Abstract:
A device for creating and placing a lamella comprises a focused ion beam, a scanning electron microscope, a stage for placing at least two specimens enabling tilting, rotation and movement of the specimen. The device further comprises a manipulator terminated by a needle for attaching and transporting the specimen. The manipulator is positioned in a plane perpendicular to the axis of the tilt of the specimen, thereby enabling easy transportation and placing of the lamella into the specimen holder for a transmission electron microscope, so-called grid. The manipulator is adjusted to rotate the needle about its own axis. Thus, it enables inverting of the lamella and its polishing over a layer of semiconductor substrate, on which a semiconductor structure is formed, in case of creating the lamella from a semiconductor device.
Abstract:
A method for reducing or removing organic and/or inorganic contamination from a vacuum system of imaging and analytical devices, wherein at least a portion of the area of the inner surface of the vacuum space of the vacuum system is provided with a photocatalytic layer, at least a portion of this photocatalytic layer being cooled to a temperature in the range of 0 K to 280 K, whereby the photocatalytic layer is afterwards at least partially irradiated by electromagnetic radiation, which activates a photocatalytic reaction of the photocatalytic layer with the adsorbed gases of the atmosphere of the inner vacuum space of the vacuum system, where this reaction decomposes the contaminants, reducing their concentration and/or the concentration of water in the inner vacuum space of the vacuum system.
Abstract:
A method of uniformly removing material from a sample surface includes the steps of sputtering by means of scanning the surface with a focused ion beam and a simultaneous observing of the sample during sputtering. Uniform sputtering of different materials is achieved by high-angle sputtering from multiple directions, wherein the directions are rotated relative to each other by a non-zero angle.
Abstract:
The subject matter of the invention is a method of uniformly removing material from a sample surface by sputtering by means of scanning the surface with a focused ion beam and a simultaneous observing of the sample during sputtering. Uniform sputtering of different materials is achieved by high-angle sputtering from multiple directions, wherein the directions are rotated relative to each other by a non-zero angle.
Abstract:
An apparatus for processing a specimen with two or more particle beams, wherein the specimen has a milled side that is processed by a first particle beam and observed by a second particle beam. The specimen is milled during a first milling operation by the first particle beam with the specimen in a first position. Thereafter, the specimen tilts in a second position around an axis of tilt of the specimen. Thereafter, the specimen is milled during a second milling operation. Milling can be performed during continuous tilting of the specimen around the axis of tilt. The axis of tilt of the specimen intersects the milled side. In all the aforementioned positions of the specimen, the second particle beam impinges on the milled side, which enables monitoring of the milling in real time.
Abstract:
A system uses number of analytical devices such as an electron microscope a Raman microscope, an ion beam column and a scanning probe microscope for sample analysis concurrent, consecutive or with the mutual correlation of the analysis performed by the different devices in the same sample area using the connection of the Raman microscope optical objective lens and objective manipulator, that significantly reduces time needed for analyzing by Raman microscope together with other devices and maintains high quality of the sensed signals comparable to stand alone analytical devices.
Abstract:
A method and apparatus for processing a specimen with two or more particle beams, wherein the specimen has a milled side that is processed by a first particle beam and observed by a second particle beam. The specimen is milled during a first milling operation by the first particle beam with the specimen in a first position. Thereafter, the specimen tilts in a second position around an axis of tilt of the specimen. Thereafter, the specimen is milled during a second milling operation. Milling can be performed during continuous tilting of the specimen around the axis of tilt. The axis of tilt of the specimen intersects the milled side. In all the aforementioned positions of the specimen, the second particle beam impinges on the milled side, which enables monitoring of the milling in real time.
Abstract:
A method and apparatus for processing a specimen with two or more particle beams, wherein the specimen has a milled side that is processed by a first particle beam and observed by a second particle beam. The specimen is milled during a first milling operation by the first particle beam with the specimen in a first position. Thereafter, the specimen tilts in a second position around an axis of tilt of the specimen. Thereafter, the specimen is milled during a second milling operation. Milling can be performed during continuous tilting of the specimen around the axis of tilt. The axis of tilt of the specimen intersects the milled side. In all the aforementioned positions of the specimen, the second particle beam impinges on the milled side, which enables monitoring of the milling in real time.
Abstract:
A method for the treatment of inner surfaces of vacuum components and the device for carrying it out which enables the reduction of undesirable organic and inorganic contamination of vacuum systems not only in those that are being produced, but also enables the reduction of contamination in systems that are already in use, such as SEM, TEM, SEM-FIB, XPS, MALDI, SIMS and other analytical and inspection techniques. The proposed method for contaminant treatment derives benefit from a photocatalytic process, which is actually a chemical decomposition of contaminants using a photocatalytic material and electromagnetic radiation, the photocatalytic material being cooled simultaneously to a low temperature. The photocatalytic material is applied to the walls of the vacuum system or vacuum units, which are included in the system, in the form of a layer. If the material with photocatalytic properties is exposed to electromagnetic radiation having an appropriate wavelength, its surface is activated and a characteristic chemical reaction occurs. By using this method it is possible to decompose the contaminants so that they are finally converted to a gaseous phase, the gases being subsequently pumped out of the vacuum system. The inner surface covered with the photocatalytic layer is cooled to low temperatures, which facilitates the adsorption of the contaminants onto the surface covered with the photocatalytic layer and, consequently, increases the effectiveness of the decontamination process.