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公开(公告)号：US08338713B2
公开(公告)日：2012-12-25
申请号：US11939554
申请日：2007-11-14
IPC分类号： H05K1/09
CPC分类号： H05K3/222 , H01L2224/16225 , H01L2924/15311 , H01R12/523 , H01R12/7082 , H01R12/716 , H01R12/79 , H05K3/308 , H05K2201/044 , H05K2201/10356 , H05K2201/1059
摘要： An assembly for conducting an electronic signal. The assembly includes a substrate and an electronic cable. The substrate has distinct first and second regions to enable connection to first and second circuit boards, respectively. First and second through-holes are formed in the substrate in the first and second regions, respectively. The electronic cable is disposed within the first through-hole and extends out of the first through hole, adjacent the substrate and into the second through-hole.
摘要翻译： 用于进行电子信号的组件。 组件包括基板和电子电缆。 衬底具有不同的第一和第二区域，以分别连接到第一和第二电路板。 分别在第一和第二区域的基板中形成第一和第二通孔。 电子电缆设置在第一通孔内并且延伸出第一通孔，邻近基板并进入第二通孔。
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公开(公告)号：US20090120668A1
公开(公告)日：2009-05-14
申请号：US11939554
申请日：2007-11-14
IPC分类号： H05K1/00
CPC分类号： H05K3/222 , H01L2224/16225 , H01L2924/15311 , H01R12/523 , H01R12/7082 , H01R12/716 , H01R12/79 , H05K3/308 , H05K2201/044 , H05K2201/10356 , H05K2201/1059
摘要： An assembly for conducting an electronic signal. The assembly includes a substrate and an electronic cable. The substrate has distinct first and second regions to enable connection to first and second circuit boards, respectively. First and second through-holes are formed in the substrate in the first and second regions, respectively. The electronic cable is disposed within the first through-hole and extends out of the first through hole, adjacent the substrate and into the second through-hole.
摘要翻译： 用于进行电子信号的组件。 组件包括基板和电子电缆。 衬底具有不同的第一和第二区域，以分别连接到第一和第二电路板。 分别在第一和第二区域的基板中形成第一和第二通孔。 电子电缆设置在第一通孔内并且延伸出第一通孔，邻近基板并进入第二通孔。
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公开(公告)号：US20110065332A1
公开(公告)日：2011-03-17
申请号：US12953171
申请日：2010-11-23
CPC分类号： H01R12/714 , H01R12/52 , H01R12/7082 , H01R13/24 , H01R13/6599
摘要： An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface.
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公开(公告)号：US08324727B2
公开(公告)日：2012-12-04
申请号：US12720110
申请日：2010-03-09
申请人： Joseph C. Fjelstad , Kevin P. Grundy , Para K. Segaram , William F. Wiedemann , Thomas J. Obenhuber , Inessa Obenhuber, legal representative
发明人： Joseph C. Fjelstad , Kevin P. Grundy , Para K. Segaram , William F. Wiedemann , Thomas J. Obenhuber
IPC分类号： H01L23/34
CPC分类号： H01C7/003 , H01C13/02 , H01G4/33 , H01L23/49816 , H01L23/49822 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48235 , H01L2224/49109 , H01L2924/00014 , H01L2924/01078 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H05K1/0231 , H05K1/0233 , H05K1/0234 , H05K1/0246 , H05K1/186 , H05K3/4602 , H05K2201/09536 , H05K2201/10643 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Disclosed are low profile discrete electronic component structures that are suitable for placement and use in a vertical interconnection mode either within an electronic interconnection substrate, between interconnection substrate and electronic component or within an IC package.
摘要翻译： 公开了适用于在电子互连衬底内，互连衬底和电子部件之间或IC封装内的垂直互连模式下放置和使用的薄型离散电子部件结构。
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5.发明申请公开(公告)号：US20110171857A1
公开(公告)日：2011-07-14
申请号：US13052831
申请日：2011-03-21
IPC分类号： H01R13/46
CPC分类号： H01R12/714 , H01R12/52 , H01R12/7082 , H01R13/24 , H01R13/6599
摘要： An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface.
摘要翻译： 电连接器。 一种电连接器，包括具有第一通道的连接器主体和在第一末端部分中延伸穿过第一通道的第一导电元件。 第一末端部分具有第一力矩臂，当被迫与第一导电表面接触时，扭转第一导电元件以产生扭转力。 扭转力保持第一末端部分与第一导电表面接触。
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6.发明申请High Speed, Direct Path, Stair-Step, Electronic Connectors with Improved Signal Integrity Characteristics and Methods for their Manufacture 有权高速，直通，阶梯式，电子连接器，具有改进的信号完整性特性及其制造方法公开(公告)号：US20100151704A1
公开(公告)日：2010-06-17
申请号：US12693097
申请日：2010-01-25
IPC分类号： H01R12/00
CPC分类号： H05K1/117 , H01R12/523 , H01R12/62 , H01R12/716 , H01R13/24 , H01R13/6587 , H05K1/142 , H05K3/366 , H05K3/368 , H05K2201/09063 , H05K2201/09445 , H05K2201/09472 , H05K2201/09709 , H05K2201/09845 , H05K2201/10189 , H05K2203/167
摘要： An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised of stair-step electrical connectors mated to stair-step printed circuit boards, other stair-step electrical components, or combinations thereof.
摘要翻译： 一种电连接器，包括布置成阶梯式结构的多个电触点，其设计成与具有以阶梯状构造布置的电触点的电气部件配合。 一种直接连接信号系统，包括与台阶式印刷电路板，其他楼梯电气部件或其组合配合的楼梯级电连接器。
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公开(公告)号：US20100127402A1
公开(公告)日：2010-05-27
申请号：US12692974
申请日：2010-01-25
IPC分类号： H01L23/48
CPC分类号： H01L23/13 , H01L23/3107 , H01L24/48 , H01L24/49 , H01L25/105 , H01L2224/0401 , H01L2224/05599 , H01L2224/16235 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/49109 , H01L2224/85399 , H01L2225/1029 , H01L2225/1058 , H01L2225/107 , H01L2225/1088 , H01L2924/00014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19107 , H01L2924/3011 , H01L2924/30111 , H05K1/182 , H05K1/183 , H05K3/308 , H05K3/3405 , H05K3/3421 , H05K3/3447 , H05K3/4046 , H05K3/4602 , H05K3/4697 , H05K2201/0919 , H05K2201/092 , H05K2201/09845 , H05K2201/10189 , H05K2201/1053 , H05K2201/10545 , H05K2201/1059 , H05K2201/10659 , H05K2201/10689 , H05K2201/10704 , H05K2201/10727 , H05K2201/10734 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： Structures employed by a plurality of packages, printed circuit boards, connectors and interposers to create signal paths which reduce the deleterious signal quality issues associated with the use of through-holes. Disclosed structures can coexist with through-hole implementations.
摘要翻译： 由多个封装，印刷电路板，连接器和插入件采用的结构，以产生减少与使用通孔相关联的有害信号质量问题的信号路径。 公开的结构可以与通孔实现共存。
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8.发明授权公开(公告)号：US07909615B1
公开(公告)日：2011-03-22
申请号：US12953171
申请日：2010-11-23
IPC分类号： H01R12/00
CPC分类号： H01R12/714 , H01R12/52 , H01R12/7082 , H01R13/24 , H01R13/6599
摘要： An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface.
摘要翻译： 电连接器。 一种电连接器，包括具有第一通道的连接器主体和在第一末端部分中延伸穿过第一通道的第一导电元件。 第一末端部分具有第一力矩臂，当被迫与第一导电表面接触时，扭转第一导电元件以产生扭转力。 扭转力保持第一末端部分与第一导电表面接触。
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9.发明授权公开(公告)号：US07845986B2
公开(公告)日：2010-12-07
申请号：US11123863
申请日：2005-05-06
IPC分类号： H01R24/00
CPC分类号： H01R12/714 , H01R12/52 , H01R12/7082 , H01R13/24 , H01R13/6599
摘要： An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface.
摘要翻译： 电连接器。 一种电连接器，包括具有第一通道的连接器主体和在第一末端部分中延伸穿过第一通道的第一导电元件。 第一末端部分具有第一力矩臂，当被迫与第一导电表面接触时，扭转第一导电元件以产生扭转力。 扭转力保持第一末端部分与第一导电表面接触。
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公开(公告)号：US20100165525A1
公开(公告)日：2010-07-01
申请号：US12720110
申请日：2010-03-09
申请人： Joseph C. Fjelstad , Kevin P. Grundy , Para K. Segaram , William F. Wiedemann , Thomas J. Obenhuber , Inessa Obenhuber
发明人： Joseph C. Fjelstad , Kevin P. Grundy , Para K. Segaram , William F. Wiedemann , Thomas J. Obenhuber , Inessa Obenhuber
CPC分类号： H01C7/003 , H01C13/02 , H01G4/33 , H01L23/49816 , H01L23/49822 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48235 , H01L2224/49109 , H01L2924/00014 , H01L2924/01078 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H05K1/0231 , H05K1/0233 , H05K1/0234 , H05K1/0246 , H05K1/186 , H05K3/4602 , H05K2201/09536 , H05K2201/10643 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Disclosed are low profile discrete electronic component structures that are suitable for placement and use in a vertical interconnection mode either within an electronic interconnection substrate, between interconnection substrate and electronic component or within an IC package.
摘要翻译： 公开了适用于在电子互连衬底内，互连衬底和电子部件之间或IC封装内的垂直互连模式下放置和使用的薄型离散电子部件结构。
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