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    Method of protecting integrated circuits
    3.
    发明授权
    Method of protecting integrated circuits 有权
    保护集成电路的方法

    公开(公告)号：US08026599B2

    公开(公告)日：2011-09-27

    申请号：US11517131

    申请日：2006-09-07

    申请人： Alan O'Donnell

    发明人： Alan O'Donnell

    IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

    CPC分类号： H01L23/552 ,  H01L21/56 ,  H01L23/3114 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present application relates to the manufacture of Wafer Level Chip Scale Packages (WLCSPs), which are a type of CSP in which the traditional wire bonding arrangements are dispensed with in favor of making direct contact by means of conductive bumps (typically solder balls) to the integrated circuitry. WLCSPs differ from fine pitch Ball Grid Array (BGA) and leadframe based Chip Scale Packages (CSPs) in that most of the packaging process steps are performed at wafer level. A package and method of manufacture are provided which prevent the ingress of light to the internal circuitry of WLCSP packages by providing a substantially opaque coating on the inactive side of the WLCSP packages and at least partially on the sides of WLCSP packages.

    摘要翻译： 本申请涉及晶片级芯片尺寸封装（WLCSP）的制造，这是一种CSP型，其中传统的引线键合装置被省去，有利于通过导电凸块（通常是焊球）直接接触到 集成电路。 WLCSPs与细间距球栅阵列（BGA）和基于引线框架的芯片尺寸封装（CSP）不同，因为大多数封装工艺步骤在晶圆级执行。 提供了一种封装和制造方法，其通过在WLCSP封装的不活动侧提供基本上不透明的涂层并且至少部分地在WLCSP封装的侧面上来防止光进入WLCSP封装的内部电路。

    Method of protecting integrated circuits
    4.
    发明申请
    Method of protecting integrated circuits 有权
    保护集成电路的方法

    公开(公告)号：US20080064137A1

    公开(公告)日：2008-03-13

    申请号：US11517131

    申请日：2006-09-07

    申请人： Alan O'Donnell

    发明人： Alan O'Donnell

    IPC分类号： H01L21/00

    CPC分类号： H01L23/552 ,  H01L21/56 ,  H01L23/3114 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present application relates to the manufacture of Wafer Level Chip Scale Packages (WLCSPs), which are a type of CSP in which the traditional wire bonding arrangements are dispensed with in favour of making direct contact by means of conductive bumps (typically solder balls) to the integrated circuitry. WLCSPs differ from fine pitch Ball Grid Array (BGA) and leadframe based Chip Scale Packages (CSPs) in that most of the packaging process steps are performed at wafer level. A package and method of manufacture are provided which prevent the ingress of light to the internal circuitry of WLCSP packages by providing a substantially opaque coating on the inactive side of the WLCSP packages and at least partially on the sides of WLCSP packages.

    摘要翻译： 本申请涉及晶片级芯片尺寸封装（WLCSP）的制造，这是一种CSP型，其中传统的引线键合装置被省去，有利于通过导电凸块（通常是焊球）直接接触到 集成电路。 WLCSPs与细间距球栅阵列（BGA）和基于引线框架的芯片尺寸封装（CSP）不同，因为大多数封装工艺步骤在晶圆级执行。 提供了一种封装和制造方法，其通过在WLCSP封装的不活动侧提供基本上不透明的涂层并且至少部分地在WLCSP封装的侧面上来防止光进入WLCSP封装的内部电路。