Optoelectronic Semiconductor Chip
    1.
    发明申请
    Optoelectronic Semiconductor Chip 有权
    光电半导体芯片

    公开(公告)号:US20130028281A1

    公开(公告)日:2013-01-31

    申请号:US13262583

    申请日:2010-03-10

    IPC分类号: H01L33/02 H01S5/34

    摘要: In at least one embodiment of the optoelectronic semiconductor chip (1), the latter is based on a nitride material system and comprises at least one active quantum well (2). The at least one active quantum well (2) is designed to generate electromagnetic radiation when in operation. Furthermore, the at least one active quantum well (2) comprises N successive zones (A) in a direction parallel to a growth direction z of the semiconductor chip (1), N being a natural number greater than or equal to 2. At least two of the zones (A) of the active quantum well (2) have mutually different average indium contents c. Furthermore the at least one active quantum well (2) fulfils the condition: 40≦∫c(z)dz−2.5N−1.5∫dz≦80

    摘要翻译: 在光电子半导体芯片(1)的至少一个实施例中,后者基于氮化物材料系统并且包括至少一个有源量子阱(2)。 至少一个有源量子阱(2)被设计成在操作时产生电磁辐射。 此外,至少一个有源量子阱(2)在平行于半导体芯片(1)的生长方向z的方向上包括N个连续区域(A),N是大于或等于2的自然数。至少 有源量子阱(2)的两个区域(A)具有相互不同的平均铟含量c。 此外,至少一个有源量子阱(2)满足条件:40≦̸∫c(z)dz-2.5N-1.5∫dz≦̸ 80

    Composite substrate, and method for the production of a composite substrate
    9.
    发明授权
    Composite substrate, and method for the production of a composite substrate 有权
    复合基板,以及复合基板的制造方法

    公开(公告)号:US08502264B2

    公开(公告)日:2013-08-06

    申请号:US12298723

    申请日:2007-04-20

    IPC分类号: H01L33/02

    摘要: A composite substrate (1) comprising a substrate body (2) and a utility layer (31) fixed on the substrate body (2). A planarization layer (4) is arranged between the utility layer (31) and the substrate body (2). A method for producing a composite substrate (1) applies a planarization layer (4) on a provided utility substrate (3). The utility substrate (3) is fixed on a substrate body (2) for the composite substrate (1). The utility substrate (3) is subsequently separated, wherein a utility layer (31) of the utility substrate (3) remains for the composite substrate (1) on the substrate body (2).

    摘要翻译: 一种复合基板(1),其包括固定在所述基板主体(2)上的基板主体(2)和有效层(31)。 在实用层(31)和基板主体(2)之间布置有平坦化层(4)。 复合基板(1)的制造方法在设置的实用基板(3)上涂敷平坦化层(4)。 该实用基板(3)固定在复合基板(1)的基板主体(2)上。 随后分离实用基板(3),其中保留用于基板主体(2)上的复合基板(1)的效用基板(3)的有用层(31)。