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    UNIVERSAL WAFER CARRIER FOR WAFER LEVEL DIE BURN-IN
    1.
    发明申请
    UNIVERSAL WAFER CARRIER FOR WAFER LEVEL DIE BURN-IN 失效
    通用水平滚轮加速器

    公开(公告)号：US20070285115A1

    公开(公告)日：2007-12-13

    申请号：US11841566

    申请日：2007-08-20

    申请人： Alan Wood ,  Tim Corbett ,  Warren Farnworth

    发明人： Alan Wood ,  Tim Corbett ,  Warren Farnworth

    IPC分类号： G01R31/02 ,  G01R1/06

    CPC分类号： G01R31/2863

    摘要： A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical testing equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical testing are completed. After burn-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.

    摘要翻译： 用于测试半导体晶片上的无引脚骰子的可重复使用的老化/测试夹具由两半组成。 测试夹具的前半部分是用于接收晶片的晶片腔板，第二半部分在晶片和电气测试设备之间建立电气连通。 刚性基板在其上具有与晶片电接触的导体。 在老化和电气测试完成之前，测试夹具不需要打开。 在老化应力和电气测试之后，可以将单个裸片或单独的封装裸片与封装裸片之间建立互为独立部件，阵列或簇的互连，或者作为单个部分或阵列。

    Pipe
    8.
    发明授权
    Pipe 有权

    公开(公告)号：US10107421B2

    公开(公告)日：2018-10-23

    申请号：US13983598

    申请日：2012-02-07

    申请人： Alan Wood ,  Horst Sandner

    发明人： Alan Wood ,  Horst Sandner

    IPC分类号： F16L9/12 ,  B29C71/00 ,  C08J5/00 ,  F16L11/06 ,  E21B17/01 ,  B29C47/00 ,  B29C47/90 ,  B29C71/02 ,  B29K71/00 ,  B29C47/88

    摘要： A polyetheretherketone pipe of length greater than 250 meters and a residual stress of less than 5 MPa may be made using a calibrator device (2) which includes a cone shaped opening (6) arranged to receive a molten extruded pipe shaped polymer. Attached to the front member (4) is a vacuum plate (14a) and successive vacuum plates (14b-14h) are attached to one another to define an array of vacuum plates, the vacuum plates being arranged to allow a vacuum to be applied to a pipe precursor passing through opening (16). The vacuum plates (14) also include (10) temperature control means for heating or cooling the plates and therefore heating or cooling a pipe precursor passing through the openings. With a vacuum applied to opening (6, 16) and heating/cooling the plates, an extruded hot plastics pipe is inserted into calibrator (2) via opening (6) and conveyed through opening (16) in plates (14), whereupon it is urged by the vacuum against the cylindrical surface defined by plates (14) to maintain its shape and the (15) temperature of each plate is controlled to control the rate of cooling of the pipe precursor passing through. The pipe may be cooled at a relatively slow rate so that a pipe made from a relatively fast crystallizing polymer crystallizes and the crystallinity of the pipe along its extent and throughout its thickness is substantially constant.