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公开(公告)号:US20190093225A1
公开(公告)日:2019-03-28
申请号:US16082740
申请日:2017-03-06
申请人: SEMBLANT LIMITED
IPC分类号: C23C16/503 , C23C16/02 , C23C16/56 , C23C16/44 , C23C16/511 , B05D1/00 , B05D3/00
摘要: A plasma deposition method in which a cover layer is deposited onto the internal walls of an empty plasma chamber by plasma deposition of a precursor mixture comprising (i) one or more hydrocarbon compounds of formula (A), or (ii) one or more C1-C3 alkane, C2-C3 alkene or C2-C3 alkyne compounds: (Formula (A)) wherein: Z1 represents C1-C3 alkyl or C2-C3 alkenyl; Z2 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; Z3 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; Z4 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; Z5 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; and Z6 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl.
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公开(公告)号:US20190037705A1
公开(公告)日:2019-01-31
申请号:US16071647
申请日:2017-01-19
申请人: SEMBLANT LIMITED
摘要: An electrical assembly which has a multi-layer conformal coating comprising three or more layers on at least one surface of the electrical assembly, wherein the lowest layer of the multi-layer conformal coating, which is in contact with the at least one surface of the electrical assembly, is obtainable by plasma deposition of a precursor mixture comprising (a) one or more organo-silicon compounds, (b) optionally O2, N2O, NO2, H2, NH3 and/or N2, and (c) optionally He, Ar and/or Kr; the uppermost layer of the multi-layer conformal coating is obtainable by plasma deposition of a precursor mixture comprising (a) one or more organosilicon compounds, (b) optionally O2, N2O, NO2, H2, NH3 and/or N2, and (c) optionally He, Ar and/or Kr; and the multi-layer coating comprises one or more layers which is obtainable by plasma deposition of a precursor mixture comprising (a) one or more hydrocarbon compounds of formula (A), (b) optionally NH3, N2O, N2, NO2, CH4, C2H6, C3H6 and/or C3H8, and (c) optionally He, Ar and/or Kr, Z1 represents C1-C3 alkyl or C2-C3 alkenyl; Z2 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; Z3 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; Z4 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; Z5 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; and Z6 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl.
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公开(公告)号:US20210078136A1
公开(公告)日:2021-03-18
申请号:US16772371
申请日:2018-12-03
申请人: Semblant Limited
发明人: Ebrahim GHANBARI
摘要: A method of removing a conformal coating from a circuit board coated with said conformal coating, the method comprising: subjecting the circuit board to a jet comprising dry-ice ejected from a nozzle, to remove said conformal coating from said circuit board.
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公开(公告)号:US20170245374A1
公开(公告)日:2017-08-24
申请号:US14779731
申请日:2014-03-25
申请人: SEMBLANT LIMITED
CPC分类号: H05K3/282 , H01L21/32138 , H01L23/552 , H01L23/562 , H01L23/564 , H01L2224/80007 , H01L2224/81007 , H01L2224/82007 , H01L2224/83007 , H01L2224/84007 , H01L2224/85007 , H01L2224/86007 , H05K1/181 , H05K3/285 , H05K2201/09872 , H05K2203/095 , H05K2203/1322 , H05K2203/1333 , H05K2203/1377
摘要: The present invention relates to an electrical assembly which has a conformal coating, wherein said conformal coating is obtainable by a method which comprises: (a) plasma polymerization of a compound of formula (I) and a fluorohydrocarbon, wherein the molar ratio of the compound of formula (I) to the fluorohydrocarbon is from 5:95 to 50:50, and deposition of the resulting polymer onto at least one surface of the electrical assembly: wherein: R1 represents C1-C3 alkyl or C2-C3 alkenyl; R2 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R3 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R4 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R5 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; and R6 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl, and (b) plasma polymerization of a compound of formula (I) and deposition of the resulting polymer onto the polymer formed in step (a).
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公开(公告)号:US20210134566A1
公开(公告)日:2021-05-06
申请号:US16638742
申请日:2018-08-15
申请人: Semblant Limited
IPC分类号: H01J37/32
摘要: A substrate mount for a plasma processing apparatus comprising: a frame; an aperture within the frame, configured to accommodate an insert, the insert being configured to support a substrate for processing by the plasma processing apparatus; a releasable securing mechanism configured to releasably secure the insert within the aperture such that the insert can be replaced.
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公开(公告)号:US20180237917A1
公开(公告)日:2018-08-23
申请号:US15751407
申请日:2016-08-11
申请人: SEMBLANT LIMITED
CPC分类号: C23C18/1605 , C23C16/04 , C23C16/30 , C23C16/401 , C23C16/505 , C23C28/04 , H05K3/0079 , H05K3/184 , H05K2203/0713 , H05K2203/095
摘要: The present invention relates to an electroless plating method, in which electroless plating is performed by contacting a substrate which is patterned with an anti-electroless plating coating with an electroless plating solution, whereby metal is deposited by electroless plating onto portions of the substrate that are not patterned with the anti-electroless plating coating, the anti-electroless plating coating having multiple layers, each of which is obtainable by plasma deposition of a precursor mixture comprising (a) one or more organosilicon compounds, (b) optionally O2, N2O, NO2, H2, NH3, N2, SiF4 and/or hexafluoropropylene (HFP), and (c) optionally He, Ar and/or Kr.
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公开(公告)号:US09992875B2
公开(公告)日:2018-06-05
申请号:US14779731
申请日:2014-03-25
申请人: Semblant Limited
IPC分类号: H01L23/552 , H01L23/00 , H01L21/3213 , H05K3/28 , H05K1/18
CPC分类号: H05K3/282 , H01L21/32138 , H01L23/552 , H01L23/562 , H01L23/564 , H01L2224/80007 , H01L2224/81007 , H01L2224/82007 , H01L2224/83007 , H01L2224/84007 , H01L2224/85007 , H01L2224/86007 , H05K1/181 , H05K3/285 , H05K2201/09872 , H05K2203/095 , H05K2203/1322 , H05K2203/1333 , H05K2203/1377
摘要: The present invention relates to an electrical assembly which has a conformal coating, wherein said conformal coating is obtainable by a method which comprises: (a) plasma polymerization of a compound of formula (I) and a fluorohydrocarbon, wherein the molar ratio of the compound of formula (I) to the fluorohydrocarbon is from 5:95 to 50:50, and deposition of the resulting polymer onto at least one surface of the electrical assembly: wherein: R1 represents C1-C3 alkyl or C2-C3 alkenyl; R2 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R3 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R4 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R5 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; and R6 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl, and (b) plasma polymerization of a compound of formula (I) and deposition of the resulting polymer onto the polymer formed in step (a).
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公开(公告)号:US20200211828A1
公开(公告)日:2020-07-02
申请号:US16622423
申请日:2018-06-13
申请人: Semblant Limited
发明人: Andrew Simon Hall Brooks , Gareth Hennighan , Gianfranco Aresta , Richard Anthony Lione , Shailendra Vikram Singh , Siobhan Marie Woollard
IPC分类号: H01J37/32 , C23C16/458 , C23C16/509
摘要: A plasma processing apparatus for processing a substrate using a plasma, comprising: a process chamber in which the processing takes place; a plasma source for providing a plasma to the process chamber; a substrate mount within the process chamber for holding the substrate, the substrate mount comprising a surface having a plurality of apertures.
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公开(公告)号:US20190090358A1
公开(公告)日:2019-03-21
申请号:US16046075
申请日:2018-07-26
申请人: Semblant Limited
IPC分类号: H05K3/46 , C23C16/30 , C23C16/505 , H05K3/28 , H05K1/18
摘要: An electrical assembly which has a multi-layer conformal coating on at least one surface of the electrical assembly, wherein each layer of the multi-layer coating is obtainable by plasma deposition of a precursor mixture comprising (a) one or more organosilicon compounds, (b) optionally O2, N2O, NO2, H2, NH3, N2, SiF4 and/or hexafluoropropylene (HFP), and (c) optionally He, Ar and/or Kr. The chemistry of the resulting plasma-deposited material chemistry can be described by the general formula: SiOxHyCzFaNb. The properties of the conformal coating are tailored by tuning the values of x, y, z, a and b.
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公开(公告)号:US20170094810A1
公开(公告)日:2017-03-30
申请号:US15266624
申请日:2016-09-15
申请人: Semblant Limited
IPC分类号: H05K3/46 , C23C16/505 , H05K1/18
CPC分类号: H05K3/467 , C23C16/30 , C23C16/505 , H05K1/181 , H05K3/285 , H05K2201/0104 , H05K2201/0162 , H05K2201/09872 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10037 , H05K2201/10053 , H05K2201/10075 , H05K2201/10083 , H05K2201/10098 , H05K2201/10106 , H05K2201/10121 , H05K2201/10128 , H05K2201/10166 , H05K2201/10174 , H05K2201/10181 , H05K2203/095 , H05K2203/121 , H05K2203/1322 , H05K2203/1338
摘要: An electrical assembly which has a multi-layer conformal coating on at least one surface of the electrical assembly, wherein each layer of the multi-layer coating is obtainable by plasma deposition of a precursor mixture comprising (a) one or more organosilicon compounds, (b) optionally O2, N2O, NO2, H2, NH3, N2, SiF4 and/or hexafluoropropylene (HFP), and (c) optionally He, Ar and/or Kr. The chemistry of the resulting plasma-deposited material chemistry can be described by the general formula: SiOxHyCzFaNb. The properties of the conformal coating are tailored by tuning the values of x, y, z, a and b.
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