公开(公告)号：US09087850B2

公开(公告)日：2015-07-21

申请号：US13382332

申请日：2010-06-30

申请人： Atsushi Fujisawa ,  Hiroshi Fujii

发明人： Atsushi Fujisawa ,  Hiroshi Fujii

IPC分类号： H01L21/56 ,  B23K26/40 ,  H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00

CPC分类号： H01L21/268 ,  B23K2103/42 ,  B23K2103/50 ,  H01L21/4828 ,  H01L21/4842 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49558 ,  H01L23/49575 ,  H01L23/49579 ,  H01L23/49582 ,  H01L23/49586 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512

摘要： In QFN packages for vehicles which are required to have high reliability, the side surface of leads is mostly covered with lead-to-lead resin protrusions, which prevent smooth formation of solder fillets during reflow mounting. When the lead-to-lead protrusions are mechanically removed using a punching die, there is a high possibility of causing cracks of the main body of the package or terminal deformation. When a spacing is provided between the punching die and the main body of the package in order to avoid such damages, a resin residue is produced to hinder complete removal of this lead-to-lead resin protrusion. The present invention provides a method for manufacturing semiconductor device of a QFN type package using multiple leadframes having a dam bar for tying external end portions of a plurality of leads. This method includes a step of removing a sealing resin filled between the circumference of a mold cavity and the dam bar by using laser and then carrying out surface treatment, for example, solder plating.

摘要翻译： 在需要具有高可靠性的车辆的QFN封装中，引线的侧面大部分覆盖有铅 - 铅树脂突起，这防止在回流焊安装过程中焊接圆角的平滑形成。 当使用冲压模具机械地去除引线至引线突起时，可能导致封装主体或端子变形的裂纹。 当为了避免这样的损坏而在冲压模具和包装主体之间设置间隔时，产生树脂残留物以阻止该引出铅引线树脂突起的完全移除。 本发明提供一种使用多个引线框制造QFN型封装半导体器件的方法，所述引线框具有用于捆扎多个引线的外部端部的阻挡条。 该方法包括通过使用激光去除填充在模腔周边和坝条之间的密封树脂，然后进行表面处理，例如焊料镀覆的步骤。

公开(公告)号：US20120108013A1

公开(公告)日：2012-05-03

申请号：US13382332

申请日：2010-06-30

申请人： Atsushi Fujisawa ,  Hiroshi Fujii

发明人： Atsushi Fujisawa ,  Hiroshi Fujii

IPC分类号： H01L21/56

CPC分类号： H01L21/268 ,  B23K2103/42 ,  B23K2103/50 ,  H01L21/4828 ,  H01L21/4842 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49558 ,  H01L23/49575 ,  H01L23/49579 ,  H01L23/49582 ,  H01L23/49586 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512

摘要： In QFN packages for vehicles which are required to have high reliability, the side surface of leads is mostly covered with lead-to-lead resin protrusions, which prevent smooth formation of solder fillets during reflow mounting. When the lead-to-lead protrusions are mechanically removed using a punching die, there is a high possibility of causing cracks of the main body of the package or terminal deformation. When a spacing is provided between the punching die and the main body of the package in order to avoid such damages, a resin residue is produced to hinder complete removal of this lead-to-lead resin protrusion. The present invention provides a method for manufacturing semiconductor device of a QFN type package using multiple leadframes having a dam bar for tying external end portions of a plurality of leads. This method includes a step of removing a sealing resin filled between the circumference of a mold cavity and the dam bar by using laser and then carrying out surface treatment, for example, solder plating.

摘要翻译： 在需要具有高可靠性的车辆的QFN封装中，引线的侧面大部分覆盖有铅 - 铅树脂突起，这防止在回流焊安装过程中焊接圆角的平滑形成。 当使用冲压模具机械地去除引线至引线突起时，可能导致封装主体或端子变形的裂纹。 当为了避免这样的损坏而在冲压模具和包装主体之间设置间隔时，产生树脂残留物以阻止该引出铅引线树脂突起的完全移除。 本发明提供一种使用多个引线框制造QFN型封装半导体器件的方法，所述引线框具有用于捆扎多个引线的外部端部的阻挡条。 该方法包括通过使用激光去除填充在模腔周边和坝条之间的密封树脂，然后进行表面处理，例如焊料镀覆的步骤。

公开(公告)号：US09006871B2

公开(公告)日：2015-04-14

申请号：US13639509

申请日：2010-05-12

申请人： Atsushi Fujisawa

发明人： Atsushi Fujisawa

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L23/49568 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/49582 ,  H01L23/562 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/27013 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00012 ,  H01L2924/01014 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2224/45015 ,  H01L2924/207

摘要： A trench portion (trench) is formed at each of four corner portions of a chip bonding region having a quadrangular planar shape smaller than an outer-shape size of a die pad included in a semiconductor device. Each trench is formed along a direction of intersecting with a diagonal line which connects between the corner portions where the trench portions are arranged, and both ends of each trench portion are extended to an outside of the chip bonding region. The semiconductor chip is mounted on the chip bonding region so as to interpose a die-bond material. In this manner, peel-off of the die-bond material in a reflow step upon mounting of the semiconductor device on a mounting substrate can be suppressed. Also, even if the peel-off occurs, expansion of the peel-off can be suppressed.

摘要翻译： 在具有小于包含在半导体器件中的管芯焊盘的外形尺寸的四边形平面形状的芯片接合区域的四个角部的每一个处形成沟槽部分（沟槽）。 每个沟槽沿与沟槽部分的角部连接的对角线交叉的方向形成，并且每个沟槽部的两端延伸到芯片接合区域的外侧。 半导体芯片安装在芯片接合区域上，以便插入芯片接合材料。 以这种方式，可以抑制将半导体器件安装在安装基板上时的回流焊步骤中的芯片接合材料的剥离。 此外，即使发生剥离，也可以抑制剥离的膨胀。

公开(公告)号：US08193024B2

公开(公告)日：2012-06-05

申请号：US12647444

申请日：2009-12-26

申请人： Atsushi Fujisawa

发明人： Atsushi Fujisawa

IPC分类号： H01L21/00 ,  H01L21/44

CPC分类号： H01L21/561 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/05553 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83855 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The reliability of a photosensor-type semiconductor device is enhanced. The sealing step in a manufacturing process for the semiconductor device is carried out as described below. A molding die having an upper die and a lower die is prepared and a film is arranged between the upper die and the lower die. A lead frame in which first adhesive, a semiconductor chip, second adhesive 11, and a base material are mounted over the upper surface of each tab is arranged between the film and the lower die. The base material has an opening formed therein and the opening is covered with a protective sheet. The semiconductor chip has a light receiving area formed in its main surface. The upper die and the lower die are clamped to cause part of the base material to bite into the film. Thereafter, sealing resin is supplied to between the film and the lower die to form a blanket sealing body. Thus the photosensor-type semiconductor device without resin flash over the light receiving area is obtained.

摘要翻译： 光传感器型半导体器件的可靠性得到提高。 半导体器件的制造工序中的密封工序如下所述进行。 制备具有上模和下模的成型模具，并且在上模和下模之间布置膜。 在薄膜和下模之间配置有将第一粘合剂，半导体芯片，第二粘合剂11和基材安装在每个突片的上表面上的引线框架。 基材具有形成在其中的开口，并且开口被保护片覆盖。 半导体芯片在其主表面上形成有光接收区域。 上模和下模夹紧，使部分基材咬入薄膜。 此后，将密封树脂供应到薄膜和下模之间以形成橡皮布密封体。 因此，获得了没有树脂在光接收区域闪光的光电传感器型半导体器件。

公开(公告)号：US20100193923A1

公开(公告)日：2010-08-05

申请号：US12693984

申请日：2010-01-26

申请人： Shigeki Tanaka ,  Masakazu Sakano ,  Toshiyuki Shinya ,  Takafumi Konno ,  Kazuaki Yoshida ,  Takashi Sato ,  Atsushi Fujisawa

发明人： Shigeki Tanaka ,  Masakazu Sakano ,  Toshiyuki Shinya ,  Takafumi Konno ,  Kazuaki Yoshida ,  Takashi Sato ,  Atsushi Fujisawa

IPC分类号： H01L23/495 ,  H01L21/50 ,  H01L21/60

CPC分类号： H01L23/49575 ,  B81B7/007 ,  B81B2207/098 ,  B81C1/0023 ,  G01C19/56 ,  G01L19/141 ,  G01P1/023 ,  H01L21/565 ,  H01L23/3107 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85186 ,  H01L2224/85207 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： The reliability of a semiconductor device is prevented from being reduced. A planar shape of a sealing body is comprised of a quadrangle having a pair of first sides, and a pair of second sides crossing with the first sides. Further, it has a die pad, a controller chip (first semiconductor chip) and a sensor chip (second semiconductor chip) mounted over the die pad, and a plurality of leads arranged along the first sides of the sealing body. The controller chip and the leads are electrically coupled to each other via wires (first wires), and the sensor chip and the controller chip are electrically coupled to each other via wires (second wires). Herein, the die pad is supported by a plurality of suspending leads formed integrally with the die pad and extending from the die pad toward the first sides of the sealing body. Each of the suspending leads has an offset part.

摘要翻译： 防止半导体器件的可靠性降低。 密封体的平面形状由具有一对第一侧面的四边形和与第一面交叉的一对第二侧面构成。 此外，其具有安装在管芯焊盘上的管芯焊盘，控制器芯片（第一半导体芯片）和传感器芯片（第二半导体芯片）以及沿着密封体的第一侧布置的多个引线。 控制器芯片和引线通过导线（第一布线）彼此电耦合，并且传感器芯片和控制器芯片通过导线（第二布线）彼此电耦合。 这里，管芯焊盘由与焊盘一体形成的多个悬置引线支撑，并从焊盘朝向密封体的第一侧延伸。 每个悬挂引线都有一个偏移部分。

公开(公告)号：US5757955A

公开(公告)日：1998-05-26

申请号：US576960

申请日：1995-12-22

申请人： Atsushi Fujisawa ,  Akihiro Komori ,  Shigeki Furukawa

发明人： Atsushi Fujisawa ,  Akihiro Komori ,  Shigeki Furukawa

IPC分类号： H01R43/00 ,  G01N21/95 ,  G06T7/60

CPC分类号： G01N21/95

摘要： A color image pickup 33 picks up a color image of cores 9 soldered to the inner wall of a metal tube 12 of a connector 11 by a solder 16b. A component image of the color of the cores 9 is extracted from the color image. A non-soldered area of the cores 9 exposed from the solder 16b is calculated based on the extracted component image. The calculated non-soldered area is compared with a first threshold value to determine whether or not the cores 9 are satisfactorily soldered (i.e., the wires are satisfactorily connected). Connection of the wires can be checked with a uniform quality and an improved accuracy.

摘要翻译： 彩色图像拾取器33通过焊料16b拾取焊接到连接器11的金属管12的内壁的芯9的彩色图像。 从彩色图像中提取核心9的颜色的分量图像。 基于所提取的分量图像计算从焊料16b露出的芯9的非焊接区域。 将计算的非焊接区域与第一阈值进行比较，以确定核心9是否被令人满意地焊接（即，电线被令人满意地连接）。 可以以均匀的质量和精度提高电线的连接。

公开(公告)号：US5716206A

公开(公告)日：1998-02-10

申请号：US575348

申请日：1995-12-20

申请人： Atsushi Fujisawa ,  Akihiro Komori ,  Shigeki Furukawa

发明人： Atsushi Fujisawa ,  Akihiro Komori ,  Shigeki Furukawa

IPC分类号： G01N21/95 ,  H01R4/72 ,  H01R43/00 ,  F27B9/14

CPC分类号： G01N21/95 ,  H01R43/00 ,  H01R4/723

摘要： A heating apparatus 1 includes a plurality of closable heating units 10 arranged at specified intervals and each provided with a heater 14, a conveyor 20 for conveying the closable heating units 10 along a loop-shaped conveyance path including a setting station 31, an unloading station 32 and a cooling station 33, and a controller for controlling the heater 14 to heat a solder containing wire connector set in the heating unit at the setting station 31 until the heating unit sent out from the setting station 31 reaches the cooling station 33. The heating apparatus 1 thus constructed heats a wire connection, in particular a connector, such that the wire connection is secure and watertight, and has a good working efficiency.

摘要翻译： 加热装置1包括以规定间隔布置的多个可关闭加热单元10，每个设置有加热器14，用于沿着包括设置站31，卸载站 32和冷却站33，以及控制器，用于控制加热器14加热设置在加热单元中的设置在设置站31处的包含焊料的连接器的连接器，直到从设置站31发出的加热单元到达冷却站33。 如此构造的加热装置1加热电线连接，特别是连接器，使得电线连接是牢固和防水的，并且具有良好的工作效率。

公开(公告)号：US5432300A

公开(公告)日：1995-07-11

申请号：US106379

申请日：1993-08-13

申请人： Atsushi Fujisawa ,  Isao Akasaka ,  Hiroyuki Hamada

发明人： Atsushi Fujisawa ,  Isao Akasaka ,  Hiroyuki Hamada

IPC分类号： H01B7/17 ,  H01B11/06 ,  H01R4/70 ,  H01R13/658 ,  H05K9/00 ,  H02G15/02

CPC分类号： H01R13/6599 ,  H01R4/70

摘要： This invention aims to facilitate attaching and positional correction of a protecting member for an unshielded section on an end portion of a shielding electric cable 1 and to enhance flexibility of processes of working and wiring the cable 1 and flexibility of a wiring posture of the cable 1. A protecting construction for an end portion of a shielded electric cable 1 comprises: an unshielded section on the end portion of the cable; a flexible and insulative protecting tube 10 having a shielding layer 8 on the interior thereof, the protecting tube 10 being provided with a slit 7 along an axial direction so that the tube 10 can be opened and closed in a peripheral direction, the protecting tube 10 being mounted through the slit 7 on the unshielded section on the end portion of the cable 1; and a tape 11 wound around the protecting tube 10 to secure it (10) to the end portion of the cable 1. The slit protecting tube 10 forms a protecting member for the unshielded section.

摘要翻译： 本发明旨在便于在屏蔽电缆1的端部上用于非屏蔽部分的保护部件的安装和位置校正，并且提高电缆1的加工和布线工艺的灵活性以及电缆1的布线姿势的灵活性 屏蔽电缆1的端部的保护结构包括：电缆端部的非屏蔽部分; 在其内部具有屏蔽层8的柔性和绝缘保护管10，保护管10沿着轴向设置有狭缝7，使得管10能够沿周向打开和关闭，保护管10 通过狭缝7安装在电缆1的端部上的非屏蔽部分上; 以及缠绕在保护管10上的带11，以将其固定（10）到电缆1的端部。狭缝保护管10形成用于非屏蔽部分的保护部件。

公开(公告)号：US07579674B2

公开(公告)日：2009-08-25

申请号：US12027730

申请日：2008-02-07

申请人： Kenji Amano ,  Atsushi Fujisawa ,  Hajime Hasebe

发明人： Kenji Amano ,  Atsushi Fujisawa ,  Hajime Hasebe

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/49548 ,  H01L24/48 ,  H01L2224/32014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device with improved reliability is provided. The semiconductor device in a QFN package configuration has a semiconductor chip mounted on a tab, leads which are alternately arranged around the tab and electrically connected to the electrodes of the semiconductor chip via bonding wires, and an encapsulating resin portion for encapsulating therein the semiconductor chip and the bonding wires. The lower exposed surfaces of the leads are exposed at the outer peripheral portion of the back surface of the encapsulating resin portion to form external terminals. The lower exposed surfaces of the leads are exposed at the portion of the back surface of the encapsulating resin portion which is located inwardly of the lower exposed surface of the leads to also form external terminals. The cut surfaces of the leads are exposed at the cut surfaces of the encapsulating resin portion, while the upper exposed surfaces of the leads are exposed from the portion of the encapsulating resin portion which is proximate to the cut surfaces thereof. Each of the upper exposed surfaces of the leads has a width smaller than the width of each of the lower exposed surfaces thereof.

摘要翻译： 提供了具有可靠性提高的半导体器件。 QFN封装结构中的半导体器件具有安装在突片上的半导体芯片，引线交替地布置在突片周围并通过接合线电连接到半导体芯片的电极，并且封装树脂部分用于封装半导体芯片 和接合线。 引线的下暴露表面在封装树脂部分的后表面的外周部分露出以形成外部端子。 引线的下暴露表面暴露在封装树脂部分的背面的位于引线下暴露表面内部的部分处，并形成外部端子。 引线的切割表面在封装树脂部分的切割表面处露出，而引线的上暴露表面从密封树脂部分的接近其切割表面的部分露出。 引线的每个上暴露表面的宽度小于其下暴露表面的宽度。

公开(公告)号：US20050029640A1

公开(公告)日：2005-02-10

申请号：US10878226

申请日：2004-06-29

申请人： Kenji Amano ,  Atsushi Fujisawa ,  Hajime Hasebe

发明人： Kenji Amano ,  Atsushi Fujisawa ,  Hajime Hasebe

IPC分类号： H01L23/50 ,  H01L23/31 ,  H01L23/495 ,  H01L21/44 ,  H01L21/50 ,  H01L23/02

CPC分类号： H01L23/3107 ,  H01L23/49548 ,  H01L24/48 ,  H01L2224/32014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor chip is mounted on a tab, leads alternately arranged around the tab are electrically connected to electrodes of the semiconductor chip via bonding wires, and encapsulating resin encapsulates the semiconductor chip and bonding wires. The lower surfaces of the leads are exposed at the outer periphery of the back surface of the encapsulating resin to form external terminals. The lower surfaces of the leads are exposed at the back surface of the encapsulating resin located inwardly of the lower exposed surface of the leads to form external terminals. The cut surfaces of the leads are exposed at the cut surfaces of the encapsulating resin, while upper exposed surfaces of the leads are exposed from the encapsulating resin portion which is proximate to the cut surfaces thereof. Each of the upper exposed surfaces of the leads has a width smaller than the width of each of the lower exposed surfaces.

摘要翻译： 半导体芯片安装在突片上，交替布置在突片周围的引线通过接合线电连接到半导体芯片的电极，封装树脂封装半导体芯片和接合线。 引线的下表面在封装树脂的背面的外周露出，形成外部端子。 引线的下表面在位于引线的下暴露表面内侧的封装树脂的背面处露出，以形成外部端子。 引线的切割表面在封装树脂的切割表面处露出，而引线的上暴露表面从接近其切割表面的封装树脂部分露出。 引线的每个上暴露表面的宽度小于每个下暴露表面的宽度。