公开(公告)号：US5907271A

公开(公告)日：1999-05-25

申请号：US763365

申请日：1996-12-11

申请人： Atsushi Hirano ,  Shigeyuki Kuroda ,  Kenji Tanaka

发明人： Atsushi Hirano ,  Shigeyuki Kuroda ,  Kenji Tanaka

IPC分类号： H01C7/02 ,  H01C7/18 ,  H01C7/10

CPC分类号： H01C7/18 ,  H01C7/02 ,  H01C7/027 ,  Y10T29/49085

摘要： A positive characteristic thermistor device includes a device main body made of a semiconductor ceramic material which reliably and cleanly delaminates upon the application of excessive voltage thereto. The main body has outer layers having lower porosity formed on both sides of an inner layer having higher porosity. The inner layer having higher porosity can be obtained by burning a ceramic material for positive characteristic thermistors including resin beads mixed therein. After forming the main body, an electrode is formed on the outer surface of each of the outer layers. When an overvoltage is applied to this positive characteristic thermistor device, delamination occurs in the inner layer having higher porosity to create an open-circuit in a circuit in which the thermistor device is connected.

摘要翻译： 正特性热敏电阻器件包括由半导体陶瓷材料制成的器件主体，其在施加过大电压时可靠且清洁地分层。 主体具有在具有较高孔隙率的内层的两侧形成的具有较低孔隙率的外层。 具有较高孔隙率的内层可以通过对包含混合在其中的树脂珠的正特性热敏电阻的陶瓷材料进行烧制来获得。 在形成主体之后，在每个外层的外表面上形成电极。 当对该正特性热敏电阻器件施加过电压时，在具有较高孔隙率的内层中发生分层，以在其中连接热敏电阻器件的电路中产生开路。

公开(公告)号：US5790011A

公开(公告)日：1998-08-04

申请号：US671736

申请日：1996-06-28

申请人： Atsushi Hirano ,  Shigeyuki Kuroda ,  Kenji Tanaka

发明人： Atsushi Hirano ,  Shigeyuki Kuroda ,  Kenji Tanaka

IPC分类号： H01C7/02 ,  H01C7/10 ,  H01C7/13

CPC分类号： H01C7/02

摘要： There is provided a positive characteristics thermistor device having excellent thermal breakdown characteristics. According to the present invention, a positive characteristics thermistor device has a positive characteristics thermistor element 1 and electrodes 2 and 3 formed on principal surfaces of the positive characteristics thermistor element 1. The positive characteristics thermistor element 1 includes an inner region 4 and outer regions 5 and 6 and a porosity occupying rate of the outer regions 5 and 6 is set higher than that of the inner region 4.

摘要翻译： 提供了具有优异的热击穿特性的正特性热敏电阻器件。 根据本发明，正特性热敏电阻器件具有正特性热敏电阻元件1和形成在正特性热敏电阻元件1的主表面上的电极2和3.正特性热敏电阻元件1包括内部区域4和外部区域5 并且外部区域5和6的孔隙率占据率被设定为高于内部区域4的孔隙率占据率。

公开(公告)号：US20060046040A1

公开(公告)日：2006-03-02

申请号：US11240388

申请日：2005-10-03

申请人： Hirokazu Kameda ,  Shuya Nakao ,  Shigeyuki Kuroda ,  Masaru Kojima ,  Kenji Tanaka

发明人： Hirokazu Kameda ,  Shuya Nakao ,  Shigeyuki Kuroda ,  Masaru Kojima ,  Kenji Tanaka

IPC分类号： B32B7/02

CPC分类号： B32B18/00 ,  B32B2315/08 ,  C04B35/111 ,  C04B35/6263 ,  C04B35/63 ,  C04B35/632 ,  C04B35/63456 ,  C04B35/6346 ,  C04B35/63488 ,  C04B35/653 ,  C04B37/042 ,  C04B2235/5445 ,  C04B2235/656 ,  C04B2235/6567 ,  C04B2235/9615 ,  C04B2237/30 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/345 ,  C04B2237/36 ,  C04B2237/365 ,  C04B2237/52 ,  C04B2237/525 ,  C04B2237/64 ,  C04B2237/68 ,  C04B2237/704 ,  H01L21/481 ,  H01L21/4857 ,  H01L23/15 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2201/0195 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/249953 ,  Y10T428/249994 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/2848 ,  Y10T428/31504 ,  H01L2924/00

摘要： A composite laminate includes first sheet layers and second sheet layers. The first sheet layers include a first particulate aggregate and the second sheet layers include a second particulate aggregate. Each of internal second sheet layers is disposed between two first sheet layers and two external second sheet layers constitute two main faces of the composite laminate. The thickness of the internal second sheet layers is greater than the thickness of the external second sheet layers. The first sheet layers and the second sheet layers are bonded to each other by penetration of a part of the first particulate aggregate contained in the first sheet layers into the second sheet layers. This configuration can reduce the transverse shrinkage in the firing step of the composite laminate.

公开(公告)号：US06579392B1

公开(公告)日：2003-06-17

申请号：US09698394

申请日：2000-10-27

申请人： Hirokazu Kameda ,  Shuya Nakao ,  Shigeyuki Kuroda ,  Masaru Kojima ,  Kenji Tanaka

发明人： Hirokazu Kameda ,  Shuya Nakao ,  Shigeyuki Kuroda ,  Masaru Kojima ,  Kenji Tanaka

IPC分类号： B32B3126

CPC分类号： B32B18/00 ,  B32B2315/08 ,  C04B35/111 ,  C04B35/6263 ,  C04B35/63 ,  C04B35/632 ,  C04B35/63456 ,  C04B35/6346 ,  C04B35/63488 ,  C04B35/653 ,  C04B37/042 ,  C04B2235/5445 ,  C04B2235/656 ,  C04B2235/6567 ,  C04B2235/9615 ,  C04B2237/30 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/345 ,  C04B2237/36 ,  C04B2237/365 ,  C04B2237/52 ,  C04B2237/525 ,  C04B2237/64 ,  C04B2237/68 ,  C04B2237/704 ,  H01L21/481 ,  H01L21/4857 ,  H01L23/15 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2201/0195 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/249953 ,  Y10T428/249994 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/2848 ,  Y10T428/31504 ,  H01L2924/00

摘要： A composite laminate includes first sheet layers and second sheet layers. The first sheet layers include a first particulate aggregate and the second sheet layers include a second particulate aggregate. Each of internal second sheet layers is disposed between two first sheet layers and two external second sheet layers constitute two main faces of the composite laminate. The thickness of the internal second sheet layers is greater than the thickness of the external second sheet layers. The first sheet layers and the second sheet layers are bonded to each other by penetration of a part of the first particulate aggregate contained in the first sheet layers into the second sheet layers. This configuration can reduce the transverse shrinkage in the firing step of the composite laminate.

摘要翻译： 复合层压板包括第一片层和第二片层。 第一片层包括第一颗粒聚集体，第二片层包括第二颗粒聚集体。 每个内部第二片层设置在两个第一片层之间，两个外部第二片层构成复合层压体的两个主面。 内部第二片层的厚度大于外部第二片层的厚度。 第一片层和第二片层通过将包含在第一片层中的第一颗粒聚集体的一部分穿入第二片层而彼此接合。 这种构造可以减少复合层叠体的烧成工序的横向收缩。

公开(公告)号：US06984441B2

公开(公告)日：2006-01-10

申请号：US10192594

申请日：2002-07-11

申请人： Hirokazu Kameda ,  Shuya Nakao ,  Shigeyuki Kuroda ,  Masaru Kojima ,  Kenji Tanaka

发明人： Hirokazu Kameda ,  Shuya Nakao ,  Shigeyuki Kuroda ,  Masaru Kojima ,  Kenji Tanaka

IPC分类号： B32B7/02 ,  B32B3/26 ,  B32B5/16 ,  B32B18/00 ,  B32B9/04

CPC分类号： B32B18/00 ,  B32B2315/08 ,  C04B35/111 ,  C04B35/6263 ,  C04B35/63 ,  C04B35/632 ,  C04B35/63456 ,  C04B35/6346 ,  C04B35/63488 ,  C04B35/653 ,  C04B37/042 ,  C04B2235/5445 ,  C04B2235/656 ,  C04B2235/6567 ,  C04B2235/9615 ,  C04B2237/30 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/345 ,  C04B2237/36 ,  C04B2237/365 ,  C04B2237/52 ,  C04B2237/525 ,  C04B2237/64 ,  C04B2237/68 ,  C04B2237/704 ,  H01L21/481 ,  H01L21/4857 ,  H01L23/15 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2201/0195 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/249953 ,  Y10T428/249994 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/2848 ,  Y10T428/31504 ,  H01L2924/00

摘要： A composite laminate includes first sheet layers and second sheet layers. The first sheet layers include a first particulate aggregate and the second sheet layers include a second particulate aggregate. Each of internal second sheet layers is disposed between two first sheet layers and two external second sheet layers constitute two main faces of the composite laminate. The thickness of the internal second sheet layers is greater than the thickness of the external second sheet layers. The first sheet layers and the second sheet layers are bonded to each other by penetration of a part of the first particulate aggregate contained in the first sheet layers into the second sheet layers. This configuration can reduce the transverse shrinkage in the firing step of the composite laminate.

公开(公告)号：US06306511B1

公开(公告)日：2001-10-23

申请号：US09620856

申请日：2000-07-21

申请人： Shuya Nakao ,  Hirokazu Kameda ,  Shigeyuki Kuroda ,  Kenji Tanaka ,  Masaru Kojima

发明人： Shuya Nakao ,  Hirokazu Kameda ,  Shigeyuki Kuroda ,  Kenji Tanaka ,  Masaru Kojima

IPC分类号： B32B1706

CPC分类号： B32B5/30 ,  B32B5/16 ,  B32B2307/20 ,  B32B2315/02 ,  B32B2315/08 ,  B32B2457/08 ,  H01F41/043 ,  H01F2017/0026 ,  H01G4/40 ,  H01L21/4857 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H03H7/0115 ,  H03H2001/0085 ,  H05K1/0306 ,  H05K1/162 ,  H05K1/165 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2201/086 ,  H01L2924/00

摘要： There is disclosed a hybrid laminate comprising: a substrate layer containing a compact of first powder; and a functional material layer being in contact with the substrate layer and containing a compact of second powder; wherein the compact of the first powder comprises a glass material; the compact of the second powder comprises a ceramic material having at least one specific electric property selected from dielectricity, magnetism, resistivity and insulation; at least a part of the first powder is in a sintered state; and the second powder is in an unsintered state and is bonded together by diffusion or a flow of a part of the material of the substrate layer into the functional material layer.

摘要翻译： 公开了一种混合层叠体，其包含：含有第一粉末的压块的基材层; 以及功能性材料层，其与所述基材层接触并含有第二粉末的压块; 其中所述第一粉末的压块包括玻璃材料; 第二粉末的压块包括具有选自介电性，磁性，电阻率和绝缘性中的至少一种比电性的陶瓷材料; 第一粉末的至少一部分处于烧结状态; 并且第二粉末处于未烧结状态，并且通过基底层的材料的一部分的扩散或流动结合到功能材料层中。

公开(公告)号：US07589952B2

公开(公告)日：2009-09-15

申请号：US12109371

申请日：2008-04-25

申请人： Akihiro Motoki ,  Kenichi Kawasaki ,  Makoto Ogawa ,  Shigeyuki Kuroda ,  Tatsuo Kunishi

发明人： Akihiro Motoki ,  Kenichi Kawasaki ,  Makoto Ogawa ,  Shigeyuki Kuroda ,  Tatsuo Kunishi

IPC分类号： H01G4/228

CPC分类号： H01G4/2325 ,  H01G4/30 ,  Y10T29/435

摘要： A multilayer electronic device includes a laminate and an external electrode that is formed on an end surface of the laminate after a plurality of conductive particles having a particle diameter of about 1 μm or more is adhered to the end surface of the laminate, for example, by a sandblast method or a brush polishing method. The external electrode is defined by a plating film that is formed by electroplating or electroless plating.

摘要翻译： 例如，多层电子器件包括层压体和形成在层叠体的端面上的外部电极，该多个电子器件在层叠体的端面附着有多个粒径为1μm以上的导电粒子之后， 通过喷砂法或刷子抛光法。 外部电极由通过电镀或无电镀形成的电镀膜限定。

公开(公告)号：US08154849B2

公开(公告)日：2012-04-10

申请号：US12030282

申请日：2008-02-13

申请人： Tatsuo Kunishi ,  Yoshihiko Takano ,  Shigeyuki Kuroda ,  Akihiro Motoki ,  Hideyuki Kashio ,  Takashi Noji

发明人： Tatsuo Kunishi ,  Yoshihiko Takano ,  Shigeyuki Kuroda ,  Akihiro Motoki ,  Hideyuki Kashio ,  Takashi Noji

IPC分类号： H01G4/228

CPC分类号： C25D3/12 ,  C25D5/02 ,  C25D7/00 ,  C25D21/10 ,  H01G4/2325 ,  H01G4/30 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49163 ,  Y10T29/49204

摘要： A laminate is prepared in which adjacent internal electrodes are electrically insulated from each other at an end surface at which the internal electrodes are exposed, a space between the adjacent internal electrodes, which is measured in the thickness direction of insulating layers, is about 10 μm or less, and a withdrawn distance of the adjacent internal electrodes from the end surface is about 1 μm or less. In an electroplating step, electroplating deposits deposited on the ends of the adjacent internal electrodes are grown so as to be connected to each other.

摘要翻译： 制备层叠体，其中相邻的内部电极在内部电极暴露的端面处彼此电绝缘，在绝缘层的厚度方向上测量的相邻内部电极之间的空间为约10μm 相邻的内部电极与端面的退出距离为1μm以下。 在电镀步骤中，沉积在相邻内部电极的端部上的电镀沉积物彼此连接。

公开(公告)号：US07719819B2

公开(公告)日：2010-05-18

申请号：US12043225

申请日：2008-03-06

申请人： Akihiro Motoki ,  Makoto Ogawa ,  Tatsuo Kunishi ,  Jun Nishikawa ,  Yoshihiko Takano ,  Shigeyuki Kuroda

发明人： Akihiro Motoki ,  Makoto Ogawa ,  Tatsuo Kunishi ,  Jun Nishikawa ,  Yoshihiko Takano ,  Shigeyuki Kuroda

IPC分类号： H01G4/06 ,  H01G7/00

CPC分类号： H01G4/30 ,  H01G4/0085 ,  H01G4/012 ,  H01G4/232 ,  Y10T29/435

摘要： A method for manufacturing a laminated electronic component is performed such that a water-repellent agent is applied to end surfaces at which ends of internal electrodes are exposed so as to be filled in spaces along interfaces between insulating layers and the internal electrodes. Subsequently, an abrading step is performed such that the internal electrodes are sufficiently exposed at the end surfaces and an excess water-repellent agent is removed therefrom to enable plating films to be directly formed on the end surfaces.

摘要翻译： 进行层叠电子部件的制造方法，使得将防水剂施加到内部电极的端部露出的端面，以在绝缘层和内部电极之间的界面填充空间。 接着，进行研磨工序，使内部电极在端面充分露出，从其中除去多余的防水剂，使得能够在端面上直接形成镀膜。

公开(公告)号：US08341815B2

公开(公告)日：2013-01-01

申请号：US12796688

申请日：2010-06-09

申请人： Tatsuo Kunishi ,  Yoshihiko Takano ,  Shigeyuki Kuroda ,  Akihiro Motoki ,  Hideyuki Kashio ,  Takashi Noji

发明人： Tatsuo Kunishi ,  Yoshihiko Takano ,  Shigeyuki Kuroda ,  Akihiro Motoki ,  Hideyuki Kashio ,  Takashi Noji

IPC分类号： H01G4/228

CPC分类号： C25D3/12 ,  C25D5/02 ,  C25D7/00 ,  C25D21/10 ,  H01G4/2325 ,  H01G4/30 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49163 ,  Y10T29/49204

摘要： A laminate is prepared in which adjacent internal electrodes are electrically insulated from each other at an end surface at which the internal electrodes are exposed, a space between the adjacent internal electrodes, which is measured in the thickness direction of insulating layers, is about 10 μm or less when a withdrawn distance of the adjacent internal electrodes from the end surface is about 1 μm or less, and is about 20 μm or less when a protruding length of the adjacent internal electrodes from the end surface is at least about 0.1 μm. In an electroplating step, electroplating deposits deposited on the ends of the adjacent internal electrodes are grown so as to be connected to each other.

摘要翻译： 制备层叠体，其中相邻的内部电极在内部电极暴露的端面处彼此电绝缘，在绝缘层的厚度方向上测量的相邻内部电极之间的空间为约10μm 当相邻的内部电极从端面的取出距离为约1μm以下时为约20μm以下，当从端面的相邻内部电极的突出长度为至少约0.1μm时，为约20μm以下。 在电镀步骤中，沉积在相邻内部电极的端部上的电镀沉积物彼此连接。