摘要:
A system including at least one system microphone, a processor connected to computer readable memory and the at least one system microphone, a measurement microphone connected to the processor, at least one audio speaker, a signal generator connected to the processor and configured to produce signals from the at least one audio speaker for both the measurement microphone and the at least one system microphone to measure the response of the at least one audio speaker, and a device manager application executable from the computer readable memory and configured to perform the steps of calibrating the at least one audio speaker with the measurement microphone using the signals of the signal generator based on the response of the at least one audio speaker thereby creating at least one calibrated audio speaker and calibrating the at least one system microphone with the at least one calibrated audio speaker using the signals of the signal generator.
摘要:
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical testing equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical testing are completed. After burn-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.
摘要:
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical testing equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical testing are completed. After burn-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.
摘要:
A semiconductor component includes a thinned semiconductor substrate having a back side and a circuit side containing integrated circuits and associated circuitry. The semiconductor component also includes at least one lasered feature on the back side configured to provide selected electrical or physical characteristics for the substrate. The lasered feature can cover the entire back side or only selected areas of the back side, and can be configured to change electrical properties, mechanical properties or gettering properties of the substrate.
摘要:
A method for fabricating semiconductor components includes the steps of providing a semiconductor substrate having a circuit side, a back side and integrated circuits and circuitry on the circuit side; thinning the substrate from the back side to a selected thickness; laser processing the back side of the thinned substrate to form at least one lasered feature on the back side; and dicing the substrate into a plurality of components having the lasered feature. The lasered feature can cover the entire back side or only selected areas of the back side, and can be configured to change electrical properties, mechanical properties or gettering properties of the substrate. A semiconductor component includes a thinned semiconductor substrate having a back side and a circuit side containing integrated circuits and associated circuitry. The semiconductor component also includes at least one lasered feature on the back side configured to provide selected electrical or physical characteristics for the substrate.
摘要:
Methods and systems for rendering three dimensional graphical data by intercepting a three dimensional graphics stream comprising three dimensional graphics commands generated by an application executing on a first computing machine, and then analyzing the characteristics associated with a remoting system to determine a location for rendering three dimensional data from the three dimensional graphics commands. The remoting system may comprise at least the first computing machine having a graphics rendering component, a second computing machine having a graphics rendering component and a network. Based on the analysis, a rendering location is determined and the application is induced to reinitialize a context for determining where to render three dimensional data. The three dimensional data is then rendered from the three dimensional graphics commands at the rendering location.
摘要:
Methods and systems for providing three dimensional graphics to remote computing machines and appliances that include an agent executing on a local computing machine to intercept a plurality of graphics commands generated by a three dimensional application executing on a local computing machine. A first portion of the plurality of graphics commands are encoded by the agent using a first codec, while a second portion of the plurality of graphics commands are encoded by the agent using a second codec. The agent creates a frame comprising the first portion and the second portion of the plurality of graphics commands, compresses the frame, and transmits the frame to a remote computing machine.
摘要:
Methods and systems for improving resource utilization when remoting three dimensional graphics commands that are generated by an application executing on a local computing machine. An agent that executes on a local computing machine intercepts a first call to a drawing library. The application generates this first call to request information from the drawing library. The agent further transmits a first frame that is generated by the application, to a remote computing machine, and prevents a return of the first call to the requesting application until the agent receives a notification indicating either the first frame was transmitted to the remote computing device or the first frame was rendered. Upon receiving such a notification, the agent permits the return of the first call to the requesting application.
摘要:
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical testing equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical testing are completed. After burn-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.
摘要:
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical testing equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical testing are completed. After burn-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.