公开(公告)号：US20040250767A1

公开(公告)日：2004-12-16

申请号：US10828952

申请日：2004-04-21

Applicant: Rohm and Haas Electronic Materials, L.L.C.

Inventor： Marc Langlois ,  Anthony A. Cox

IPC: C23C016/00

CPC classification number: C23C16/042 ,  C23C16/453

Abstract: A method and apparatus for coating a surface of a substrate using combustion chemical vapor deposition is disclosed. A chemical vapor deposition stream, composed of a coating precursor and a combustible medium, is directed toward a substrate and combusted to provide a reacted coating precursor in a gaseous plume. The plume is modified by exposing it to a shield prior to the plume contacting the surface of the substrate and depositing a coating thereon. The shield serves to control the coating thickness and material characteristics of the deposited material.

Abstract translation: 公开了一种使用燃烧化学气相沉积涂覆基板表面的方法和装置。 由涂料前体和可燃介质组成的化学气相沉积物流被引向衬底并燃烧，从而在气态羽流中提供反应的涂层前体。 羽毛通过在羽毛接触基底表面并在其上沉积涂层之前将其暴露于屏蔽来进行修饰。 屏蔽件用于控制沉积材料的涂层厚度和材料特性。

公开(公告)号：US20040198042A1

公开(公告)日：2004-10-07

申请号：US10817571

申请日：2004-04-02

Applicant: Rohm and Haas Electronic Materials, L.L.C.

Inventor： Deodatta Vinayak Shenai-Khatkhate

IPC: H01L021/26

CPC classification number: C23C16/28 ,  C07C391/00 ,  C07C395/00 ,  C07F5/00 ,  C07F5/064 ,  C07F7/0807 ,  C07F7/0827 ,  C07F7/30 ,  C23C16/18

Abstract: Methods of preparing Group IVA and Group VIA organometallic compounds, particularly Group IVA organometallic compounds, are provided. Such manufacturing methods employ an amine and/or phosphine catalyst in a transalkylation step and may be performed in a batch, semi-continuous or continuous manner.

Abstract translation: 提供了制备IVA族和VIA族有机金属化合物，特别是IVA族有机金属化合物的方法。 这种制造方法在烷基转移步骤中使用胺和/或膦催化剂，并且可以以间歇，半连续或连续方式进行。

公开(公告)号：US20040253804A1

公开(公告)日：2004-12-16

申请号：US10816627

申请日：2004-04-02

Applicant: Rohm and Haas Electronic Materials, L.L.C.

Inventor： Rozalia Beica ,  Neil D. Brown ,  Kai Wang

IPC: H01L021/00 ,  H01L021/44 ,  C25D013/00 ,  G01L001/20

CPC classification number: C25D3/60 ,  H01L2224/11

Abstract: Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, an acid, a thiourea derivative, and an additive selected from alkanol amines, polyethylene imines, alkoxylated aromatic alcohols, and combinations thereof. Also disclosed are methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device.

Abstract translation: 公开了用于在基材上沉积锡合金的电解质组合物。 电解质组合物包括锡离子，一种或多种合金金属的离子，酸，硫脲衍生物和选自烷醇胺，聚乙烯亚胺，烷氧基化芳族醇及其组合的添加剂。 还公开了在基板上沉积锡合金的方法以及在半导体器件上形成互连凸点的方法。

公开(公告)号：US20040229762A1

公开(公告)日：2004-11-18

申请号：US10845878

申请日：2004-05-13

Applicant: Rohm and Haas Electronic Materials, L.L.C.

Inventor： Edward W. Rutter JR.

IPC: C11D001/00

CPC classification number: C11D7/261 ,  C11D7/263 ,  C11D7/264 ,  C11D7/5022 ,  C11D11/0047

Abstract: Compositions useful for the removal of polymeric material from substrates, such as magnetoresistive sensors, are provided. Methods of removing such polymeric material from magnetoresistive sensors and methods of manufacturing magnetoresistive sensors are also provided.

Abstract translation: 提供了可用于从衬底去除聚合物材料的组合物，例如磁阻传感器。 还提供了从磁阻传感器去除这种聚合材料的方法以及制造磁阻传感器的方法。

公开(公告)号：US20040197945A1

公开(公告)日：2004-10-07

申请号：US10816356

申请日：2004-04-02

Applicant: Rohm and Haas Electronic Materials L.L.C.

Inventor： Egbert Woelk ,  Deodatta Vinayak Shenai-Khatkhate

IPC: H01L051/40

CPC classification number: C07F7/0807 ,  C07F7/30 ,  C23C16/18 ,  C23C16/22 ,  C23C16/28

Abstract: Germanium compounds suitable for use as vapor phase deposition precursors for germanium films are provided. Methods of depositing films containing germanium using such compounds are also provided. Such germanium films are particularly useful in the manufacture of electronic devices.

Abstract translation: 提供适合用作锗膜气相沉积前体的锗化合物。 还提供了使用这种化合物沉积含锗的薄膜的方法。 这种锗膜在电子器件的制造中特别有用。

公开(公告)号：US20040263290A1

公开(公告)日：2004-12-30

申请号：US10793574

申请日：2004-03-04

Applicant: Rohm and Haas Electronic Materials, L.L.C.

Inventor： David W. Sherrer ,  John J. Fisher

IPC: H01P003/06 ,  H01P003/08

CPC classification number: H01P3/06 ,  H01P1/08 ,  H01P3/00 ,  H01P5/103 ,  H01P5/183 ,  H01P11/002 ,  H01P11/003 ,  H01P11/005 ,  H05K1/0221 ,  H05K1/0272 ,  H05K3/4644 ,  H05K3/4685 ,  H05K2201/09809 ,  Y10T29/49117 ,  Y10T29/49123

Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

Abstract translation: 提供同轴波导微结构。 微结构包括设置在衬底上方的衬底和同轴波导。 同轴波导包括：中心导体; 包括一个或多个壁的外导体，与中心导体间隔开并设置在中心导体周围; 一个或多个电介质支撑构件，用于支撑与中心导体接触并封闭在外部导体内的中心导体; 以及中心导体和外部导体之间的芯体积，其中芯体积处​​于真空状态或气体状态。 还提供了通过顺序构建工艺形成同轴波导微结构的方法和包括同轴波导微结构的密封封装。

公开(公告)号：US20040219451A1

公开(公告)日：2004-11-04

申请号：US10768941

申请日：2004-01-30

Applicant: Rohm and Haas Electronic Materials, L.L.C.

Inventor： Kei Arao ,  Makoto Nomura

IPC: G03C001/76

CPC classification number: G03F7/038

Abstract: Negative type photosensitive resin compositions are provided. Such negative photosensitive resin compositions contain a novolac resin and a phenol-biphenylene resin as well as an epoxy compound. These resin compositions have excellent heat-impact resistance for the hardened resin material.

Abstract translation: 提供负型感光性树脂组合物。 这种负型感光性树脂组合物含有酚醛清漆树脂和苯酚 - 亚联苯树脂以及环氧化合物。 这些树脂组合物对于硬化树脂材料具有优异的耐热冲击性。

公开(公告)号：US20040222104A1

公开(公告)日：2004-11-11

申请号：US10778630

申请日：2004-02-13

Applicant: Rohm and Haas Electronic Materials, L.L.C

Inventor： Deyan Wang ,  Robert D. Mikkola ,  Robert A. Binstead

IPC: C25D003/38

CPC classification number: C25D3/38 ,  C25D3/02 ,  H01L21/2885 ,  H05K3/423

Abstract: Compositions useful for electrodepositing a metal are provided. These compositions contain one or more metal salts, electrolyte, two or more brightener compounds and optionally one or more of leveler compounds and wetting agents. Also provided are methods of depositing a metal layer using these compositions.

Abstract translation: 提供了可用于电沉积金属的组合物。 这些组合物含有一种或多种金属盐，电解质，两种或更多种增白剂化合物和任选的一种或多种矫味剂化合物和润湿剂。 还提供了使用这些组合物沉积金属层的方法。

公开(公告)号：US20040194703A1

公开(公告)日：2004-10-07

申请号：US10817618

申请日：2004-04-02

Applicant: Rohm and Haas Electronic Materials, L.L.C.

Inventor： Deodatta Vinayak Shenai-Khatkhate ,  Michael Brendan Power

IPC: C23C016/00 ,  C08F004/44

CPC classification number: C23C16/28 ,  C07C391/00 ,  C07C395/00 ,  C07F7/0807 ,  C07F7/0827 ,  C07F7/30 ,  C23C16/18

Abstract: Organometallic compounds suitable for use as vapor phase deposition precursors for Group IV metal-containing films are provided. Methods of depositing Group IV metal-containing films using certain organometallic precursors are also provided. Such Group IV metal-containing films are particularly useful in the manufacture of electronic devices.

Abstract translation: 提供了适合用作第IV族含金属膜的气相沉积前体的有机金属化合物。 还提供了使用某些有机金属前体沉积IV族含金属膜的方法。 这种含IV族的含金属膜在电子器件的制造中特别有用。

公开(公告)号：US20040256239A1

公开(公告)日：2004-12-23

申请号：US10843984

申请日：2004-05-12

Applicant: Rohm and Haas Electronic Materials, L.L.C.

Inventor： Keith L. Whitlaw ,  Michael P. Toben ,  Andre Egli ,  Jeffrey N. Crosby ,  Craig S. Robinson

IPC: C25D005/02 ,  B05D001/32 ,  B05D005/00

CPC classification number: H05K3/244 ,  C25D5/022 ,  C25D5/10 ,  C25D5/34 ,  H01L2924/0002 ,  H05K3/383 ,  H05K2203/0392 ,  H01L2924/00

Abstract: A method for plating tin or a tin alloy on a substrate such that whiskers are prevented form forming or the number of whickers is reduced in number as well as size.

Abstract translation: 在基板上镀锡或锡合金的方法，使得防止成形形成晶须或数量减少的数量和尺寸。