公开(公告)号：US20100134979A1

公开(公告)日：2010-06-03

申请号：US12540880

申请日：2009-08-13

申请人： Yoshiko Obiraki ,  Seiji Oka ,  Takeshi Oi

发明人： Yoshiko Obiraki ,  Seiji Oka ,  Takeshi Oi

IPC分类号： H05K7/20 ,  H01R9/00

CPC分类号： H01L23/3735 ,  H01L23/4334 ,  H01L23/49811 ,  H01L25/072 ,  H01L25/115 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/30107 ,  H02M7/003 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A power semiconductor apparatus has: plural power semiconductor units, sealed by a transfer mold resin so that insertion holes of conductive tubular sockets in which plural external terminals can be insertion-connected are exposed in one surface thereof and a metal heat dissipation surface is exposed in another surface thereof; and a conductive connecting member having the plural external terminals. The surfaces of the power semiconductor units that have the insertion holes of tubular sockets are arrayed in the same direction in the plural power semiconductor units. Electrical wiring connection between the plural power semiconductor units is effected by inserting the external terminals of the conductive connecting member into the respective insertion holes of the tubular sockets of the plural power semiconductor units.

摘要翻译： 功率半导体装置具有：多个功率半导体单元，其由转移树脂密封，使得能够插入多个外部端子的导电管状插座的插入孔在其一个表面露出，金属散热面露出 其另一表面; 以及具有多个外部端子的导电连接构件。 具有管状插座的插入孔的功率半导体单元的表面在多个功率半导体单元中以相同的方向排列。 通过将导电连接构件的外部端子插入到多个功率半导体单元的管状插座的各个插入孔中，实现多个功率半导体单元之间的电连接。

公开(公告)号：US20100133667A1

公开(公告)日：2010-06-03

申请号：US12564560

申请日：2009-09-22

申请人： Seiji OKA ,  Yoshiko OBIRAKI ,  Takeshi OI

发明人： Seiji OKA ,  Yoshiko OBIRAKI ,  Takeshi OI

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/49531 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/141 ,  H05K1/145 ,  H05K3/202 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A wiring process between the provided power semiconductor module and the external circuit is simple. In the power semiconductor module, a power semiconductor element and a cylindrical conductor are joined to one surface of a lead frame. An opening of the cylindrical conductor is exposed at a surface of transfer molding resin. Sealing with the transfer molding resin is performed such that terminal portions of the lead frame protrude from peripheral side portions of the transfer molding resin. The cylindrical conductor is conductive with a control circuit. The terminal portions of the lead frame are each conductive with a main circuit.

摘要翻译： 所提供的功率半导体模块和外部电路之间的布线处理简单。 在功率半导体模块中，功率半导体元件和圆柱形导体接合到引线框架的一个表面。 圆柱形导体的开口在传递模塑树脂的表面露出。 进行与传递模塑树脂的密封，使得引线框架的端子部分从传递模塑树脂的周边部分突出。 圆柱形导体与控制电路导通。 引线框架的端子部分都用主电路导电。

公开(公告)号：US08866353B2

公开(公告)日：2014-10-21

申请号：US13519332

申请日：2011-01-20

申请人： Yoshihiro Miyama ,  Moriyuki Hazeyama ,  Masaya Inoue ,  Yoshiko Obiraki ,  Tatsuya Kitamura

发明人： Yoshihiro Miyama ,  Moriyuki Hazeyama ,  Masaya Inoue ,  Yoshiko Obiraki ,  Tatsuya Kitamura

IPC分类号： H02K9/06 ,  H02K9/10 ,  H02K9/22 ,  H02K11/00 ,  H02K5/18 ,  H02K5/20 ,  H02K1/27 ,  H02K1/32

CPC分类号： H02K5/18 ,  H02K1/2786 ,  H02K1/32 ,  H02K5/20 ,  H02K9/06 ,  H02K11/33

摘要： A first inverter ventilation aperture is disposed so as to pass through a portion of a fin base that faces a bearing, a first rotor ventilation aperture is disposed so as to pass through a portion of a bottom surface portion that faces the bearing, and a first cooling airflow ventilation channel is formed in which a cooling airflow flows radially inward through radiating fins, then flows toward a first surface side of a mount portion through the first inverter ventilation aperture, flows axially through an interior portion of a stator core, and then flows out between the bottom surface portion and a base portion through the first rotor ventilation aperture, and subsequently flows radially outward between the bottom surface portion and the base portion due to rotational driving of a centrifugal fan.

摘要翻译： 第一逆变器通风孔设置成穿过与轴承相对的翅片基部的一部分，第一转子通风孔设置成穿过面向轴承的底面部的一部分， 形成冷却空气流通通道，其中冷却气流径向向内流过散热片，然后通过第一逆变通风孔向安装部分的第一表面侧流动，轴向流过定子芯的内部，然后流动 通过第一转子通风孔在底面部分和基部之间出来，并且随后由于离心风扇的旋转驱动而在底面部分和基部之间径向向外流动。

公开(公告)号：US08823151B2

公开(公告)日：2014-09-02

申请号：US13150716

申请日：2011-06-01

申请人： Yoshihiro Yamaguchi ,  Yoshiko Obiraki

发明人： Yoshihiro Yamaguchi ,  Yoshiko Obiraki

IPC分类号： H01L23/50 ,  H01L23/34 ,  H01L23/00 ,  H01L25/07 ,  H01L23/367

CPC分类号： H01L23/49575 ,  H01L23/34 ,  H01L23/367 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/0603 ,  H01L2224/29139 ,  H01L2224/32245 ,  H01L2224/37012 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40475 ,  H01L2224/45124 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10254 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1203 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/37099

摘要： An object is to provide a semiconductor device having a plate electrode adapted to a plurality of chips, capable of being produced at low cost, and having high heat cycle property. A semiconductor device according to the present invention includes a plurality of semiconductor chips formed on a substrate, and a plate electrode connecting electrodes of the plurality of semiconductor chips. The plate electrode has half-cut portions formed by half-pressing and the raised sides of the half-cut portions are bonded with the electrodes of the semiconductor chips.

摘要翻译： 本发明的目的是提供一种半导体器件，其具有能够以低成本制造并具有高热循环特性的多个芯片的板状电极。 根据本发明的半导体器件包括形成在基板上的多个半导体芯片和连接多个半导体芯片的电极的平板电极。 平板电极具有通过半按压形成的半切部，半切部的凸起侧与半导体芯片的电极接合。

公开(公告)号：US08610261B2

公开(公告)日：2013-12-17

申请号：US12582246

申请日：2009-10-20

申请人： Seiji Oka ,  Yoshiko Obiraki ,  Takeshi Oi

发明人： Seiji Oka ,  Yoshiko Obiraki ,  Takeshi Oi

IPC分类号： H01L23/48

CPC分类号： H01L23/3735 ,  H01L23/041 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/072 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power semiconductor device includes a power semiconductor module having cylindrical conductors which are joined to a wiring pattern so as to be substantially perpendicular to the wiring pattern and whose openings are exposed at a surface of transfer molding resin, and an insert case having a ceiling portion and peripheral walls, the ceiling portion being provided with external terminals that are fitted into, and passed through, the ceiling portion, the external terminals having outer-surface-side connecting portions at the outer surface side of the ceiling portion and inner-surface-side connecting portions at the inner surface side of the ceiling portion. The power semiconductor module is set within the insert case such that the inner-surface-side connecting portions of the external terminals are inserted into the cylindrical conductors.

摘要翻译： 功率半导体器件包括功率半导体模块，该功率半导体模块具有圆柱形导体，其连接到布线图案，以便基本上垂直于布线图案，并且其开口在传输模塑树脂的表面处露出;以及插入壳体，其具有顶部 以及周壁，所述顶部设置有外部端子，所述外部端子嵌入并通过所述顶部，所述外部端子在所述顶部的外表面侧具有外表面侧连接部， 在顶棚部分的内表面侧的侧连接部分。 功率半导体模块设置在插入壳体内，使得外部端子的内表面侧连接部分插入圆柱形导体中。

公开(公告)号：US20160172995A1

公开(公告)日：2016-06-16

申请号：US14992762

申请日：2016-01-11

申请人： Yoshiko Obiraki ,  Yasushi Nakayama ,  Yuji Miyazaki ,  Hiroshi Nakatake

发明人： Yoshiko Obiraki ,  Yasushi Nakayama ,  Yuji Miyazaki ,  Hiroshi Nakatake

IPC分类号： H02M7/00 ,  H05K5/00 ,  H05K7/20

CPC分类号： H02M7/003 ,  H01L23/49811 ,  H01L23/49844 ,  H01L23/5385 ,  H01L25/072 ,  H01L25/162 ,  H01L25/18 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19107 ,  H01L2924/30107 ,  H02M7/537 ,  H05K5/0021 ,  H05K5/0065 ,  H05K7/2039 ,  H01L2924/00014 ,  H01L2924/00

摘要： A power semiconductor module capable of reducing variation of inductance between upper/lower arms and reducing variation of current caused by the variation of inductance. The power semiconductor module includes circuit blocks (upper/lower arms) each of which is configured by connecting self-arc-extinguishing type semiconductor elements in series; first and second positive electrode terminals, first and second negative electrode terminals, and first and second AC terminals. Further, there are first and second wiring patterns that connect the self-arc-extinguishing type semiconductor elements to the DC and AC terminals. The outline of the power semiconductor module has a substantially quadrangular surface.

摘要翻译： 一种功率半导体模块，能够减少上臂/下臂之间的电感变化，并减少由电感变化引起的电流变化。 功率半导体模块包括通过串联连接自灭弧型半导体元件而构成的电路块（上/下臂） 第一和第二正极端子，第一和第二负极端子以及第一和第二AC端子。 此外，存在将自灭弧型半导体元件连接到DC和AC端子的第一和第二布线图案。 功率半导体模块的轮廓具有大致四边形的表面。

公开(公告)号：US20120299407A1

公开(公告)日：2012-11-29

申请号：US13519332

申请日：2011-01-20

申请人： Yoshihiro Miyama ,  Moriyuki Hazeyama ,  Masaya Inoue ,  Yoshiko Obiraki ,  Tatsuya Kitamura

发明人： Yoshihiro Miyama ,  Moriyuki Hazeyama ,  Masaya Inoue ,  Yoshiko Obiraki ,  Tatsuya Kitamura

IPC分类号： H02K9/06

CPC分类号： H02K5/18 ,  H02K1/2786 ,  H02K1/32 ,  H02K5/20 ,  H02K9/06 ,  H02K11/33

摘要： A first inverter ventilation aperture is disposed so as to pass through a portion of a fin base that faces a bearing, a first rotor ventilation aperture is disposed so as to pass through a portion of a bottom surface portion that faces the bearing, and a first cooling airflow ventilation channel is formed in which a cooling airflow flows radially inward through radiating fins, then flows toward a first surface side of a mount portion through the first inverter ventilation aperture, flows axially through an interior portion of a stator core, and then flows out between the bottom surface portion and a base portion through the first rotor ventilation aperture, and subsequently flows radially outward between the bottom surface portion and the base portion due to rotational driving of a centrifugal fan.

摘要翻译： 第一逆变器通风孔设置成穿过与轴承相对的翅片基部的一部分，第一转子通风孔设置成穿过面向轴承的底面部的一部分， 形成冷却空气流通通道，其中冷却气流径向向内流过散热片，然后通过第一逆变通风孔向安装部分的第一表面侧流动，轴向流过定子芯的内部，然后流动 通过第一转子通风孔在底面部分和基部之间出来，并且随后由于离心风扇的旋转驱动而在底面部分和基部之间径向向外流动。

公开(公告)号：US08299601B2

公开(公告)日：2012-10-30

申请号：US12535222

申请日：2009-08-04

申请人： Seiji Oka ,  Yoshiko Obiraki ,  Takeshi Oi

发明人： Seiji Oka ,  Yoshiko Obiraki ,  Takeshi Oi

IPC分类号： H01L23/48

CPC分类号： H01L23/3735 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/4006 ,  H01L23/4334 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01068 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015

摘要： A power semiconductor module includes: a circuit board having a metal base plate, a high thermal conductive insulating layer, and a wiring pattern; power semiconductor elements electrically connected to the wiring pattern; tubular external terminal connection bodies provided to the wiring pattern for external terminals; and a transfer mold resin body encapsulated to expose through-holes in the metal base plate and used to fixedly attach cooling fins to the face of the metal base plate on the other side with attachment members, the face of the metal base plate on the other side, and top portions of the tubular external terminal connection bodies, to form insertion holes for the attachment members communicating with the through-holes and having a larger diameter than the through-holes, and to cover the one side and side faces of the metal base plate and the power semiconductor elements.

摘要翻译： 功率半导体模块包括：具有金属基板，高导热绝缘层和布线图案的电路板; 电连接到所述布线图案的功率半导体元件; 提供给外部端子的布线图案的管状外部端子连接体; 以及转印模塑树脂体，其被封装以暴露在金属基板中的通孔，并用于将冷却翅片固定地附接到具有附接构件的另一侧上的金属基板的表面，金属基板的另一面 侧面和顶部，以形成用于与通孔连通并且具有比通孔更大的直径的附接构件的插入孔，并且覆盖金属的一侧和侧面 基板和功率半导体元件。

公开(公告)号：US20100133684A1

公开(公告)日：2010-06-03

申请号：US12535222

申请日：2009-08-04

申请人： Seiji OKA ,  Yoshiko Obiraki ,  Takeshi Oi

发明人： Seiji OKA ,  Yoshiko Obiraki ,  Takeshi Oi

IPC分类号： H01L23/34 ,  H01L21/56

CPC分类号： H01L23/3735 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/4006 ,  H01L23/4334 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01068 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015

摘要： A power semiconductor module includes: a circuit board having a metal base plate, a high thermal conductive insulating layer, and a wiring pattern; power semiconductor elements electrically connected to the wiring pattern; tubular external terminal connection bodies provided to the wiring pattern for external terminals; and a transfer mold resin body encapsulated to expose through-holes in the metal base plate and used to fixedly attach cooling fins to the face of the metal base plate on the other side with attachment members, the face of the metal base plate on the other side, and top portions of the tubular external terminal connection bodies, to form insertion holes for the attachment members communicating with the through-holes and having a larger diameter than the through-holes, and to cover the one side and side faces of the metal base plate and the power semiconductor elements.

摘要翻译： 功率半导体模块包括：具有金属基板，高导热绝缘层和布线图案的电路板; 电连接到所述布线图案的功率半导体元件; 提供给外部端子的布线图案的管状外部端子连接体; 以及转印模塑树脂体，其被封装以暴露在金属基板中的通孔，并用于将冷却翅片固定地附接到具有附接构件的另一侧上的金属基板的表面，金属基板的另一面 侧面和顶部，以形成用于与通孔连通并且具有比通孔更大的直径的附接构件的插入孔，并且覆盖金属的一侧和侧面 基板和功率半导体元件。

公开(公告)号：US20100133681A1

公开(公告)日：2010-06-03

申请号：US12582246

申请日：2009-10-20

申请人： Seiji OKA ,  Yoshiko OBIRAKI ,  Takeshi OI

发明人： Seiji OKA ,  Yoshiko OBIRAKI ,  Takeshi OI

IPC分类号： H01L23/538

CPC分类号： H01L23/3735 ,  H01L23/041 ,  H01L23/3121 ,  H01L23/49811 ,  H01L24/48 ,  H01L25/072 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power semiconductor device includes a power semiconductor module having cylindrical conductors which are joined to a wiring pattern so as to be substantially perpendicular to the wiring pattern and whose openings are exposed at a surface of transfer molding resin, and an insert case having a ceiling portion and peripheral walls, the ceiling portion being provided with external terminals that are fitted into, and passed through, the ceiling portion, the external terminals having outer-surface-side connecting portions at the outer surface side of the ceiling portion and inner-surface-side connecting portions at the inner surface side of the ceiling portion. The power semiconductor module is set within the insert case such that the inner-surface-side connecting portions of the external terminals are inserted into the cylindrical conductors.

摘要翻译： 功率半导体器件包括功率半导体模块，该功率半导体模块具有圆柱形导体，其连接到布线图案，以便基本上垂直于布线图案，并且其开口在传输模塑树脂的表面处露出;以及插入壳体，其具有顶部 以及周壁，所述顶部设置有外部端子，所述外部端子嵌入并通过所述顶部，所述外部端子在所述顶部的外表面侧具有外表面侧连接部， 在顶棚部分的内表面侧的侧连接部分。 功率半导体模块设置在插入壳体内，使得外部端子的内表面侧连接部分插入圆柱形导体中。