公开(公告)号：US5609721A

公开(公告)日：1997-03-11

申请号：US367828

申请日：1995-01-03

申请人： Atsuhiro Tsukune ,  Kiyokatsu Suzuki ,  Katsuyoshi Matsuura ,  Fumitake Mieno ,  Hirokazu Yamanishi

发明人： Atsuhiro Tsukune ,  Kiyokatsu Suzuki ,  Katsuyoshi Matsuura ,  Fumitake Mieno ,  Hirokazu Yamanishi

IPC分类号： C23C16/44 ,  C23C16/455 ,  H01L21/00 ,  C23C16/00

CPC分类号： C23C16/45561 ,  C23C16/4405 ,  C23C16/4412 ,  C23C16/455 ,  H01L21/67028 ,  Y10S438/905

摘要： An apparatus and method for manufacturing a semiconductor device includes a reaction chamber adapted to exhaust gas therefrom, and a cleaning gas supplying system for introducing cleaning gas containing ClF.sub.3 into the reaction chamber, the system having a plurality of gas blowout holes formed in the flow direction of gas at least in the reaction chamber. The reaction chamber may be a tubular chamber, and the cleaning gas supplying system may be a tube extending from one end to the other end of the reaction chamber along the inner wall or the central axis of the reaction chamber, a plurality of through holes being formed in the side wall of the tube. Damages to the inner surface of the reaction chamber of the semiconductor device manufacturing apparatus can be suppressed and a film attached to the inner wall of the reaction chamber can be removed in a short time.

摘要翻译： 一种用于制造半导体器件的设备和方法，包括适于从其中排出的反应室和用于将含有ClF 3的清洁气体引入反应室的清洁气体供给系统，该系统具有沿流动方向形成的多个气体吹出孔 至少在反应室中。 反应室可以是管状室，并且清洁气体供应系统可以是沿着反应室的内壁或中心轴线从反应室的一端延伸到另一端的管，多个通孔是 形成在管的侧壁中。 能够抑制对半导体装置制造装置的反应室内表面的损伤，能够在短时间内除去附着于反应室内壁的膜。

公开(公告)号：US08997337B2

公开(公告)日：2015-04-07

申请号：US12882255

申请日：2010-09-15

申请人： Shunsuke Sone ,  Hirokazu Yamanishi

发明人： Shunsuke Sone ,  Hirokazu Yamanishi

IPC分类号： H01R43/18 ,  H01R12/71 ,  H01R12/58

CPC分类号： H01R43/18 ,  H01R12/585 ,  H01R12/716 ,  Y10T29/49004 ,  Y10T29/51 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183

摘要： A manufacturing apparatus for an electronic component includes a plurality of press members provided with a pair of arm sections extending in one direction intersecting with a direction of the pressing, the plurality of press members contacting a housing of a connector and pressing a plurality of pins held by the housing toward a plurality of holes in a substrate, a drive unit pressing the press members and press-fitting the plurality of pins into the holes in the substrate, a stress measurement unit coupled with the pair of arm sections and adapted to measure a stress generated at the pair of arm sections when the pins are pressed toward the holes in the substrate, and a drive control unit controlling a press force of the drive unit in accordance with a measurement result of the stress measurement unit.

摘要翻译： 一种用于电子部件的制造装置，包括多个按压部件，所述多个按压部件设置有一对臂部，所述一对臂部在与所述按压方向相交的一个方向上延伸，所述多个按压部件与连接器的壳体接触并按压多个销 通过所述壳体朝向基板中的多个孔，驱动单元，所述驱动单元按压所述按压构件并将所述多个销压配合到所述基板中的孔中;应力测量单元，与所述一对臂部联接，并且适于测量 当所述销被按压到所述基板中的孔时，在所述一对臂部分产生的应力;以及驱动控制单元，其根据所述应力测量单元的测量结果来控制所述驱动单元的按压力。

公开(公告)号：US20070135018A1

公开(公告)日：2007-06-14

申请号：US11367367

申请日：2006-03-06

申请人： Shunsuke Sone ,  Hirokazu Yamanishi

发明人： Shunsuke Sone ,  Hirokazu Yamanishi

IPC分类号： B24B51/00 ,  B24B1/00 ,  B24B29/00

CPC分类号： G11B5/1871 ,  B24B37/048 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/49041

摘要： An apparatus for processing a magnetic head slider used for a magnetic disk apparatus for performing a magnetic recording/reproducing process in a discoid recording medium comprises a discoid recording medium used as an abrasive material, a holding unit configured to hold a suspension arm on which a magnetic head slider is disposed, an elevating unit configured to bring the magnetic head slider into contact with the discoid recording medium in a sliding manner by elevating and lowering the suspension arm, and a rotating unit configured to rotate the discoid recording medium at a rotation speed lower than a rotation speed upon the magnetic recording/reproducing process.

摘要翻译： 一种用于处理在盘状记录介质中执行磁记录/再现处理的磁盘装置的磁头滑块的装置包括：用作研磨材料的盘状记录介质;保持单元，其构造成将悬架臂保持在其上， 设置有磁头滑动器，升降单元，其构造成通过升降所述悬架臂使所述磁头滑块以滑动的方式与所述盘状记录介质接触;以及旋转单元，其构造成以盘旋转所述盘状记录介质 低于磁记录/再现处理时的旋转速度。

公开(公告)号：US07584532B2

公开(公告)日：2009-09-08

申请号：US11367367

申请日：2006-03-06

申请人： Shunsuke Sone ,  Hirokazu Yamanishi

发明人： Shunsuke Sone ,  Hirokazu Yamanishi

IPC分类号： G11B5/127 ,  H04R31/00

CPC分类号： G11B5/1871 ,  B24B37/048 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/49041

摘要： An apparatus for processing a magnetic head slider used for a magnetic disk apparatus for performing a magnetic recording/reproducing process in a discoid recording medium. The apparatus for processing a magnetic head slider includes a discoid recording medium used as an abrasive material, a holding unit configured to hold a suspension arm on which a magnetic head slider is disposed, an elevating unit configured to bring the magnetic head slider into contact with the discoid recording medium in a sliding manner by elevating and lowering the discoid recording medium, and a rotating unit configured to rotate the discoid recording medium at a rotation speed lower than a rotation speed upon the magnetic recording/reproducing process.

摘要翻译： 一种用于处理用于在盘状记录介质中进行磁记录/再现处理的磁盘装置的磁头滑块的装置。 用于处理磁头滑动器的装置包括用作研磨材料的盘状记录介质，保持单元，其构造成保持设置有磁头滑动器的悬架臂;升降单元，其构造成使磁头滑块与 盘状记录介质以滑动方式通过升高和降低盘状记录介质;以及旋转单元，其构造成在磁记录/再现处理时以低于旋转速度的旋转速度旋转盘状记录介质。

公开(公告)号：US20090146652A1

公开(公告)日：2009-06-11

申请号：US12292650

申请日：2008-11-24

申请人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

发明人： Norio Kainuma ,  Kenji Kobae ,  Hidehiko Kira ,  Hiroshi Kobayashi ,  Shuichi Takeuchi ,  Takayoshi Matsumura ,  Hirokazu Yamanishi ,  Shinji Hiraoka ,  Yoshiaki Yanagida

IPC分类号： G01R33/12

CPC分类号： G11B5/455 ,  G11B5/4555 ,  G11B5/6005 ,  H01R13/2421 ,  H01R2201/20

摘要： A slider tester includes a driving unit that rotates a test medium, a set plate that detachably supports a slider as a single body, and an investigating apparatus that is electrically connected to the slider supported by the set plate and investigates the characteristics of the slider. A movable support part 30 that tiltably supports the slider is provided on the set plate. There is also provided a pressing mechanism that elastically presses the slider via the movable support part toward a surface of the medium to dispose the slider floating over the surface of the medium. The pressing mechanism includes an elastic body 56 composed of a plate spring that contacts the movable support part and elastically presses the movable support part.

摘要翻译： 滑块测试器包括使测试介质旋转的驱动单元，可拆卸地支撑滑块作为单个主体的固定板，以及与由固定板支撑的滑块电连接的调查装置，并且调查滑块的特性。 在该固定板上设置有可滑动地支承滑块的可动支承部30。 还提供了一种按压机构，其通过可移动支撑部件朝向介质的表面弹性地按压滑块以将滑块设置在介质表面上。 按压机构包括弹性体56，其由与所述可动支撑部接触并弹性地按压所述可动支撑部的板簧构成。

公开(公告)号：US20060169750A1

公开(公告)日：2006-08-03

申请号：US11139789

申请日：2005-05-31

申请人： Hisao Tanaka ,  Masanao Fujii ,  Toru Okada ,  Susumu Iida ,  Hirokazu Yamanishi ,  Yutaka Noda

发明人： Hisao Tanaka ,  Masanao Fujii ,  Toru Okada ,  Susumu Iida ,  Hirokazu Yamanishi ,  Yutaka Noda

IPC分类号： B23K1/005

CPC分类号： H05K3/3478 ,  B23K1/206 ,  B23K3/0623 ,  H05K3/3442 ,  H05K2201/0382 ,  H05K2201/10727 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/0465 ,  Y02P70/613

摘要： There are provided a solder ball deforming step of mechanically deforming a ball to break an oxide film of a surface thereof and to expose a nonoxide surface and a solder melting step of heating and melting the deformed solder ball through energy irradiation in a state where the deformed solder ball is mounted on joint units of a loaded work. The solder ball deforming step mechanically deforms the solder ball to form at least two orthogonal contact surfaces in contact with the joint surfaces of the joint units.

摘要翻译： 提供了一种使球体机械变形以破坏其表面的氧化膜并且暴露非氧化物表面的焊球变形步骤和通过能量照射在变形的状态下加热和熔化变形的焊球的焊料熔化步骤 焊球安装在负载工作的接头单元上。 焊球变形步骤使焊锡球机械地变形以形成与接头单元的接合表面接触的至少两个正交的接触表面。

公开(公告)号：US08163126B2

公开(公告)日：2012-04-24

申请号：US13020312

申请日：2011-02-03

申请人： Tohru Harada ,  Kazuhisa Mishima ,  Hirokazu Yamanishi ,  Yoshiaki Yanagida

发明人： Tohru Harada ,  Kazuhisa Mishima ,  Hirokazu Yamanishi ,  Yoshiaki Yanagida

IPC分类号： B29C65/00 ,  B29C65/10 ,  B29C45/00 ,  B29C47/00 ,  B29C43/02 ,  B29C49/00 ,  B29C51/00 ,  B32B37/00 ,  B44C1/17 ,  B23K37/00 ,  B30B5/02 ,  B30B5/04 ,  B30B15/34 ,  B29D24/00 ,  B29D29/00 ,  B28B21/36 ,  B28B11/08 ,  A01J21/00 ,  A01J25/12 ,  A21C3/00 ,  A21C11/00 ,  A23G1/20 ,  A23G3/02 ,  A23P1/00 ,  B29C55/28

CPC分类号： B29C65/524 ,  B29C65/02 ,  B29C65/1406 ,  B29C65/4835 ,  B29C65/4845 ,  B29C65/7847 ,  B29C66/1122 ,  B29C66/301 ,  B29C66/342 ,  B29C66/45 ,  B29C66/81422 ,  B29C66/81423 ,  B29C66/8362 ,  B29C66/9221 ,  B29C66/9231 ,  B29C66/92431 ,  B29C66/961 ,  B29K2105/0079 ,  B29K2995/0082 ,  B29L2016/00 ,  B32B37/003 ,  B32B37/0053 ,  B32B37/12 ,  B32B37/223 ,  B32B38/1858 ,  B32B38/1866 ,  B32B2457/20 ,  G02F1/1303 ,  G02F1/133305 ,  Y10T156/1052 ,  Y10T156/17

摘要： Disclosed is a film sticking device that sticks a first film substrate and a second film substrate together on a curved-surface shape. The film sticking device includes a mold having a curved attachment surface formed into a desired curved-surface shape; an attracting and holding unit capable of relatively moving on the curved attachment surface and having plural vacuum chambers on which an attracting surface for attracting and holding the second film substrate is provided; and a suctioning unit capable of separately applying suction processing to the plural vacuum chambers. The suctioning unit starts, as the attracting and holding unit moves, the suction processing of the vacuum chamber corresponding to a position opposing the second film substrate and sequentially stops, as the second film substrate is stuck to the first film substrate, the suction processing of the vacuum chamber corresponding to the stuck second film substrate.

摘要翻译： 公开了一种胶片贴装装置，其以第一薄膜基板和第二薄膜基板一起弯曲成形。 胶片贴附装置包括具有形成为期望的曲面形状的弯曲的附接表面的模具; 能够在弯曲的安装面上相对移动并具有多个真空室的吸引保持单元，在该真空室中设置有用于吸引和保持第二膜基板的吸附面; 以及能够对多个真空室分别进行吸引处理的吸引单元。 当吸引保持单元移动时，抽吸单元开始与第二膜基板相对的位置对应的真空室的抽吸处理，并且随着第二膜基板粘贴到第一膜基板上而依次停止吸入处理 真空室对应于粘附的第二膜基底。

公开(公告)号：US20120060356A1

公开(公告)日：2012-03-15

申请号：US13225902

申请日：2011-09-06

申请人： Tohru Harada ,  Mitsuo Takeuchi ,  Hirokazu Yamanishi ,  Yoshiaki Yanagida ,  Toru Okada

发明人： Tohru Harada ,  Mitsuo Takeuchi ,  Hirokazu Yamanishi ,  Yoshiaki Yanagida ,  Toru Okada

IPC分类号： G01R31/28 ,  B23P21/00

CPC分类号： H05K13/0486 ,  H01L24/75 ,  H01L24/81 ,  Y10T29/49004 ,  Y10T29/53022

摘要： An apparatus for mounting an electronic component includes a heating head that moves relative to the electronic component placed on a printed board, inclines according to the inclination of the electronic component, comes into contact with the electronic component, and heats a joining material that joins the printed board and the electronic component; a first sensor that measures the position and the inclination of the heating head; a second sensor that measures the position and the inclination of the printed board; and, a control unit that calculates the position and the inclination of the electronic component based on a measurement result of the first sensor in a state where the heating head is in contact with the electronic component, and determines the melted state of the joining material based on the measurement result of the second sensor and the position and the inclination of the electronic component.

摘要翻译： 一种用于安装电子部件的装置包括：相对于放置在印刷电路板上的电子部件移动的加热头，根据电子部件的倾斜倾斜与电子部件接触，并加热连接到电子部件的接合材料 印刷电路板和电子元器件; 测量加热头的位置和倾斜度的第一传感器; 测量印刷板的位置和倾斜度的第二传感器; 以及控制单元，其基于在所述加热头与所述电子部件接触的状态下的所述第一传感器的测量结果来计算所述电子部件的位置和倾斜度，并且基于所述接合材料的熔融状态来确定 关于第二传感器的测量结果以及电子部件的位置和倾斜度。

公开(公告)号：US20110061225A1

公开(公告)日：2011-03-17

申请号：US12882255

申请日：2010-09-15

申请人： Shunsuke Sone ,  Hirokazu Yamanishi

发明人： Shunsuke Sone ,  Hirokazu Yamanishi

IPC分类号： H05K13/00

CPC分类号： H01R43/18 ,  H01R12/585 ,  H01R12/716 ,  Y10T29/49004 ,  Y10T29/51 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183

摘要： A manufacturing apparatus for an electronic component includes a plurality of press members contacting a housing of a connector, pressing a plurality of pins held by the housing toward a plurality of holes in a substrate, and provided with a pair of arm sections extending in one direction intersecting with a direction of the pressing, a drive unit pressing the press members and press-fitting the plurality of pins into the holes in the substrate, a stress measurement unit provided to the respective arm sections and adapted to measure a stress generated when the pins are pressed toward the holes in the substrate, and a drive control unit controlling a press force of the drive unit in accordance with a measurement result of the stress measurement unit.

摘要翻译： 一种用于电子部件的制造装置，包括与连接器的壳体接触的多个按压部件，将由壳体保持的多个销按压到基板的多个孔，并且设置有一对沿一个方向延伸的臂部 与按压方向相交的驱动单元，驱动单元，按压所述按压构件并将所述多个销压配合到所述基板的孔中;应力测量单元，设置在所述各个臂部，并且适于测量当所述销 被压向基板中的孔，驱动控制单元根据应力测量单元的测量结果控制驱动单元的按压力。

公开(公告)号：US20110001974A1

公开(公告)日：2011-01-06

申请号：US12882812

申请日：2010-09-15

申请人： Tohru Harada ,  Kazuhisa Mishima ,  Hirokazu Yamanishi

发明人： Tohru Harada ,  Kazuhisa Mishima ,  Hirokazu Yamanishi

IPC分类号： G01B11/00

CPC分类号： G03F1/00 ,  G03F9/7011 ,  G03F9/7076 ,  G03F9/7088 ,  H01L21/67092 ,  H01L21/681

摘要： An alignment apparatus for a planar member includes, an image capturing unit which captures an image of a rotationally asymmetrical alignment mark provided on the planar member, a position detection unit which detects a position of the alignment mark from the image, a position adjusting unit which adjusts, based on the detected position of the alignment mark, the position of the planar member relative to a reference position, and an orientation detection unit which detects an orientation of the planar member based on the rotational asymmetry of the alignment mark captured in the image.

摘要翻译： 一种用于平面构件的对准装置包括：捕获设置在平面构件上的旋转非对称对准标记的图像的图像捕获单元，检测来自图像的对准标记位置的位置检测单元，位置调整单元， 基于对准标记的检测位置调整平面构件相对于基准位置的位置;以及姿态检测单元，其基于在图像中捕获的对准标记的旋转不对称性来检测平面构件的取向 。