减少设备中接触区域的污染。 在电镀工艺之后从设备中取出半导体晶片时可能发生污染。 在某些实施方案中，使用具有疏水涂层的基板，例如聚酰胺 - 酰亚胺（PAI）和有时聚四氟乙烯（PTFE）。 此外，接触环组件的接触尖端可以被定位成更远离唇密封的唇缘。 在某些实施方案中，接触环组件和/或唇膏的一部分还包括疏水性涂层。

公开(公告)号：US20110226614A1

公开(公告)日：2011-09-22

申请号：US13051822

申请日：2011-03-18

Applicant: Robert Rash ,  Richard Abraham ,  David W. Porter ,  Steven T. Mayer

Inventor： Robert Rash ,  Richard Abraham ,  David W. Porter ,  Steven T. Mayer

IPC: C25B15/08 ,  C25B15/00 ,  C25B15/02

CPC classification number: C25D5/08 ,  C25D5/006 ,  C25D17/00 ,  C25D17/002 ,  C25D21/04 ,  C25D21/06 ,  C25D21/14 ,  C25D21/18

Abstract: An electrolyte, and particularly anolyte, may be circulated via an open loop having a pressure regulator, so that the pressure in the plating chamber is maintained at a constant (or substantially constant) value with respect to atmospheric pressure. In these embodiments, a pressure regulator is in fluid communication with the anode chamber.

Abstract translation: 电解质，特别是阳极电解液可以经由具有压力调节器的开环循环，使得电镀室中的压力相对于大气压维持在恒定（或基本上恒定的）值。 在这些实施例中，压力调节器与阳极室流体连通。

公开(公告)号：US07985325B2

公开(公告)日：2011-07-26

申请号：US11929638

申请日：2007-10-30

Applicant: Robert Rash ,  Shantinath Ghongadi ,  Kousik Ganesan ,  Zhian He ,  Tariq Majid ,  Jeff Hawkins ,  Seshasayee Varadarajan ,  Bryan Buckalew

Inventor： Robert Rash ,  Shantinath Ghongadi ,  Kousik Ganesan ,  Zhian He ,  Tariq Majid ,  Jeff Hawkins ,  Seshasayee Varadarajan ,  Bryan Buckalew

IPC: C25D17/06

CPC classification number: C25D17/001 ,  C25D7/123 ,  C25D17/02

Abstract: Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup.

Abstract translation: 公开了一种闭式电镀杯的实施例。 一个实施例包括一个包括一个开口的杯底，以及一个围绕开口设置在杯底的密封件。 密封件包括基本上位于密封件的内边缘处的与晶片接触的峰。 该实施例还包括设置在密封件的一部分上的电接触结构，其中电接触结构包括外环和从外环向内延伸的多个触点，并且其中每个触头具有大致平坦的晶片接触表面。 该实施例还包括晶圆定心机构，其配置成使晶片位于杯中心。

公开(公告)号：US20100155254A1

公开(公告)日：2010-06-24

申请号：US12633219

申请日：2009-12-08

Applicant: Vinay Prabhakar ,  Bryan L. Buckalew ,  Kousik Ganesan ,  Shantinath Ghongadi ,  Zhian He ,  Steven T. Mayer ,  Robert Rash ,  Jonathan D. Reid ,  Yuichi Takada ,  James R. Zibrida

Inventor： Vinay Prabhakar ,  Bryan L. Buckalew ,  Kousik Ganesan ,  Shantinath Ghongadi ,  Zhian He ,  Steven T. Mayer ,  Robert Rash ,  Jonathan D. Reid ,  Yuichi Takada ,  James R. Zibrida

IPC: C25D7/12 ,  C25D17/00 ,  C25D17/02

CPC classification number: C25D17/001 ,  C25D7/123

Abstract: Methods, apparatuses, and various apparatus components, such as base plates, lipseals, and contact ring assemblies are provided for reducing contamination of the contact area in the apparatuses. Contamination may happen during removal of semiconductor wafers from apparatuses after the electroplating process. In certain embodiments, a base plate with a hydrophobic coating, such as polyamide-imide (PAI) and sometimes polytetrafluoroethylene (PTFE), are used. Further, contact tips of the contact ring assembly may be positioned further away from the sealing lip of the lipseal. In certain embodiments, a portion of the contact ring assembly and/or the lipseal also include hydrophobic coatings.

Abstract translation: 提供了诸如基板，密封圈和接触环组件的方法，装置和各种装置部件，以减少设备中接触区域的污染。 在电镀工艺之后从设备中取出半导体晶片时可能发生污染。 在某些实施方案中，使用具有疏水涂层的基板，例如聚酰胺 - 酰亚胺（PAI）和有时聚四氟乙烯（PTFE）。 此外，接触环组件的接触尖端可以被定位成更远离唇密封的唇缘。 在某些实施方案中，接触环组件和/或唇膏的一部分还包括疏水性涂层。