公开(公告)号：US20100283159A1

公开(公告)日：2010-11-11

申请号：US12843251

申请日：2010-07-26

申请人： Yao-Sheng LIN ,  Tai-Hong CHEN

发明人： Yao-Sheng LIN ,  Tai-Hong CHEN

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H05K3/361 ,  G02F1/13452 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/81 ,  H01L24/83 ,  H01L24/98 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13016 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83136 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/15788 ,  H01L2924/351 ,  H05K1/111 ,  H05K3/225 ,  H05K3/323 ,  H05K3/4092 ,  H05K2201/09427 ,  H05K2201/09663 ,  H05K2203/175 ,  H01L2924/00

摘要： A circuit substrate and the method for fabricating a packaging of the circuit substrate are provided. A plurality of electrodes are formed on the surface of the circuit substrate, the electrodes are formed with fork structures over an connection section of the circuit substrate, so that when the circuit substrate expands/contracts due to thermal processes, the probability of alignment with electrodes of an external circuit board is increased by easily detaching the fork structure overlapping an electrode of the external circuit board which is not corresponding to the fork structure of the electrode of the circuit substrate, so as to avoid short circuit. Thus, electrode misalignment due to electrode pitch variation of the traditional circuit substrate as a result of thermal deformation can be effectively eliminated.

摘要翻译： 提供电路基板和制造电路基板的封装的方法。 多个电极形成在电路基板的表面上，电极在电路基板的连接部分上形成有叉结构，使得当电路基板由于热处理而膨胀/收缩时，与电极对准的概率 通过容易地分离与外部电路板的与电路基板的电极的叉结构不相对应的电极重叠的叉结构来增加外部电路板，以避免短路。 因此，可以有效地消除由于热变形导致的传统电路基板的电极间距变化引起的电极未对准。

公开(公告)号：US20070210457A1

公开(公告)日：2007-09-13

申请号：US11308180

申请日：2006-03-10

申请人： Ji-Cheng Lin ,  Yao-Sheng Lin ,  Shyh-Ming Chang ,  Su-Tsai Lu ,  Hsien-Chie Cheng ,  Tai-Hong Chen

发明人： Ji-Cheng Lin ,  Yao-Sheng Lin ,  Shyh-Ming Chang ,  Su-Tsai Lu ,  Hsien-Chie Cheng ,  Tai-Hong Chen

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L24/10 ,  H01L23/49811 ,  H01L24/13 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599

摘要： A composite bump suitable for disposing on a substrate pad is provided. The composite bump includes a compliant body and an outer conductive layer. The coefficient of thermal expansion (CTE) of the compliant body is between 5 ppm/° C. and 200 ppm/° C. The outer conductive layer covers the compliant body and is electrically connected to the pad. The compliant body can provide a stress buffering effect for a bonding operation. Furthermore, by setting of the CTE of the compliant body within a preferable range, damages caused by thermal stress are reduced while the bonding effect is enhanced.

摘要翻译： 提供了适合于设置在基板焊盘上的复合凸块。 复合凸块包括柔性本体和外导电层。 柔性体的热膨胀系数（CTE）在5ppm /℃和200ppm /℃之间。外部导电层覆盖柔性体并与衬垫电连接。 柔性体可以为粘接操作提供应力缓冲效果。 此外，通过将柔性体的CTE设定在优选范围内，由于热应力引起的损伤降低，同时结合效果增强。

公开(公告)号：US06767818B1

公开(公告)日：2004-07-27

申请号：US09634556

申请日：2000-08-07

申请人： Shyh-Ming Chang ,  Tai-Hong Chen ,  Yu-Te Hsieh ,  Chun-Ming Huang ,  Jui Ming Ni ,  Ching-Yun Chang ,  Jwo-Huei Jou

发明人： Shyh-Ming Chang ,  Tai-Hong Chen ,  Yu-Te Hsieh ,  Chun-Ming Huang ,  Jui Ming Ni ,  Ching-Yun Chang ,  Jwo-Huei Jou

IPC分类号： H01L2144

CPC分类号： H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05684 ,  H01L2224/05124 ,  H01L2224/05147

摘要： A method for forming electrically conductive bumps on a semiconductor substrate, or a semiconductor wafer and devices formed by the method are disclosed. In the method, a wafer that has an active surface, a plurality of conductive elements formed on the active surface and a passivation layer insulating the plurality of conductive bumps from each other is first provided. A first metal layer is then sputter deposited on top of the plurality of conductive elements and the passivation layer, followed by stencil printing a plurality of bumps of an insulating material on top of each one of the plurality of conductive elements. The plurality of bumps may be heat treated to a temperature of at least 100° C. for a period of at least 10 minutes for stress relief. A second metal layer is then sputter deposited on top of the plurality of bumps and the first metal layer. The first and the second metal layers are then patterned by a photolithographic process and formed by a wet or dry etching process to remove metal layers in areas in-between the plurality of bumps.

摘要翻译： 公开了一种在半导体衬底或半导体晶片上形成导电凸块的方法以及通过该方法形成的器件。 在该方法中，首先提供具有活性表面的晶片，形成在有源表面上的多个导电元件和使多个导电凸块彼此绝缘的钝化层。 然后将第一金属层溅射沉积在多个导电元件和钝化层的顶部上，随后在多个导电元件中的每一个的顶部上模版印刷绝缘材料的多个凸块。 多个凸起可以被热处理至至少100℃的温度至少10分钟的时间以减轻应力。 然后将第二金属层溅射沉积在多个凸起和第一金属层的顶部上。 然后通过光刻工艺对第一和第二金属层进行构图，并通过湿式或干式蚀刻工艺形成，以去除多个凸块之间的区域中的金属层。

公开(公告)号：US06501525B2

公开(公告)日：2002-12-31

申请号：US09732863

申请日：2000-12-08

申请人： Yuan-Chang Huang ,  Tai-Hong Chen

发明人： Yuan-Chang Huang ,  Tai-Hong Chen

IPC分类号： G02F11335

CPC分类号： G02F1/13452 ,  G02F1/1345 ,  G02F1/136277 ,  H05K1/0269 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0108 ,  H05K2203/166

摘要： A method for simultaneously forming a flat display panel and bonding to a printed circuit board is disclosed in which a silicon wafer is first supplied and then coated with an alignment layer, a multiplicity of spacers are then mounted to the wafer before it is severed into a multiplicity of dies. A frame seal is then applied to the periphery of the die, while a multiplicity of metal leads is formed on the die for electrical communication with a multiplicity of thin film transistors. A glass plate is then assembled to the silicon substrate by the frame seal, while simultaneously bonded to a printed circuit board in a bonder apparatus under pressure by utilizing a conductive material such as silver paste, an anisotropic conductive film or an isotropic conductive adhesive. The bonding of the printed circuit board to the flat panel display module occurs simultaneously with the formation of interconnections between the printed circuit board and the multiplicity of metal leads on the silicon substrate through a multiplicity of transparent electrodes formed on the glass plate of the flat panel display. The present invention novel structure allows the use of a conventional alignment apparatus such as CCD for optical alignment and a conventional bonder apparatus since a glass substrate is completely exposed and optical transmission can be achieved through the flat panel display module.

摘要翻译： 公开了一种同时形成平板显示面板并结合印刷电路板的方法，其中首先提供硅晶片，然后涂覆取向层，然后将许多间隔物安装到晶片上，然后将其切割成 多重的模具 然后将框架密封件施加到管芯的周边，同时在管芯上形成多个金属引线以与多个薄膜晶体管电连通。 然后通过框架密封将玻璃板组装到硅衬底，同时通过利用诸如银膏，各向异性导电膜或各向同性导电粘合剂的导电材料在压力下在粘合装置中同时结合印刷电路板。 印刷电路板与平板显示模块的接合与印刷电路板和硅基板上的多个金属引线之间的互连通过形成在平板玻璃板上的多个透明电极同时发生 显示。 本发明的新颖结构允许使用诸如用于光学对准的CCD的常规对准装置和常规的接合装置，因为玻璃基板被完全暴露，并且可以通过平板显示模块实现光传输。

公开(公告)号：US11871810B2

公开(公告)日：2024-01-16

申请号：US16926461

申请日：2020-07-10

申请人： Tai Hong Chen

发明人： Tai Hong Chen

IPC分类号： A42B3/30 ,  H04B1/3827 ,  A61B5/024 ,  H04W4/02

CPC分类号： A42B3/30 ,  A61B5/024 ,  H04B1/385 ,  H04W4/02 ,  H04B2001/3866 ,  H04R2460/13

摘要： A communication helmet includes a helmet, a fixing belt, and a speaker module. The helmet has a head cavity for protecting a human head. Such helmet may be any known or new types of helmets for protecting soldiers, riders, policemen, working men in architecture building or in another engineering facilities, or for any other purposes and uses. The fixing belt has two belt ends connecting to two sides of the helmet. The fixing belt and the helmet together form a head container for fitting the human head.

公开(公告)号：US08604613B2

公开(公告)日：2013-12-10

申请号：US12237578

申请日：2008-09-25

申请人： Su-Tsai Lu ,  Tai-Hong Chen

发明人： Su-Tsai Lu ,  Tai-Hong Chen

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/12 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/17 ,  H01L24/29 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05567 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13016 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29499 ,  H01L2224/325 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/3025 ,  H01L2924/01007 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05541 ,  H01L2224/05005 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An electronic device comprises a substrate and a number of bump units over the substrate, wherein each of the bump units includes an electrically insulating bump-forming body extending in a first direction, and at least two conductive layers separated from each other on the electrically insulating bump-forming body, the at least two conductive layers extending in a second direction orthogonal to the first direction.

摘要翻译： 电子器件包括衬底和衬底上的多个凸块单元，其中每个凸块单元包括沿第一方向延伸的电绝缘凸块形成体，以及在电绝缘上彼此分离的至少两个导电层 所述至少两个导电层在与所述第一方向正交的第二方向上延伸。

公开(公告)号：US20090026611A1

公开(公告)日：2009-01-29

申请号：US12237578

申请日：2008-09-25

申请人： Su-Tsai Lu ,  Tai-Hong Chen

发明人： Su-Tsai Lu ,  Tai-Hong Chen

IPC分类号： H01L21/60 ,  H01L23/498

CPC分类号： H01L24/12 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/17 ,  H01L24/29 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05567 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13016 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29499 ,  H01L2224/325 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/3025 ,  H01L2924/01007 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05541 ,  H01L2224/05005 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An electronic device comprises a substrate and a number of bump units over the substrate, wherein each of the bump units includes an electrically insulating bump-forming body extending in a first direction, and at least two conductive layers separated from each other on the electrically insulating bump-forming body, the at least two conductive layers extending in a second direction orthogonal to the first direction.

摘要翻译： 电子器件包括衬底和衬底上的多个凸块单元，其中每个凸块单元包括沿第一方向延伸的电绝缘凸块形成体，以及在电绝缘上彼此分离的至少两个导电层 所述至少两个导电层在与所述第一方向正交的第二方向上延伸。

公开(公告)号：US5888373A

公开(公告)日：1999-03-30

申请号：US880998

申请日：1997-06-23

申请人： Jin-Chie Lin ,  Chih-Chia Chen ,  Tai-Hong Chen ,  Fong-Ru Yang ,  Jyh-Herng Chen

发明人： Jin-Chie Lin ,  Chih-Chia Chen ,  Tai-Hong Chen ,  Fong-Ru Yang ,  Jyh-Herng Chen

IPC分类号： C25D21/14 ,  C25D3/58

CPC分类号： C25D21/14

摘要： A method for preparing a nickel-zinc-copper or nickel-zinc alloy electroplating solution from at least one electroplating waste solution and/or at least one acidic leach solution of metal scrap containing nickel and/or zinc ions is disclosed. The method involves mixing two or more than two of solutions of the electroplating waste solutions and the acidic leach solutions, and optionally water, so that the ion concentrations of Ni, Zn, Cu, Fe, Cr and Pb of the resulting mixed solution are within the following ion concentrations:15 gdm.sup.-3

摘要翻译： 公开了一种从至少一种电镀废液和/或含有镍和/或锌离子的金属废料的至少一种酸性浸出溶液制备镍 - 锌 - 铜或镍 - 锌合金电镀溶液的方法。 该方法包括混合电镀废液和酸性浸出溶液以及任选的水中的两种或两种以上的溶液，使得所得混合溶液中的Ni，Zn，Cu，Fe，Cr和Pb的离子浓度在 以下离子浓度：15gdm-3

公开(公告)号：US08247908B2

公开(公告)日：2012-08-21

申请号：US12843251

申请日：2010-07-26

申请人： Yao-Sheng Lin ,  Tai-Hong Chen

发明人： Yao-Sheng Lin ,  Tai-Hong Chen

IPC分类号： H01L23/52

CPC分类号： H05K3/361 ,  G02F1/13452 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/81 ,  H01L24/83 ,  H01L24/98 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/13016 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83136 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/15788 ,  H01L2924/351 ,  H05K1/111 ,  H05K3/225 ,  H05K3/323 ,  H05K3/4092 ,  H05K2201/09427 ,  H05K2201/09663 ,  H05K2203/175 ,  H01L2924/00

摘要： A circuit substrate and the method for fabricating a packaging of the circuit substrate are provided. A plurality of electrodes are formed on the surface of the circuit substrate, the electrodes are formed with fork structures over an connection section of the circuit substrate, so that when the circuit substrate expands/contracts due to thermal processes, the probability of alignment with electrodes of an external circuit board is increased by easily detaching the fork structure overlapping an electrode of the external circuit board which is not corresponding to the fork structure of the electrode of the circuit substrate, so as to avoid short circuit. Thus, electrode misalignment due to electrode pitch variation of the traditional circuit substrate as a result of thermal deformation can be effectively eliminated.

摘要翻译： 提供电路基板和制造电路基板的封装的方法。 多个电极形成在电路基板的表面上，电极在电路基板的连接部分上形成有叉结构，使得当电路基板由于热处理而膨胀/收缩时，与电极对准的概率 通过容易地分离与外部电路板的与电路基板的电极的叉结构不相对应的电极重叠的叉结构来增加外部电路板，以避免短路。 因此，可以有效地消除由于热变形导致的传统电路基板的电极间距变化引起的电极未对准。

公开(公告)号：US08023060B2

公开(公告)日：2011-09-20

申请号：US11926113

申请日：2007-10-28

申请人： Yao-Sheng Lin ,  Tai-Hong Chen ,  Su-Yu Fun

发明人： Yao-Sheng Lin ,  Tai-Hong Chen ,  Su-Yu Fun

IPC分类号： G02F1/1333

CPC分类号： G06F1/1615 ,  G02F1/133305 ,  G02F2201/54 ,  G06F1/1652

摘要： A flexible display including a flexible display panel and a flexible hollow supporting structure is provided. The flexible display panel has a first end and a second end opposite to each other. The flexible hollow supporting structure is integrated with the flexible display panel and extends from the first end to the second end of the flexible display panel. In addition, a supporting medium can be infused into the flexible hollow supporting structure so as to stretch and support the flexible display panel.

摘要翻译： 提供了包括柔性显示面板和柔性中空支撑结构的柔性显示器。 柔性显示面板具有彼此相对的第一端和第二端。 柔性中空支撑结构与柔性显示面板一体化并从柔性显示面板的第一端延伸到第二端。 此外，可以将支撑介质输入到柔性中空支撑结构中，以便拉伸和支撑柔性显示面板。