公开(公告)号：US08647517B2

公开(公告)日：2014-02-11

申请号：US12216589

申请日：2008-07-08

申请人： Takahiko Yokai ,  Yasunari Ooyabu ,  Toshiki Naito

发明人： Takahiko Yokai ,  Yasunari Ooyabu ,  Toshiki Naito

IPC分类号： H01B13/00 ,  B44C1/22

CPC分类号： G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/108 ,  H05K3/44 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/0323 ,  H05K2203/056

摘要： A producing method of a suspension board with circuit includes simultaneously forming a conductive pattern formed on an insulating layer formed on a metal supporting board and having a terminal portion for connecting to an electronic component, and a mark formed on the metal supporting board, or on the insulating layer and having an opening for forming a reference hole for mounting the electronic component, and forming the reference hole by etching the metal supporting board disposed in the opening of the mark, or the insulating layer and the metal supporting board each disposed in the opening of the mark.

摘要翻译： 具有电路的悬挂板的制造方法包括同时形成形成在金属支撑板上的绝缘层上的导电图案，并且具有用于连接到电子部件的端子部分，以及形成在金属支撑板上的标记， 所述绝缘层具有用于形成用于安装所述电子部件的基准孔的开口，并且通过蚀刻设置在所述标记的开口中的所述金属支撑板，或者设置在所述绝缘层和所述金属支撑板上而形成所述基准孔 打开标记。

公开(公告)号：US20070218781A1

公开(公告)日：2007-09-20

申请号：US11717706

申请日：2007-03-14

申请人： Takahiko Yokai ,  Toshiki Naito ,  Yasunari Ooyabu

发明人： Takahiko Yokai ,  Toshiki Naito ,  Yasunari Ooyabu

IPC分类号： H01R13/514

CPC分类号： H01R12/592 ,  H01R12/52 ,  H05K1/056 ,  H05K1/118 ,  H05K3/363 ,  H05K2201/10477 ,  H05K2203/041

摘要： A wired circuit board includes a metal supporting layer, an insulating layer formed on the metal supporting layer and a conductive pattern formed on the insulating layer, and having a terminal portion for connecting to an external terminal. The terminal portion is disposed at an end portion of the conductive pattern, supported on the insulating layer, and exposed from the metal supporting layer to have an end surface thereof used as a point of contact with the external terminal.

摘要翻译： 布线电路板包括金属支撑层，形成在金属支撑层上的绝缘层和形成在绝缘层上的导电图案，并且具有用于连接到外部端子的端子部分。 端子部分设置在导电图案的端部，被支撑在绝缘层上，并从金属支撑层露出，使其端面用作与外部端子的接触点。

公开(公告)号：US07872200B2

公开(公告)日：2011-01-18

申请号：US11717706

申请日：2007-03-14

申请人： Takahiko Yokai ,  Toshiki Naito ,  Yasunari Ooyabu

发明人： Takahiko Yokai ,  Toshiki Naito ,  Yasunari Ooyabu

IPC分类号： H05K1/00

CPC分类号： H01R12/592 ,  H01R12/52 ,  H05K1/056 ,  H05K1/118 ,  H05K3/363 ,  H05K2201/10477 ,  H05K2203/041

摘要： A wired circuit board includes a metal supporting layer, an insulating layer formed on the metal supporting layer and a conductive pattern formed on the insulating layer, and having a terminal portion for connecting to an external terminal. The terminal portion is disposed at an end portion of the conductive pattern, supported on the insulating layer, and exposed from the metal supporting layer to have an end surface thereof used as a point of contact with the external terminal.

摘要翻译： 布线电路板包括金属支撑层，形成在金属支撑层上的绝缘层和形成在绝缘层上的导电图案，并且具有用于连接到外部端子的端子部分。 端子部分设置在导电图案的端部，被支撑在绝缘层上，并从金属支撑层露出，使其端面用作与外部端子的接触点。

公开(公告)号：US20090014410A1

公开(公告)日：2009-01-15

申请号：US12216589

申请日：2008-07-08

申请人： Takahiko Yokai ,  Yasunari Ooyabu ,  Toshiki Naito

发明人： Takahiko Yokai ,  Yasunari Ooyabu ,  Toshiki Naito

IPC分类号： H01B13/34

CPC分类号： G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/108 ,  H05K3/44 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/0323 ,  H05K2203/056

摘要： A producing method of a suspension board with circuit includes simultaneously forming a conductive pattern formed on an insulating layer formed on a metal supporting board and having a terminal portion for connecting to an electronic component, and a mark formed on the metal supporting board, or on the insulating layer and having an opening for forming a reference hole for mounting the electronic component, and forming the reference hole by etching the metal supporting board disposed in the opening of the mark, or the insulating layer and the metal supporting board each disposed in the opening of the mark.

摘要翻译： 具有电路的悬挂板的制造方法包括同时形成形成在金属支撑板上的绝缘层上的导电图案，并且具有用于连接到电子部件的端子部分，以及形成在金属支撑板上的标记， 所述绝缘层具有用于形成用于安装所述电子部件的基准孔的开口，并且通过蚀刻设置在所述标记的开口中的所述金属支撑板，或者设置在所述绝缘层和所述金属支撑板上而形成所述基准孔 打开标记。

公开(公告)号：US08179691B2

公开(公告)日：2012-05-15

申请号：US12318689

申请日：2009-01-06

申请人： Takahiko Yokai ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

发明人： Takahiko Yokai ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

IPC分类号： H05K7/00

CPC分类号： H05K1/0245 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0216 ,  H05K1/0248 ,  H05K1/056 ,  H05K2201/0352 ,  H05K2201/09236 ,  H05K2201/09672 ,  H05K2201/09736

摘要： A wired circuit board includes a first insulating layer; a first wire formed on the first insulating layer; a second insulating layer formed on the first insulating layer so as to cover the first wire; and a second wire formed on the second insulating layer so as to be arranged in opposed relation to the first wire in a thickness direction. The thickness of the first wire is 1 μm or less and is ⅓ or less of the thickness of the second insulating layer.

摘要翻译： 布线电路板包括第一绝缘层; 形成在所述第一绝缘层上的第一线; 形成在所述第一绝缘层上以覆盖所述第一线的第二绝缘层; 以及形成在所述第二绝缘层上以在厚度方向上相对于所述第一布线布置的第二布线。 第一线的厚度为1μm以下，为第二绝缘层的厚度的1/3以下。

公开(公告)号：US20090173521A1

公开(公告)日：2009-07-09

申请号：US12318689

申请日：2009-01-06

申请人： Takahiko Yokai ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

发明人： Takahiko Yokai ,  Tetsuya Ohsawa ,  Yasunari Ooyabu

IPC分类号： H05K1/02

CPC分类号： H05K1/0245 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0216 ,  H05K1/0248 ,  H05K1/056 ,  H05K2201/0352 ,  H05K2201/09236 ,  H05K2201/09672 ,  H05K2201/09736

摘要： A wired circuit board includes a first insulating layer; a first wire formed on the first insulating layer; a second insulating layer formed on the first insulating layer so as to cover the first wire; and a second wire formed on the second insulating layer so as to be arranged in opposed relation to the first wire in a thickness direction. The thickness of the first wire is 1 μm or less and is ⅓ or less of the thickness of the second insulating layer.

摘要翻译： 布线电路板包括第一绝缘层; 形成在所述第一绝缘层上的第一线; 形成在所述第一绝缘层上以覆盖所述第一线的第二绝缘层; 以及形成在所述第二绝缘层上以在厚度方向上相对于所述第一布线布置的第二布线。 第一线的厚度为1μm以下，为第二绝缘层的厚度的1/3以下。

公开(公告)号：US08877528B2

公开(公告)日：2014-11-04

申请号：US13446611

申请日：2012-04-13

申请人： Yasunari Ooyabu ,  Toshiki Naito ,  Satoshi Sato

发明人： Yasunari Ooyabu ,  Toshiki Naito ,  Satoshi Sato

IPC分类号： H01L21/00 ,  H01L33/56 ,  H01L33/46 ,  H01L33/00

CPC分类号： H01L33/56 ,  H01L24/97 ,  H01L33/0095 ,  H01L33/46 ,  H01L2224/16 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

摘要： A method for producing a light emitting transfer sheet includes the steps of preparing a light emitting element sheet including a light semiconductor layer connected to an electrode portion on one side surface and a phosphor layer laminated on the other side surface; dividing the light emitting element sheet into plural pieces to form a plurality of light emitting elements; disposing a plurality of the light emitting elements on a substrate to be spaced apart from each other; forming a reflecting resin layer containing a light reflecting component on the substrate so as to cover the light emitting elements; and removing the reflecting resin layer partially so that one side surface of the electrode portion is exposed from the reflecting resin layer.

摘要翻译： 发光转印片的制造方法包括以下步骤：制备包括连接到一个侧表面上的电极部分的光半导体层和层压在另一个侧表面上的荧光体层的发光元件片材; 将发光元件片分割成多个片以形成多个发光元件; 将多个发光元件设置在基板上以彼此间隔开; 在所述基板上形成包含光反射部件的反射树脂层以覆盖所述发光元件; 并且部分地去除反射树脂层，使得电极部分的一个侧表面从反射树脂层露出。

公开(公告)号：US20090044969A1

公开(公告)日：2009-02-19

申请号：US12219343

申请日：2008-07-21

申请人： Jun Ishii ,  Yasunari Ooyabu ,  Takeshi Tanaka ,  Toshiki Naito

发明人： Jun Ishii ,  Yasunari Ooyabu ,  Takeshi Tanaka ,  Toshiki Naito

IPC分类号： H05K1/14

CPC分类号： H05K3/363 ,  H05K1/056 ,  H05K1/117 ,  H05K1/142 ,  H05K2201/058 ,  H05K2201/09145 ,  H05K2201/09381 ,  H05K2203/167

摘要： A wired circuit board includes a first wired circuit board and a second wired circuit board disposed to be opposed to the first wired circuit board in the same plane. A first opposed surface of the first wired circuit board facing the second wired circuit board and a second opposed surface of the second wired circuit board facing the first wired circuit board include at least two types of interfitting surfaces extending in different directions so as to mutually interfit the first opposed surface with the second opposed surface.

摘要翻译： 布线电路板包括第一布线电路板和布置成与同一平面中的第一布线电路板相对的第二布线电路板。 面向第二布线电路板的第一布线电路板的第一相对表面和面对第一布线电路板的第二布线电路板的第二相对表面包括沿不同方向延伸的至少两种类型的配合表面，以便相互配合 具有第二相对表面的第一相对表面。

公开(公告)号：US20090025968A1

公开(公告)日：2009-01-29

申请号：US12219479

申请日：2008-07-23

申请人： Yasunari Ooyabu ,  Visit Thaveeprungsriporn ,  Hayato Abe ,  Kazuya Nakamura ,  Katsutoshi Kamei ,  Toshiki Naito

发明人： Yasunari Ooyabu ,  Visit Thaveeprungsriporn ,  Hayato Abe ,  Kazuya Nakamura ,  Katsutoshi Kamei ,  Toshiki Naito

IPC分类号： H05K1/09

CPC分类号： H05K3/244 ,  H05K3/28 ,  H05K2203/1105 ,  Y10T29/49117

摘要： A wired circuit board includes an insulating layer, a conductive pattern made of copper formed on the insulating layer and a covering layer made of an alloy of copper and tin to cover the conductive pattern. An existing ratio of tin in the covering layer increases in accordance with a distance from an inner surface adjacent to the conductive pattern toward an outer surface being not adjacent to the conductive pattern. An atomic ratio of copper to tin in the outer surface of the covering layer is more than 3.

摘要翻译： 布线电路板包括绝缘层，由绝缘层形成的由铜制成的导电图案和由铜和锡的合金制成的覆盖层以覆盖导电图案。 根据与导电图案相邻的内表面与不与导电图案相邻的外表面的距离，覆盖层中锡的存在比例增加。 覆盖层外表面铜与锡的原子比大于3。

公开(公告)号：US09412920B2

公开(公告)日：2016-08-09

申请号：US13446540

申请日：2012-04-13

申请人： Yasunari Ooyabu ,  Hisataka Ito ,  Tsutomu Nishioka ,  Toshiki Naito

发明人： Yasunari Ooyabu ,  Hisataka Ito ,  Tsutomu Nishioka ,  Toshiki Naito

IPC分类号： H01L33/50 ,  H01L33/56 ,  H01L33/46 ,  H01L23/00

CPC分类号： H01L33/56 ,  H01L24/97 ,  H01L33/46 ,  H01L33/505 ,  H01L2224/16 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2933/005 ,  H01L2924/00

摘要： A phosphor reflecting sheet provides a phosphor layer on one side in a thickness direction of a light emitting diode element and provides a reflecting resin layer at the side of the light emitting diode element. The phosphor reflecting sheet includes the phosphor layer and the reflecting resin layer provided on one surface in the thickness direction of the phosphor layer. The reflecting resin layer is formed corresponding to the light emitting diode element so as to be disposed in opposed relation to the side surface of the light emitting diode element.

摘要翻译： 荧光体反射片在发光二极管元件的厚度方向的一侧提供荧光体层，并且在发光二极管元件侧提供反射树脂层。 荧光体反射片包括荧光体层和设置在荧光体层的厚度方向的一个表面上的反射树脂层。 反射树脂层相对于发光二极管元件形成为与发光二极管元件的侧面相对设置。