Semiconductor device using composition for anisotropic conductive adhesive film or anisotropic conductive adhesive film
    9.
    发明授权
    Semiconductor device using composition for anisotropic conductive adhesive film or anisotropic conductive adhesive film 有权
    使用各向异性导电粘合膜或各向异性导电粘合膜的组合物的半导体器件

    公开(公告)号:US09534154B2

    公开(公告)日:2017-01-03

    申请号:US13724219

    申请日:2012-12-21

    摘要: An electronic device includes an anisotropic conductive adhesive film as a connection material, wherein the anisotropic conductive adhesive film has a flowability of 50% or more after preliminary pressing at 80° C. and 1 MPa for 1 second and final pressing at 180° C. and 3 MPa for 5 seconds, and a connection resistance increment greater than 0% but not greater than 25%, as calculated by Expression 1: Connection resistance increment (%)=|(A−B)/A|×100  (Expression 1) where A is a connection resistance measured after preliminary pressing at 80° C. and 1 MPa for 1 second and final pressing at 180° C. and 3 MPa for 5 seconds, and B is a connection resistance measured after reliability evaluation at a temperature of 85° C. and a humidity of 85% for 250 hours following preliminary pressing and final pressing.

    摘要翻译: 电子装置包括作为连接材料的各向异性导电粘合膜,其中各向异性导电粘合膜在80℃和1MPa预压1秒后的流动性为50%以上,最终在180℃下压制。 和3MPa 5秒,连接电阻增量大于0%但不大于25%,如式1所示:连接电阻增量(%)=(AB)/ A×100(表达式1)其中A为 在80℃,1MPa,1秒预压,180℃,3MPa,5秒的最后压制后测定的连接电阻,B为在85℃的温度下进行可靠性评价后测定的连接电阻 在预压和最终压制后250小时的湿度为85%。