Radiation emitting semiconductor device
    8.
    发明申请
    Radiation emitting semiconductor device 有权
    辐射发射半导体器件

    公开(公告)号:US20050003565A1

    公开(公告)日:2005-01-06

    申请号:US10837828

    申请日:2004-05-03

    摘要: Radiation-emitting semiconductor device, method for fabricating same and radiation-emitting optical device. A radiation-emitting semiconductor device with a multilayer structure (100) comprising a radiation-emitting active layer (10), with electrical contacts (30, 40) for impressing a current in the multilayer structure (100) and with a radiotransparent window layer (20). The window layer is arranged exclusively on the side of the multilayer structure (100) facing away from a main direction of radiation of the semiconductor device and has at least one side wall that includes a first side wall portion (20a) which extends obliquely, concavely or in a stepwise manner toward a central axis of the semiconductor device lying perpendicular to the multilayer sequence. In its subsequent extension toward the back side, viewed from the multilayer structure, the side wall changes over into a second side wall portion (20b) that extends perpendicularly to the multilayer structure, that is, parallel to the central axis, and the portion of the window layer (20) encompassing the second side wall portion (20b) forms a mounting pedestal for the semiconductor device. The first and second side wall portions are fabricated especially preferably by means of a saw blade having a shaped edge. In a preferred optical device, the semiconductor device is mounted window layer downward in a reflector cup.

    摘要翻译: 辐射发射半导体器件,其制造方法和发射光学器件。 一种具有多层结构(100)的辐射发射半导体器件(100),包括辐射发射有源层(10),具有用于在多层结构(100)中施加电流的电触点(30,40)以及无线电透过窗口层 20)。 窗层仅排列在背离半导体器件的主辐射方向的多层结构(100)的侧面上,并具有至少一个侧壁,该侧壁包括第一侧壁部分(20a),该第一侧壁部分倾斜地, 或者以逐步的方式朝向垂直于多层序列的半导体器件的中心轴线。 在从多层结构观察的随后的向后延伸的过程中,侧壁转变成垂直于多层结构延伸的第二侧壁部分(20b),即平行于中心轴线的部分 包围第二侧壁部分(20b)的窗口层(20)形成用于半导体器件的安装基座。 第一和第二侧壁部分特别优选地通过具有成形边缘的锯片来制造。 在优选的光学器件中,半导体器件将窗口层向下安装在反射杯中。

    Electromagnetic radiation generating semiconductor chip and method for making same
    9.
    发明授权
    Electromagnetic radiation generating semiconductor chip and method for making same 有权
    电磁辐射生成半导体芯片及其制造方法

    公开(公告)号:US08330175B2

    公开(公告)日:2012-12-11

    申请号:US11154292

    申请日:2005-06-16

    IPC分类号: H01L33/22

    摘要: An electromagnetic radiation generating semiconductor chip is disclosed. A semiconductor layer sequence suitable for generating electromagnetic radiation is grown on a first main face of a radioparent, electrically conductive growth substrate, for example, a SiC growth substrate. Provided on a second main face of said growth substrate that faces away from said semiconductor layer sequence is a roughening that acts as a diffuser for an electromagnetic radiation emitted into said growth substrate by said semiconductor layer sequence and that in particular has a scattering factor higher than 0.25. A layer or layer sequence reflective of the electromagnetic radiation is applied to said roughening. A method for making the semiconductor chip is also disclosed.

    摘要翻译: 公开了电磁辐射生成半导体芯片。 适用于产生电磁辐射的半导体层序列生长在放射性,导电的生长衬底(例如SiC生长衬底)的第一主面上。 提供在所述生长衬底的远离所述半导体层序列的第二主面上是粗糙化,其作为用于通过所述半导体层序列发射到所述生长衬底中的电磁辐射的扩散器,并且特别地具有高于 0.25。 将反射电磁辐射的层序列应用于所述粗糙化。 还公开了制造半导体芯片的方法。